Fabrication of LTCC T/R modules with multiple cavities and an integrated ceramic ring frame
    4.
    发明授权
    Fabrication of LTCC T/R modules with multiple cavities and an integrated ceramic ring frame 有权
    具有多个腔体和集成陶瓷环框架的LTCC T / R模块的制造

    公开(公告)号:US07416630B2

    公开(公告)日:2008-08-26

    申请号:US10718805

    申请日:2003-11-24

    IPC分类号: B32B31/00

    摘要: A method of fabricating a transmit/receive (T/R) module utilizing low temperature co-fired ceramic (LTCC) material in place of high temperature co-fired ceramic (HTCC) material and utilizing a combination of multiple lamination steps which also include forming a ceramic frame, as opposed to a metal ring frame, in the process. Brazing metallization is also utilized to attach heat sinks and lids as well as pin connectors. The formation of the pin connectors is provided on the side surface of the T/R module with a side printing process.

    摘要翻译: 使用低温共烧陶瓷(LTCC)材料代替高温共烧陶瓷(HTCC)材料制造发射/接收(T / R)模块的方法,并利用多层压步骤的组合,其还包括形成 在该过程中,与金属环框架相对的陶瓷框架。 钎焊金属化也用于连接散热器和盖子以及针连接器。 在T / R模块的侧表面上设置针式连接器的侧面印刷工艺。