公开(公告)号：US09979268B2

公开(公告)日：2018-05-22

申请号：US15121329

申请日：2015-07-29

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Yuichiro Sadanaga

IPC: H02K29/08 ,  H02K7/08 ,  H02K11/21 ,  H02K1/27 ,  H02K1/14 ,  G01D5/14 ,  G01D11/24 ,  H02K11/215

CPC classification number: H02K29/08 ,  G01D5/145 ,  G01D11/245 ,  H02K1/14 ,  H02K1/27 ,  H02K7/083 ,  H02K11/21 ,  H02K11/215

Abstract: A motor of the present invention includes a stator in which a coil is wound around a stator core, and a magnetic circuit unit having a rotor. The rotor holds a rotor magnet disposed facing the stator core and a sensor magnet for position detection with a rotation shaft in the center. The motor further includes an electronic circuit unit having a circuit board on which circuit components including a magnetic detection element are mounted, and a partition disposed between the magnetic circuit unit and the electronic circuit unit for separating their spaces. The motor has an auxiliary sensor magnet disposed facing the sensor magnet with the partition and the magnetic detection element in between. The auxiliary sensor magnet is fixed and supported by a rotatable auxiliary shaft disposed independent from and coaxial with the rotation shaft.

公开(公告)号：US10418875B2

公开(公告)日：2019-09-17

申请号：US15325514

申请日：2015-07-29

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Yuichiro Sadanaga ,  Kenji Kondo ,  Takeshi Sakata ,  Masanori Morita

IPC: H02K5/08 ,  F16L59/02 ,  H02K5/04 ,  H02K11/00 ,  H02K11/33 ,  B29C69/02 ,  H05K7/20 ,  B29K81/00 ,  B29L31/00

Abstract: A thermal insulation structure for an electronic device of the present invention is a thermal insulation structure which thermally insulates between an electronic circuit unit and a heat generator formed with another component. In the thermal insulation structure, a partition wall for separating each space and formed of resin having electric insulation properties is provided between the electronic circuit unit and the heat generator. Also, the partition wall is formed by integrating the resin and a thermal insulation material having thermal conductivity lower than thermal conductivity of air so that the resin includes the thermal insulation material. Further, the partition wall is formed by insert-molding the thermal insulation material with the resin. Further, the resin having the electric insulation properties is thermoplastic resin, and a thermal insulation raw material of the thermal insulation material is silica xerogel.