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公开(公告)号：US20180311955A1
公开(公告)日：2018-11-01
申请号：US15959988
申请日：2018-04-23
发明人： Jung-Huei Peng , Chun-Ren Cheng , Jiou-Kang Lee , Shang-Ying Tsai , Ting-Hau Wu
CPC分类号： B41J2/14088 , B41J2/14016 , B41J2/16 , B41J2/1626 , B41J2/1639 , B41J2/1642 , B41J2/1646
摘要： MEMS devices and methods of fabrication thereof are described. In one embodiment, the MEMS device includes a bottom alloy layer disposed over a substrate. An inner material layer is disposed on the bottom alloy layer, and a top alloy layer is disposed on the inner material layer, the top and bottom alloy layers including an alloy of at least two metals, wherein the inner material layer includes the alloy and nitrogen. The top alloy layer, the inner material layer, and the bottom alloy layer form a MEMS feature.
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公开(公告)号：US20180215151A1
公开(公告)日：2018-08-02
申请号：US15748856
申请日：2015-10-15
CPC分类号： B41J2/14072 , B41J2/135 , B41J2/14088 , B41J2/1601 , B41J2/1623 , B41J2/175 , B41J2/315 , B41J2202/01
摘要： In example implementations, an apparatus with an interposer is provided. The apparatus may include an epoxy molded compound (EMC). A print head die and a drive integrated circuit (IC) may be embedded in the EMC. An interposer may also be embedded in the EMC. The print head die, the drive IC and the interposer may be wire bonded within the EMC.
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公开(公告)号：US20180141340A1
公开(公告)日：2018-05-24
申请号：US15806700
申请日：2017-11-08
发明人： Soji Kondo , Yukuo Yamaguchi , Toshiaki Hirosawa , Hiromasa Amma , Takuya Iwano , Noriyasu Nagai
IPC分类号： B41J2/16
CPC分类号： B41J2/1637 , B41J2/14088 , B41J2/14145 , B41J2/1603 , B41J2/1623 , B41J2202/12 , B41J2202/19 , B41J2202/21
摘要： A method of manufacturing a liquid supply unit includes a first molding step and a second molding step. In a first molding step, a resin is injected into different positions inside a mold assembly and a first member having a first contact portion, a second member having a second contact portion and an intermediate passage member having a passage structure to connect the first contact portion to the second contact portion are molded. In a second molding step, the mold assembly is disassembled, a die slide mold disposed inside the mold assembly is moved for positioning the members. Then, the mold assembly is clamped again and a resin is injected into the mold assembly. The first contact portion and the second contact portion are respectively held on the same surfaces inside the mold assembly during a period from the first molding step to completion of the second molding step.
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公开(公告)号：US09955731B2
公开(公告)日：2018-05-01
申请号：US14712172
申请日：2015-05-14
申请人： KIMREE HI-TECH INC.
发明人： Qiuming Liu
CPC分类号： A24F47/008 , A24F1/04 , A24F7/00 , A61L2209/135 , B41J2/14088 , H05B3/00 , H05B3/06 , H05B3/44 , H05B2203/022
摘要： An atomizer and an electronic cigarette are provided by the present application. The atomizer includes an atomizing sleeve, a cigarette liquid storage space disposed in the atomizing sleeve, an electrical heating element, and a liquid guiding pipe. The electrical heating element is of a hollow cylindrical shape, and an axis of the cylindrical electrical heating element is in parallel with or coincides with an axis of the atomizer. The electrical heating element is wrapped by the liquid guiding pipe, thus, due to the liquid guiding pipe, the cigarette liquid can be uniformly delivered to the electrical heating element, and the amount of smoke atomized by the electrical heating element is uniform and constant, which improves the user experience. Further, the cylindrical shape effectively increases the length of the electrical heating element and the contact area between the electrical heating element and the cigarette liquid.
