公开(公告)号：US06803255B2

公开(公告)日：2004-10-12

申请号：US10209532

申请日：2002-07-31

申请人： Patrick A. Davis

发明人： Patrick A. Davis

IPC分类号： H01L2100

CPC分类号： H01L21/4842 ,  H01L23/49548 ,  H01L24/97 ,  H01L2924/12042 ,  H01L2924/00

摘要： A dual gauge lead frame 36 is provided, including at least one mating surface 14 and a plurality of terminal arms 16 formed into a flat circuit surface 12 having a first gauge 32. Each of the plurality of terminal arms 16 includes a fold over terminal arm portion 28 folded over and coined into a base terminal arm portion 26 to form a plurality of end posts 30. The plurality of end posts 30 form a second gauge 34.

摘要翻译： 提供双量规引线框架36，其包括至少一个配合表面14和形成为具有第一量规32的平坦电路表面12的多个端子臂16.多个端子臂16中的每一个包括端子臂上的折叠 部分28折叠并且形成基部端子臂部分26以形成多个端柱30.多个端柱30形成第二量规34。

公开(公告)号：US06476480B1

公开(公告)日：2002-11-05

申请号：US09612729

申请日：2000-07-10

申请人： Paul C. Staab ,  Pankaj Mithal ,  Patrick A. Davis ,  Stephen P. Barlow

发明人： Paul C. Staab ,  Pankaj Mithal ,  Patrick A. Davis ,  Stephen P. Barlow

IPC分类号： H01L2348

CPC分类号： H01L23/051 ,  H01L24/01 ,  H01L2924/01079 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/00

摘要： An IC power package particularly suitable for use as a rectifier for an automotive ac generator, as well as an IC packaging method. The power package comprises an electrically-conductive base, a MOSFET die mounted to the base so that the drain region of the MOSFET is electrically connected to the base, an electrically-conductive pin mounted to the die and electrically connected to the source region of the MOSFET, and an electrically-conductive member electrically connected to the gate region of the MOSFET. The conductive member can take several forms, including a second pin or a leadframe mounted to the die, or an annular-shaped member mounted to the base by an electrically-insulative member. In the latter embodiment, the annular-shaped member may be electrically connected to the gate region with a bond wire. The die is preferably encapsulated on the base, so that the base, pin and conductive member provide three connections for a rugged IC package.

摘要翻译： 特别适合用作汽车交流发电机的整流器的IC电源封装以及IC封装方法。 功率封装包括导电基极，安装到基极的MOSFET管芯，使得MOSFET的漏极区域电连接到基极，导电引脚安装到管芯并电连接到管脚的源极区域 MOSFET，以及与MOSFET的栅极区域电连接的导电部件。 导电构件可以采取几种形式，包括安装到模具的第二销或引线框架，或者由电绝缘构件安装到基座的环形构件。 在后一实施例中，环形构件可以用接合线电连接到栅极区域。 模具优选地封装在基座上，使得基座，销和导电构件为坚固的IC封装提供三个连接。