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公开(公告)号:US4661201A
公开(公告)日:1987-04-28
申请号:US773923
申请日:1985-09-09
CPC分类号: C09K13/08 , C04B41/5338 , H01L41/332
摘要: A method for preferentially etching a piezoelectric material is disclosed wherein a portion of the piezoelectric material is controllably subjected to a concentrated thermal energy source with a force sufficient to alter the crystalline orientation of the piezoelectric material. The piezoelectric material is then treated with a suitable echant for a controlled duration, wherein the portion of the piezoelectric material altered by the concentrated thermal energy source is etched at a different etching rate than the unaltered piezoelectric material, to preferentially etch a controlled anaglyphic planar configuration upon the piezoelectric material.
摘要翻译: 公开了一种用于优先蚀刻压电材料的方法,其中压电材料的一部分可控制地经受集中的热能源,其具有足以改变压电材料的晶体取向的力。 然后用合适的吸附剂处理压电材料以控制持续时间,其中由浓缩热能源改变的压电材料的部分以与未改变的压电材料不同的蚀刻速率被蚀刻,以优先蚀刻受控的图形平面配置 在压电材料上。