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1.发明授权Direct cooling pallet assembly for temperature stability for deep ion mill etch process 有权直接冷却托盘组件，用于深度离子磨蚀刻蚀工艺的温度稳定性公开(公告)号：US07481312B2
公开(公告)日：2009-01-27
申请号：US11001798
申请日：2004-12-02
申请人： Pei Chen , Jorge Goitia , Cherngye Hwang , Bigal Leung , Diana Perez , Yongjian Sun
发明人： Pei Chen , Jorge Goitia , Cherngye Hwang , Bigal Leung , Diana Perez , Yongjian Sun
IPC分类号： B65D85/00
CPC分类号： H01L21/67333 , H01L21/67109
摘要： Embodiments of the present invention are directed to a frame component of a pallet assembly. In one embodiment, the frame comprises a plurality of arms for retaining at least one carrier component. The frame further comprises at least one spring disposed upon one of the plurality of arms. The spring for applying pressure upon the carrier.
摘要翻译： 本发明的实施例涉及托盘组件的框架部件。 在一个实施例中，框架包括用于保持至少一个载体部件的多个臂。 框架还包括设置在多个臂之一上的至少一个弹簧。 用于在载体上施加压力的弹簧。
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2.发明授权Direct cooling pallet tray for temperature stability for deep ion mill etch process 有权直接冷却托盘托盘用于深度离子磨蚀刻蚀工艺的温度稳定性公开(公告)号：US07296420B2
公开(公告)日：2007-11-20
申请号：US11001795
申请日：2004-12-02
申请人： Pei Chen , Jorge Goitia , Cherngye Hwang , Bigal Leung , Diana Perez , Yongjian Sun
发明人： Pei Chen , Jorge Goitia , Cherngye Hwang , Bigal Leung , Diana Perez , Yongjian Sun
CPC分类号： H01L21/67109 , H01L21/67333
摘要： Embodiments of the present invention are directed to a pallet assembly which facilitates direct cooling of the wafer carrier. In one embodiment, the pallet assembly comprises a frame which holds at least one carrier of a component. The pallet assembly further comprises a tray which is operable for being mechanically coupled with the frame. The tray comprises at least one discreet region which corresponds with the carrier when the tray is coupled with the frame. In embodiments of the present invention, the discreet region comprises at least one hole extending through the tray for permitting a coolant medium to dissipate heat from the carrier.
摘要翻译： 本发明的实施例涉及一种有助于晶片载体的直接冷却的托盘组件。 在一个实施例中，托盘组件包括保持部件的至少一个托架的框架。 托盘组件还包括可操作以与框架机械联接的托盘。 当托盘与框架联接时，该托盘包括至少一个对应于托架的离散区域。 在本发明的实施例中，离散区域包括延伸穿过托盘的至少一个孔，用于允许冷却剂介质从载体中散发热量。
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公开(公告)号：US20060118447A1
公开(公告)日：2006-06-08
申请号：US11001798
申请日：2004-12-02
申请人： Pei Chen , Jorge Goitia , Cherngye Hwang , Bigal Leung , Diana Perez , Yongjian Sun
发明人： Pei Chen , Jorge Goitia , Cherngye Hwang , Bigal Leung , Diana Perez , Yongjian Sun
IPC分类号： B65D19/00
CPC分类号： H01L21/67333 , H01L21/67109
摘要： Embodiments of the present invention are directed to a frame component of a pallet assembly. In one embodiment, the frame comprises a plurality of arms for retaining at least one carrier component. The frame further comprises at least one spring disposed upon one of the plurality of arms. The spring for applying pressure upon the carrier.
