公开(公告)号：US6016007A

公开(公告)日：2000-01-18

申请号：US206242

申请日：1998-10-16

申请人： Philip Albert Sanger ,  Frank A. Lindberg ,  Walter Garcen

发明人： Philip Albert Sanger ,  Frank A. Lindberg ,  Walter Garcen

IPC分类号： H01L23/473 ,  H01L23/34

CPC分类号： H01L23/473 ,  H01L2224/0603 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48139 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/49111 ,  H01L2224/49113 ,  H01L2224/49175 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/19105

摘要： A semiconductor cooling arrangement wherein a semiconductor is affixed to a thermally and electrically conducting carrier such as by brazing. The coefficient of thermal expansion of the semiconductor and carrier are closely matched to one another so that during operation they will not be overstressed mechanically due to thermal cycling. Electrical connection is made to the semiconductor and carrier, and a porous metal heat exchanger is thermally connected to the carrier. The heat exchanger is positioned within an electrically insulating cooling assembly having cooling oil flowing therethrough. The arrangement is particularly well adapted for the cooling of high power switching elements in a power bridge.

摘要翻译： 半导体冷却装置，其中半导体例如通过钎焊固定到导热和导电的载体上。 半导体和载体的热膨胀系数彼此紧密地匹配，使得在操作期间，由于热循环，它们不会被机械过度应力。 电连接到半导体和载体上，多孔金属热交换器与载体热连接。 热交换器位于具有流过其中的冷却油的电绝缘冷却组件内。 该装置特别适用于电力桥中的大功率开关元件的冷却。