公开(公告)号：US07470150B2

公开(公告)日：2008-12-30

申请号：US11641418

申请日：2006-12-19

申请人： Peter Kuo ,  Chin-Pao Kuo ,  Zhi-Yong Li

发明人： Peter Kuo ,  Chin-Pao Kuo ,  Zhi-Yong Li

IPC分类号： H01R9/03

CPC分类号： H01R9/032 ,  H01R4/02 ,  H01R13/6593

摘要： A cable connector assembly (100) used in high frequency signal transmission filed includes an insulative housing (2), a conductive terminals (3) retained in the housing, a number of wires (4) arrayed in a row and electrically connecting the terminals, and a conductive shell (5). The wires comprise at least one signal wire (40b) each comprising one or more conductive cores (401b) at the innermost thereof, and a grounding layer (403b) surrounding and shielding said core. The conductive shell comprises a base portion (510, 511, 520) shielding said housing and a soldering portion (521) integral with and behind said base portion. Each grounding layer abuts against and is soldered with said soldering portion of the shell, thereby simplifying grounding path.

摘要翻译： 在高频信号传输场所中使用的电缆连接器组件（100）包括绝缘壳体（2），保持在壳体中的导电端子（3），排列成一行并电连接端子的数个电线（4） 和导电壳（5）。 所述导线包括至少一个信号线（40b），每个信号线在其最内侧包括一个或多个导电芯（401b），以及围绕和屏蔽所述芯的接地层（403b）。 导电外壳包括屏蔽所述外壳的基座部分（510,511,520）和与所述基座部分整合在一起的焊接部分（521）。 每个接地层与壳体的所述焊接部分抵接并焊接，从而简化接地路径。

公开(公告)号：US20070141907A1

公开(公告)日：2007-06-21

申请号：US11641418

申请日：2006-12-19

申请人： Peter Kuo ,  Chin-Pao Kuo ,  Zhi-Yong Li

发明人： Peter Kuo ,  Chin-Pao Kuo ,  Zhi-Yong Li

IPC分类号： H01R13/648

CPC分类号： H01R9/032 ,  H01R4/02 ,  H01R13/6593

摘要： A cable connector assembly (100) used in high frequency signal transmission filed includes an insulative housing (2), a conductive terminals (3) retained in the housing, a number of wires (4) arrayed in a row and electrically connecting the terminals, and a conductive shell (5). The wires comprise at least one signal wire (40b) each comprising one or more conductive cores (401b) at the innermost thereof, and a grounding layer (403b) surrounding and shielding said core. The conductive shell comprises a base portion (510, 511, 520) shielding said housing and a soldering portion (521) integral with and behind said base portion. Each grounding layer abuts against and is soldered with said soldering portion of the shell, thereby simplifying grounding path.

摘要翻译： 在高频信号传输场所中使用的电缆连接器组件（100）包括绝缘壳体（2），保持在壳体中的导电端子（3），排列成一行并电连接端子的数个电线（4） 和导电壳（5）。 导线包括至少一个信号线（40b），每个信号线包括位于其最内侧的一个或多个导电芯（401b）和围绕并屏蔽所述芯的接地层（403b）。 导电外壳包括屏蔽所述外壳的基座部分（510,511,520）和与所述基座部分整合在一起的焊接部分（521）。 每个接地层与壳体的所述焊接部分抵接并焊接，从而简化接地路径。

公开(公告)号：US07510425B2

公开(公告)日：2009-03-31

申请号：US11900386

申请日：2007-09-11

申请人： Peter Kuo ,  Zhi-Yong Li

发明人： Peter Kuo ,  Zhi-Yong Li

IPC分类号： H01R12/24

CPC分类号： H05K3/3405 ,  H01R12/79 ,  H05K3/3421 ,  H05K2201/10356 ,  H05K2201/2027 ,  Y10S439/942

摘要： A cable assembly (100) according to the present invention includes a number of wires (4) each having an inner conductor (41) and an insulation layer (42) enclosing the conductor, a PCB (2) having opposite rear and front ends, an upper surface (21) and a number of conductive pads (23) formed with said upper surface, and at least one wire management board (3, 3′) each defining opposite top and bottom surfaces and having a base mounted on said upper surface of the PCB and a number of wire management slots (32, 32′) formed integrally with said base and extending toward said conductive pads of the PCB. The inner conductors are received in the corresponding wire management slots and physically and electrically connect with the corresponding conductive pads.