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4.发明申请Direct cooling pallet tray for temperature stability for deep ion mill etch process 有权直接冷却托盘托盘用于深度离子磨蚀刻蚀工艺的温度稳定性公开(公告)号：US20060117762A1
公开(公告)日：2006-06-08
申请号：US11001795
申请日：2004-12-02
申请人： Pei Chen , Jorge Goitia , Cherngye Hwang , Bigal Leung , Diana Perez , Yongjian Sun
发明人： Pei Chen , Jorge Goitia , Cherngye Hwang , Bigal Leung , Diana Perez , Yongjian Sun
CPC分类号： H01L21/67109 , H01L21/67333
摘要： Embodiments of the present invention are directed to a pallet assembly which facilitates direct cooling of the wafer carrier. In one embodiment, the pallet assembly comprises a frame which holds at least one carrier of a component. The pallet assembly further comprises a tray which is operable for being mechanically coupled with the frame. The tray comprises at least one discreet region which corresponds with the carrier when the tray is coupled with the frame. In embodiments of the present invention, the discreet region comprises at least one hole extending through the tray for permitting a coolant medium to dissipate heat from the carrier.
摘要翻译： 本发明的实施例涉及一种有助于晶片载体的直接冷却的托盘组件。 在一个实施例中，托盘组件包括保持部件的至少一个托架的框架。 托盘组件还包括可操作以与框架机械联接的托盘。 当托盘与框架联接时，该托盘包括至少一个对应于托架的离散区域。 在本发明的实施例中，离散区域包括延伸穿过托盘的至少一个孔，用于允许冷却剂介质从载体中散发热量。
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公开(公告)号：US08220136B2
公开(公告)日：2012-07-17
申请号：US11800127
申请日：2007-05-03
CPC分类号： G11B5/4853 , G11B5/102 , G11B5/3163 , G11B5/3173 , Y10T29/49027 , Y10T29/49039 , Y10T29/49041 , Y10T29/49055 , Y10T29/53165 , Y10T156/10
摘要： A method for forming a planarized surface for at least one bar of sliders for utilization in a hard disk drive is disclosed. In general, at least one bar of sliders is placed on an adhesive layer. A single thermoplastic layer is then provided above the at least one bar of sliders. The single thermoplastic layer is then heated to a softening temperature such that the single thermoplastic layer will flow between the at least one bar of sliders. The single thermoplastic layer is then cooled to form a planarized surface of both said single thermoplastic layer and said at least one bar of sliders at said adhesive layer.
摘要翻译： 公开了一种用于形成至少一个用于硬盘驱动器的滑块的平面化表面的方法。 通常，将至少一个滑杆放置在粘合剂层上。 然后在至少一个滑杆上方设置单个热塑性层。 然后将单个热塑性层加热到软化温度，使得单个热塑性层将在至少一个滑块之间流动。 然后将单个热塑性层冷却以在所述粘合剂层处形成所述单一热塑性层和所述至少一个滑块条的平坦化表面。
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公开(公告)号：US20080273270A1
公开(公告)日：2008-11-06
申请号：US11800127
申请日：2007-05-03
CPC分类号： G11B5/4853 , G11B5/102 , G11B5/3163 , G11B5/3173 , Y10T29/49027 , Y10T29/49039 , Y10T29/49041 , Y10T29/49055 , Y10T29/53165 , Y10T156/10
摘要： A method for forming a planarized surface for at least one bar of sliders for utilization in a hard disk drive is disclosed. In general, at least one bar of sliders is placed on an adhesive layer. A single thermoplastic layer is then provided above the at least one bar of sliders. The single thermoplastic layer is then heated to a softening temperature such that the single thermoplastic layer will flow between the at least one bar of sliders. The single thermoplastic layer is then cooled to form a planarized surface of both said single thermoplastic layer and said at least one bar of sliders at said adhesive layer.
摘要翻译： 公开了一种用于形成至少一个用于硬盘驱动器的滑块的平面化表面的方法。 通常，将至少一个滑杆放置在粘合剂层上。 然后在至少一个滑杆上方设置单个热塑性层。 然后将单个热塑性层加热到软化温度，使得单个热塑性层将在至少一个滑块之间流动。 然后将单个热塑性层冷却以在所述粘合剂层处形成所述单一热塑性层和所述至少一个滑块条的平坦化表面。
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