利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

193 条记录 (耗时 0.029 秒)

    Thermal Fluid-Ejection Echanism Having Heating Resistor On Cavity Sidewalls
    1.
    发明申请
    Thermal Fluid-Ejection Echanism Having Heating Resistor On Cavity Sidewalls 有权
    在腔侧壁上具有加热电阻的热流体喷射机构

    公开(公告)号：US20130286104A1

    公开(公告)日：2013-10-31

    申请号：US13978571

    申请日：2011-01-31

    申请人： Peter Mardilovich ,  Lawrence H. White ,  Eric D. Torniainen

    发明人： Peter Mardilovich ,  Lawrence H. White ,  Eric D. Torniainen

    IPC分类号： B41J2/05

    CPC分类号： B41J2/05 ,  B41J2/1412 ,  B41J2/14129 ,  B41J2/1603 ,  B41J2/1626 ,  B41J2002/14387

    摘要： A thermal fluid-ejection mechanism includes a substrate having a top surface. A cavity formed within the substrate has one or more sidewalls and a floor. The angle of the sidewalls from the floor is greater than or equal to nominally ninety degrees. The thermal fluid-ejection mechanism includes a patterned conductive layer on one or more of the substrate's top surface and the cavity's sidewalls. The thermal fluid-ejection mechanism includes a patterned resistive layer on the sidewalls of the cavity. The patterned resistive layer is located over the patterned conductive layer where the patterned conductive layer is formed on the sidewalls of the cavity. The patterned resistive layer is formed as a heating resistor of the thermal-fluid ejection mechanism. The conductive layer is formed as a conductor of the thermal-fluid ejection mechanism, to permit electrical activation of the heating resistor to cause fluid to be ejected from the thermal fluid-ejection mechanism.

    摘要翻译： 热流体喷射机构包括具有顶表面的基板。 在衬底内形成的空腔具有一个或多个侧壁和底板。 来自地板的侧壁的角度大于或等于标称九十度。 热流体喷射机构包括在基板的顶表面和空腔的侧壁的一个或多个上的图案化导电层。 热流体喷射机构包括在腔的侧壁上的图案化电阻层。 图案化电阻层位于图案化导电层上方，其中图案化的导电层形成在空腔的侧壁上。 图案化电阻层形成为热流体喷射机构的加热电阻器。 导电层形成为热流体喷射机构的导体，以允许加热电阻器的电激活以使流体从热流体喷射机构喷出。

    RING-TYPE HEATING RESISTOR FOR THERMAL FLUID-EJECTION MECHANISM
    6.
    发明申请
    RING-TYPE HEATING RESISTOR FOR THERMAL FLUID-EJECTION MECHANISM 审中-公开
    用于热流体喷射机构的环式加热电阻器

    公开(公告)号：US20130321531A1

    公开(公告)日：2013-12-05

    申请号：US14000622

    申请日：2011-03-01

    申请人： Peter Mardilovich ,  Lawrence H. White ,  Erik D. Torniainen

    发明人： Peter Mardilovich ,  Lawrence H. White ,  Erik D. Torniainen

    IPC分类号： B41J2/14

    CPC分类号： B41J2/1412

    摘要： A ring-type heating resistor for a thermal fluid-ejection mechanism includes resistive segments and conductive segments. The resistive segments are rectangular in shape. The resistive segments are separated from one another. The conductive segments are interleaved in relation to the resistive segments such that each conductive segment electrically connects two of the resistive segments. The resistive segments and the conductive segments together form a pseudo-ring that approximates a true ring.

    摘要翻译： 用于热流体喷射机构的环形加热电阻器包括电阻段和导电段。 电阻段的形状为矩形。 电阻段彼此分离。 导电段相对于电阻段交错，使得每个导电段电连接两个电阻段。 电阻段和导电段一起形成近似真环的伪环。

    Thermal fluid-ejection echanism having heating resistor on cavity sidewalls
    7.
    发明授权
    Thermal fluid-ejection echanism having heating resistor on cavity sidewalls 有权
    热流体喷射机构在空腔侧壁上具有加热电阻

    公开(公告)号：US08939552B2

    公开(公告)日：2015-01-27

    申请号：US13978571

    申请日：2011-01-31

    申请人： Peter Mardilovich ,  Lawrence H. White ,  Erik D. Torniainen

    发明人： Peter Mardilovich ,  Lawrence H. White ,  Erik D. Torniainen

    IPC分类号： B41J2/05 ,  B41J2/14 ,  B41J2/16

    CPC分类号： B41J2/05 ,  B41J2/1412 ,  B41J2/14129 ,  B41J2/1603 ,  B41J2/1626 ,  B41J2002/14387

    摘要： A thermal fluid-ejection mechanism includes a substrate having a top surface. A cavity formed within the substrate has one or more sidewalls and a floor. The angle of the sidewalls from the floor is greater than or equal to nominally ninety degrees. The thermal fluid-ejection mechanism includes a patterned conductive layer on one or more of the substrate's top surface and the cavity's sidewalls. The thermal fluid-ejection mechanism includes a patterned resistive layer on the sidewalls of the cavity. The patterned resistive layer is located over the patterned conductive layer where the patterned conductive layer is formed on the sidewalls of the cavity. The patterned resistive layer is formed as a heating resistor of the thermal-fluid ejection mechanism. The conductive layer is formed as a conductor of the thermal-fluid ejection mechanism, to permit electrical activation of the heating resistor to cause fluid to be ejected from the thermal fluid-ejection mechanism.

    摘要翻译： 热流体喷射机构包括具有顶表面的基板。 在衬底内形成的空腔具有一个或多个侧壁和底板。 来自地板的侧壁的角度大于或等于标称九十度。 热流体喷射机构包括在基板的顶表面和空腔的侧壁的一个或多个上的图案化导电层。 热流体喷射机构包括在腔的侧壁上的图案化电阻层。 图案化电阻层位于图案化导电层上方，其中图案化的导电层形成在空腔的侧壁上。 图案化电阻层形成为热流体喷射机构的加热电阻器。 导电层形成为热流体喷射机构的导体，以允许加热电阻器的电激活以使流体从热流体喷射机构喷出。