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    Large scale integrated circuit test system
    1.
    发明授权
    Large scale integrated circuit test system 失效
    大规模集成电路测试系统

    公开(公告)号：US4760335A

    公开(公告)日：1988-07-26

    申请号：US760386

    申请日：1985-07-30

    申请人： Frank A. Lindberg

    发明人： Frank A. Lindberg

    IPC分类号： G01R1/04 ,  H05K7/10 ,  H01R13/62 ,  G01R31/26

    CPC分类号： H05K7/1023 ,  G01R1/0408 ,  H01R12/714

    摘要： A large scale integrated circuit package and test assembly wherein a chip is mounted on an insulating package substrate, and the package substrate is easily demountably connectable on a circuit test board. An alignment and electrical connector member bridges between the substrate conductors and the printed circuit board conductors. An elastomeric member is aligned over the alignment and electrical connector and compressed by a cover plate to make the electrical connection between the substrate and the printed circuit board. A plurality of such circuit package can be mounted upon a large area test board, and each of the individual circuit packages can be tested during system analysis.

    摘要翻译： 一种大规模集成电路封装和测试组件，其中芯片安装在绝缘封装衬底上，并且封装衬底容易可拆卸地连接在电路测试板上。 对准和电连接器构件在衬底导体和印刷电路板导体之间桥接。 弹性体构件对齐在对准和电连接器上并由盖板压缩以使得基板和印刷电路板之间的电连接。 可以在大面积测试板上安装多个这样的电路封装，并且可以在系统分析期间测试每个单独的电路封装。

    Method for manufacturing tape including lead frames
    2.
    发明授权
    Method for manufacturing tape including lead frames 失效
    用于制造包括引线框的胶带的方法

    公开(公告)号：US4308339A

    公开(公告)日：1981-12-29

    申请号：US119247

    申请日：1980-02-07

    申请人： Frank A. Lindberg

    发明人： Frank A. Lindberg

    IPC分类号： H01L21/48 ,  H01L21/60 ,  H01L21/66 ,  H01L23/495 ,  H01L23/50 ,  H01L23/58 ,  C23F1/02

    CPC分类号： H01L22/32 ,  H01L21/4828 ,  H01L21/4839 ,  H01L22/00 ,  H01L23/49572 ,  H01L24/50 ,  H01L2924/01322 ,  H01L2924/1306 ,  H01L2924/14 ,  H01L2924/3011

    摘要： A metallic lead frame strip, method of manufacturing same, a test tape, a method of testing together with the art work for same is disclosed. The method of manufacturing includes a method for producing art work that provides for accuracy in etching both sides of the lead frame strip simultaneously and permits a highly accurate positioning of the bonding bumps of at least one integral bonding bump for each lead and also discloses leads having a plurality of bonding bumps for connecting electrically common portions of a chip to be tested. Also, the use of registration aids are disclosed which allow lead bumps to be registered to chip pads even though the bumps cannot be seen in the alignment step. The testing of the chip also includes a method and double-layer test strip that may be used repeatedly for testing successively larger chips having an increasing number of individual leads.

    摘要翻译： 公开了一种金属引线框带，其制造方法，测试带，与本技术相结合的测试方法。 制造方法包括一种用于制造艺术作品的方法，其提供同时蚀刻引线框架条的两侧的精度，并且允许针对每个引线的至少一个整体焊接凸块的焊接凸块的高精度定位，并且还公开了具有 用于连接待测试芯片的电气公共部分的多个接合凸块。 此外，公开了使用配准辅助装置，即使在对准步骤中看不到凸块，也可以将引线凸块注册到芯片焊盘。 该芯片的测试还包括一种方法和双层测试条，可以重复使用以测试具有越来越多的单个引线的连续更大的芯片。

    Formation of openings in dielectric sheet
    3.
    发明授权
    Formation of openings in dielectric sheet 失效
    电介质片中开口的形成

    公开(公告)号：US4023999A

    公开(公告)日：1977-05-17

    申请号：US522959

    申请日：1974-11-11

    申请人： Frank A. Lindberg ,  Stephen G. Konsowski ,  Maurice B. Shamash ,  Seymour J. Ponemone

    发明人： Frank A. Lindberg ,  Stephen G. Konsowski ,  Maurice B. Shamash ,  Seymour J. Ponemone

