公开(公告)号：US20060249231A1

公开(公告)日：2006-11-09

申请号：US11413840

申请日：2006-04-28

申请人： Patricia Bezerra ,  Michael Ott

发明人： Patricia Bezerra ,  Michael Ott

IPC分类号： C22C19/05 ,  C22C19/07

CPC分类号： F01D5/005 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/30 ,  B23K35/3033 ,  B23K35/3046 ,  C22C19/05 ,  C22C19/051 ,  C22C19/058 ,  C22C19/07 ,  F05D2230/237 ,  F05D2230/30 ,  Y02T50/67

摘要： Solders contain at least one agent for lowering the melting point, but these agents lead to a deterioration in the properties of the component to which the solder is applied. The solder according to the invention has a composition which is identical or similar to that of a solder according to the prior art, but in this case the elements which form a compound with the agent for lowering the melting point are at least partially added in powder form.

摘要翻译： 焊料含有至少一种用于降低熔点的试剂，但这些试剂导致施加焊料的组分的性能变差。 根据本发明的焊料具有与根据现有技术的焊料相同或相似的组成，但在这种情况下，与降低熔点的试剂形成化合物的元素至少部分地以粉末 形成。

公开(公告)号：US20050087584A1

公开(公告)日：2005-04-28

申请号：US10692403

申请日：2003-10-23

申请人： Zafir Abdo ,  Patricia Bezerra ,  Paul Zombo

发明人： Zafir Abdo ,  Patricia Bezerra ,  Paul Zombo

IPC分类号： B23K20/02 ,  B23K28/00 ,  B23K31/02

CPC分类号： B23K20/02 ,  B23K28/00

摘要： A joint (32) having bond line grains (28) that nucleate in the joint region (32) and grow into the adjoined solid substrates (12, 14). The resulting bond line grains have a size that is greater than a thickness (T) of a molten region (15). The surfaces of the substrates are cold worked to a desired degree of residual stress prior to the bonding process so that the recrystallization of the substrate surface necessary for the grains to grow into the substrates results in a reduction in the local free energy.

摘要翻译： 具有接合线晶粒（28）的接头（32），其在接合区域（32）中成核并生长成相邻的固体基板（12,14）。 所得的结合线粒子的尺寸大于熔融区域（15）的厚度（T）。 在接合过程之前，将基板的表面冷加工到所需的残余应力程度，使得晶粒生长到基板中所需的基板表面的再结晶导致局部自由能的降低。

公开(公告)号：US07165712B2

公开(公告)日：2007-01-23

申请号：US10692403

申请日：2003-10-23

申请人： Zafir Abdo ,  Patricia Bezerra ,  Paul J. Zombo

发明人： Zafir Abdo ,  Patricia Bezerra ,  Paul J. Zombo

IPC分类号： B23K1/20

CPC分类号： B23K20/02 ,  B23K28/00

摘要： A joint having bond line grains that nucleate in the joint region and grow into the adjoined solid substrates. The resulting bond line grains have a size that is greater than a thickness of a molten region. The surfaces of the substrates are cold worked to a desired degree of residual stress prior to the bonding process so that the recrystallization of the substrate surface necessary for the grains to grow into the substrates results in a reduction in the local free energy.

摘要翻译： 具有接合线粒子的接头，其在接合区域中成核并生长成相邻的固体基底。 所得的结合线粒子的尺寸大于熔融区域的厚度。 在接合过程之前，将基板的表面冷加工到所需的残余应力程度，使得晶粒生长到基板中所需的基板表面的再结晶导致局部自由能的降低。