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公开(公告)号：US09950525B2
公开(公告)日：2018-04-24
申请号：US15287379
申请日：2016-10-06
发明人： Ryoji Oohashi , Koichi Omata , Hideo Tamura , Takaaki Yamaguchi , Kousuke Kubo , Suguru Taniguchi , Yuji Tamaru , Toshio Negishi , Yohei Osuki
IPC分类号： B41J2/14
CPC分类号： B41J2/1433 , B41J2/14072 , B41J2/14088 , B41J2/14129 , B41J2/14201 , B41J2/1603 , B41J2/1631 , B41J2/1635 , B41J2/1642 , B41J2/1646 , B41J2002/14217
摘要： An element substrate for a liquid ejecting head includes a substrate, an element forming layer on the substrate, and a discharge port forming member formed of an insulating member on the element forming layer. The element forming layer includes an energy generating element configured to provide energy to a liquid for ejection. The discharge port forming member includes a discharge port forming surface having discharge ports through which the liquid is ejected and an exterior side surface positioned between the discharge port forming surface and the element forming layer. The exterior side surface has a first edge facing the element forming layer. The element substrate further includes a conductive layer disposed between the first edge and the element forming layer and grounded.
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公开(公告)号：US20180009223A1
公开(公告)日：2018-01-11
申请号：US15547322
申请日：2016-01-28
申请人： ETH Zurich
CPC分类号： B41J2/1433 , B41J2/06 , B41J2/14088 , B41J2002/14475
摘要： A print head (1) for depositing a liquid on a substrate comprises a layer structure including a stop layer (5) made of a dielectric material, an electrically conducting device layer (6), and an insulator layer (7) made of a dielectric material. A nozzle (3) is formed in the layer structure. The nozzle has a nozzle opening (34) for ejecting the liquid. A ring trench (31) is formed around the nozzle. The nozzle opening and the ring trench are radially separated by an annular nozzle wall (32). An ejection channel (37) is formed adjacent to the ring trench along the direction of ejection. An extraction electrode (8) is arranged on the insulator layer (7) and surrounds the nozzle.
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公开(公告)号：US20170368821A1
公开(公告)日：2017-12-28
申请号：US15617276
申请日：2017-06-08
发明人： Yasuo Fujii , Kazunari Fujii
IPC分类号： B41J2/14
CPC分类号： B41J2/14072 , B41J2/04501 , B41J2/04531 , B41J2/04541 , B41J2/0458 , B41J2/05 , B41J2/14088 , B41J2/14112 , B41J2/14129
摘要： A liquid discharge head substrate, comprising a discharging element configured to discharge a liquid, a driver configured to drive the discharging element, a conductive protection film covering the discharging element via an insulating film, and a controller connected to the protection film and configured to output a control signal that sets the driver in an inactive state when a change of a voltage of the protection film or a change in a current that flows to the protection film is detected.
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公开(公告)号：US20170341390A1
公开(公告)日：2017-11-30
申请号：US15602798
申请日：2017-05-23
CPC分类号： B41J2/14129 , B41J2/14 , B41J2/14016 , B41J2/14088 , B41J2/14145 , B41J2/1603 , B41J2/162 , B41J2/1623 , B41J2/1628 , B41J2/1629 , B41J2/1631 , B41J2/1632 , B41J2/1634 , B41J2/1642 , B41J2/1646 , B41J2002/14467
摘要： A liquid discharge head comprising a silicon substrate; an insulating layer A formed on a first surface of the silicon substrate, a protective layer A that includes metal oxide and is formed on the insulating layer A, the structure that is formed on the protective layer A by direct contact with the protective layer A, includes organic resin, and forms a part of a flow path for liquid, and an element that is formed on a second surface of the silicon substrate on a side opposite to the first surface, and is configured to generate energy used for discharging the liquid.
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公开(公告)号：US20170341382A1
公开(公告)日：2017-11-30
申请号：US15602671
申请日：2017-05-23
发明人： Ryo Kasai , Kengo Umeda , Takatsuna Aoki , Makoto Takagi
CPC分类号： B41J2/04563 , B41J2/04528 , B41J2/04541 , B41J2/0458 , B41J2/14072 , B41J2/14088
摘要： A print element substrate and a printing device which can suppress lowering of an image quality are provided. For that purpose, a heater, a sub-heater, and a driver are arranged in each heating area, and a plurality of the heating areas is arrayed on the print element substrate.
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公开(公告)号：US09751310B2
公开(公告)日：2017-09-05
申请号：US14585968
申请日：2014-12-30
CPC分类号： B41J2/1623 , B41J2/14024 , B41J2/14088 , B41J2/1433 , B41J2/1635 , B41J2/164 , B41J29/02 , Y10T29/49083 , Y10T29/49126 , Y10T29/49401 , Y10T29/53191
摘要： A method for manufacturing a liquid ejection head includes joining a support member to a print element substrate using another member to which the print element substrate is attached. The other member has a suction region to be held at the time of being attached to the support member.
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