摘要:
Slots or apertures are formed in the connector shroud of a T/R module in a plane perpendicular to the axis of the connector so as to allow plating solution to flow freely through the entire inner portion of the connector, particularly the rear portion, during fabrication of the T/R module. The slots are formed prior to the shroud being brazed on to the module substrate. By allowing plating solution to flow through the connector, the interior of the connector can be more thoroughly plated, thereby improving the yield of the assembly while reducing cost.
摘要:
A method of fabricating a transmit/receive (T/R) module utilizing low temperature co-fired ceramic (LTCC) material in place of high temperature co-fired ceramic (HTCC) material and utilizing a combination of multiple lamination steps which also include forming a ceramic frame, as opposed to a metal ring frame, in the process. Brazing metallization is also utilized to attach heat sinks and lids as well as pin connectors. The formation of the pin connectors is provided on the side surface of the T/R module with a side printing process.