摘要翻译： 根据本发明的电缆组件（100）包括多个电线（4），每个电线具有内导体（41）和封闭导体的绝缘层（42），具有相对的后端和前端的PCB（2） 形成有所述上表面的上表面（21）和多个导电垫（23），以及至少一个线管理板（3,3'），每个线管理板限定相对的顶表面和底表面，并且具有安装在所述上表面 和与所述基座一体形成且朝向PCB的所述导电垫延伸的多个线管理槽（32,32'）。 内部导体被接收在相应的导线管理槽中，并与相应的导电焊盘物理和电连接。

公开(公告)号：US20080064254A1

公开(公告)日：2008-03-13

申请号：US11900386

申请日：2007-09-11

申请人： Peter Kuo ,  Zhi-Yong Li

发明人： Peter Kuo ,  Zhi-Yong Li

IPC分类号： H01R12/24

CPC分类号： H05K3/3405 ,  H01R12/79 ,  H05K3/3421 ,  H05K2201/10356 ,  H05K2201/2027 ,  Y10S439/942

摘要： A cable assembly (100) according to the present invention includes a number of wires (4) each having an inner conductor (41) and an insulation layer (42) enclosing the conductor, a PCB (2) having opposite rear and front ends, an upper surface (21) and a number of conductive pads (23) formed with said upper surface, and at least one wire management board (3, 3′) each defining opposite top and bottom surfaces and having a base mounted on said upper surface of the PCB and a number of wire management slots (32, 32′) formed integrally with said base and extending toward said conductive pads of the PCB. The inner conductors are received in the corresponding wire management slots and physically and electrically connect with the corresponding conductive pads.

摘要翻译： 根据本发明的电缆组件（100）包括多个电线（4），每个电线具有内导体（41）和封闭导体的绝缘层（42），具有相对的后端和前端的PCB（2） 形成有所述上表面的上表面（21）和多个导电垫（23），以及至少一个线管理板（3,3'），每个线管理板限定相对的顶表面和底表面，并且具有安装在所述上表面 和与所述基座一体形成且朝向PCB的所述导电垫延伸的多个线管理槽（32,32'）。 内部导体被接收在相应的导线管理槽中，并与相应的导电焊盘物理和电连接。

公开(公告)号：US08516694B2

公开(公告)日：2013-08-27

申请号：US13091152

申请日：2011-04-21

申请人： Xue-Jun Cai ,  Zhi-Yong Li

发明人： Xue-Jun Cai ,  Zhi-Yong Li

IPC分类号： H01K3/10

CPC分类号： H05K3/4697 ,  H05K2201/09127 ,  H05K2203/013 ,  H05K2203/308

摘要： A method for manufacturing printed circuit board includes steps below. An inner substrate including a first electrically conductive layer is provided. A first electrically conductive pattern is formed in the first electrically conductive layer. The first electrically conductive pattern includes an exposed region and an attaching region. A protective layer is formed on the entire exposed region. A first adhesive layer and a second electrically conductive layer are laminated on a surface of the first electrically conductive pattern in the attaching region and a surface of the protective layer. A slit along a boundary of the exposed region passing through the second electrically conductive pattern and the first adhesive layer is defined. The second electrically conductive layer corresponding to the exposed region, the first adhesive layer corresponding to the exposed region and the protective layer is removed.

摘要翻译： 制造印刷电路板的方法包括以下步骤。 提供了包括第一导电层的内基板。 在第一导电层中形成第一导电图案。 第一导电图案包括曝光区域和附着区域。 在整个曝光区域上形成保护层。 第一粘合剂层和第二导电层层叠在附着区域中的第一导电图案的表面和保护层的表面上。 限定通过第二导电图案和第一粘合剂层的暴露区域的边界的狭缝。 对应于暴露区域的第二导电层，对应于暴露区域的第一粘合剂层和保护层被去除。

公开(公告)号：US08978244B2

公开(公告)日：2015-03-17

申请号：US13116001

申请日：2011-05-26

申请人： Xue-Jun Cai ,  Zhi-Yong Li ,  Chao Liu

发明人： Xue-Jun Cai ,  Zhi-Yong Li ,  Chao Liu

IPC分类号： H05K3/20 ,  H05K3/46

CPC分类号： H05K3/4697 ,  H05K3/462 ,  H05K3/4647 ,  H05K2203/061 ,  H05K2203/0733 ,  Y10T29/49124 ,  Y10T29/49128 ,  Y10T29/49155

摘要： A method for manufacturing a printed circuit board with cavity includes following steps. First, a first substrate is provided. The first substrate includes a first electrically conductive layer defining an exposed portion and a laminating portion. Second, a second substrate is provided. The second substrate includes an unwanted portion corresponding to the exposed portion and a preserving portion. Third, a first annular bump surrounding the exposed portion is formed. Fourth, a second annular bump surrounding the unwanted portion is formed. Fifth, a first adhesive layer defining an opening is provided. Sixth, the first and second substrates are laminated to the first adhesive layer, the exposed portion and the unwanted portion are exposed in the opening, and the second annular bump is in contact with the first annular bump. Seventh, the unwanted portion is removed and a cavity is defined, the exposed portion is exposed in the cavity.

摘要翻译： 制造具有空腔的印刷电路板的方法包括以下步骤。 首先，提供第一基板。 第一衬底包括限定暴露部分的第一导电层和层压部分。 其次，设置第二基板。 第二基板包括对应于暴露部分的不期望部分和保留部分。 第三，形成围绕暴露部分的第一环形凸块。 第四，形成围绕不想要的部分的第二环形凸起。 第五，提供限定开口的第一粘合剂层。 第六，将第一和第二基板层叠到第一粘合剂层上，将暴露部分和不想要的部分暴露在开口中，并且第二环形凸块与第一环形凸起接触。 第七，去除不想要的部分并且限定空腔，暴露部分暴露在空腔中。