利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

9 条记录 (耗时 0.017 秒)

    Integrated circuit heat pipe heat spreader with through mounting holes
    2.
    发明授权
    Integrated circuit heat pipe heat spreader with through mounting holes 有权
    集成电路热管散热器，通过安装孔

    公开(公告)号：US07100679B2

    公开(公告)日：2006-09-05

    申请号：US10739709

    申请日：2003-12-18

    申请人： Peter M. Dussinger ,  Thomas L. Myers

    发明人： Peter M. Dussinger ,  Thomas L. Myers

    IPC分类号： F28D15/00

    CPC分类号： H01L23/427 ,  F28D15/0233 ,  F28D15/046 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A heat pipe with superior heat transfer between the heat pipe and the heat source and heat sink. The heat pipe is held tightly against the heat source by mounting holes which penetrate the structure of the heat pipe but are sealed off from the vapor chamber because they each are located within a sealed structure such as a pillar or the solid layers of the casing surrounding the vapor chamber. Another feature of the heat pipe is the use of more highly heat conductive material for only that part of the wick in the region which contacts the heat source, so that there is superior heat conductivity in that region.

    摘要翻译： 热管与热源和散热器之间具有优良传热的热管。 热管通过安装穿过热管结构的孔而紧密地保持在热源上，但是与蒸气室密封，因为它们各自位于密封结构中，例如立柱或外壳的固体层 蒸气室。 热管的另一个特征是使用更高导热性的材料仅用于接触热源的区域中的芯的那部分，从而在该区域具有优异的导热性。

    Integrated circuit heat pipe heat spreader with through mounting holes
    4.
    发明授权
    Integrated circuit heat pipe heat spreader with through mounting holes 有权
    集成电路热管散热器，通过安装孔

    公开(公告)号：US07028760B2

    公开(公告)日：2006-04-18

    申请号：US11069260

    申请日：2005-03-01

    申请人： Peter M. Dussinger ,  Thomas L. Myers ,  John H. Rosenfeld ,  Kenneth L. Minnerly

    发明人： Peter M. Dussinger ,  Thomas L. Myers ,  John H. Rosenfeld ,  Kenneth L. Minnerly

    IPC分类号： F28D15/00 ,  F28F7/00

    CPC分类号： H01L23/4006 ,  B22F3/11 ,  B22F2999/00 ,  F28D15/0233 ,  F28D15/046 ,  F28F2275/04 ,  H01L23/427 ,  H01L2924/0002 ,  B22F3/1035 ,  H01L2924/00

    摘要： A heat pipe with superior heat transfer between the heat pipe and the heat source and heat sink is provided. The heat pipe is held tightly against the heat source by mounting holes which penetrate the structure of the heat pipe but are sealed off from the vapor chamber because they each are located within a sealed structure such as a pillar or the solid layers of the casing surrounding the vapor chamber. Another feature of the heat pipe is the use of a plurality of particles joined together by a brazing compound such that fillets of the brazing compound are formed between adjacent ones of the plurality of particles so as to form a network of capillary passageways between the particles of the wick.

    摘要翻译： 提供了在热管和热源和散热器之间具有优异传热的热管。 热管通过安装穿过热管结构的孔而紧密地保持在热源上，但是与蒸气室密封，因为它们各自位于密封结构中，例如立柱或外壳的固体层 蒸气室。 热管的另一个特征是使用通过钎焊化合物连接在一起的多个颗粒，使得钎焊化合物的圆角形成在相邻的多个颗粒之间，以便形成在颗粒之间的毛细管通道网络 灯芯

    Integrated circuit heat pipe heat spreader with through mounting holes
    6.
    发明授权
    Integrated circuit heat pipe heat spreader with through mounting holes 有权
    集成电路热管散热器，通过安装孔

    公开(公告)号：US06302192B1

    公开(公告)日：2001-10-16

    申请号：US09310397

    申请日：1999-05-12

    申请人： Peter M. Dussinger ,  Thomas L. Myers

    发明人： Peter M. Dussinger ,  Thomas L. Myers

    IPC分类号： F28D1500

    CPC分类号： H01L23/427 ,  F28D15/0233 ,  F28D15/046 ,  H01L2924/0002 ,  H01L2924/00

    摘要： The apparatus is a heat pipe with superior heat transfer between the heat pipe and the heat source and heat sink. The heat pipe is held tightly against the heat source by mounting holes which penetrate the structure of the heat pipe but are sealed off from the vapor chamber because they each are located within a sealed structure such as a pillar or the solid layers of the casing surrounding the vapor chamber. Another feature of the heat pipe is the use of more highly heat conductive material for only that part of the wick in the region which contacts the heat source, so that there is superior heat conductivity in that region.

    摘要翻译： 该装置是在热管和热源和散热器之间具有优异传热的热管。 热管通过安装穿过热管结构的孔而紧密地保持在热源上，但是与蒸气室密封，因为它们各自位于密封结构中，例如立柱或外壳的固体层 蒸气室。 热管的另一个特征是使用更高导热性的材料仅用于接触热源的区域中的芯的那部分，从而在该区域具有优异的导热性。