    IPC分类号： H05K1/00 ,  H05K3/00 ,  H05K3/14 ,  H05K3/16 ,  H05K3/40 ,  H05K1/14

    CPC分类号： H05K3/16 ,  H05K3/002 ,  H05K3/146 ,  H05K3/4076 ,  H05K1/0393 ,  H05K2201/0154 ,  H05K2201/09509 ,  H05K2203/0554 ,  H05K2203/1184 ,  H05K3/4092

    摘要： There is disclosed a method for producing in thick (0.005 inches) polyimide films or sheets, openings, or windows across each of which an electrical conductor, such as copper or aluminum extends. The windows may be of substantial dimensions typically 0.05 inches by 0.1 inches. The conductor is of substantial thickness of about 0.0008 to 0.001 inches. The method is practiced with a sheet in which holes have been preformed. The sheet is coated with the conductor on both surfaces by being rotated in a stream of vapor of the conductor produced by impinging an electron beam (typically at 10 KV and 300 milliamperes) on a block of the conducting material. As the sheet is rotated in the stream of vapor, the walls of the holes as well as the surface of the sheet are coated with a conductor. Photoresist is then deposited on both coated surfaces of the sheet and in the holes and is exposed under masks and developed so as to expose the conducting coating on each surface in the areas of the windows. The exposed coating is then removed with an acid etchant while the remainder of the surfaces including the coating on the walls of the holes remain protected by the developed photoresist. The polyimide in the areas of the windows is thus exposed. The exposed polyimide is then removed by hydrazine leaving windows in each surface with conductors extending across the windows on the respective opposite surfaces.

    摘要翻译： 公开了一种用于生产厚（0.005英寸）聚酰亚胺膜或片，开口或窗口的方法，其中每个电导体如铜或铝延伸。 窗口可以具有通常为0.05英寸×0.1英寸的实质尺寸。 导体的厚度约为0.0008至0.001英寸。 该方法用已经进行了孔的片材实施。 通过在导电材料的块上撞击电子束（通常为10KV和300毫安）而产生的导体的蒸汽流中旋转，在两个表面上涂覆导体。 当片材在蒸汽流中旋转时，孔的壁以及片材的表面涂覆有导体。 然后将光致抗蚀剂沉积在片材的两个涂覆表面和孔中，并在掩模下暴露并显影，以暴露窗户区域中每个表面上的导电涂层。 然后用酸蚀刻剂除去暴露的涂层，而包括在孔壁上的涂层的其余表面保持被显影的光致抗蚀剂保护。 因此，在窗户的区域中的聚酰亚胺被暴露。 然后通过肼除去暴露的聚酰亚胺，在每个表面中留下窗口，导体延伸穿过相应相对表面上的窗口。

    Formation of openings in dielectric sheet
    4.
    发明授权
    Formation of openings in dielectric sheet 失效
    电介质片中开口的形成

    公开(公告)号：US3971661A

    公开(公告)日：1976-07-27

    申请号：US523946

    申请日：1974-11-14

    申请人： Frank A. Lindberg ,  Stephen G. Konsowski ,  Maurice B. Shamash ,  Seymour J. Ponemone

    发明人： Frank A. Lindberg ,  Stephen G. Konsowski ,  Maurice B. Shamash ,  Seymour J. Ponemone

    IPC分类号： H01L21/48 ,  H01L23/538 ,  H05K1/00 ,  H05K3/00 ,  H05K3/14 ,  H05K3/16 ,  H05K3/40 ,  H01L21/84

    CPC分类号： H05K3/002 ,  H01L21/486 ,  H01L23/5384 ,  H05K3/146 ,  H05K3/16 ,  H05K3/4076 ,  H01L2924/0002 ,  H05K1/0393 ,  H05K2201/0154 ,  H05K2201/09509 ,  H05K2203/0554 ,  H05K2203/1184 ,  H05K3/4092 ,  Y10T29/49993

    摘要： There is disclosed a method for producing in thick (0.005 inches) polyimide films or sheets, openings, or windows across each of which an electrical conductor, such as copper or aluminum extends. The windows may be of substantial dimensions typically 0.05 inches by 0.1 inches. The conductor is of substantial thickness of about 0.0008 to 0.001 inches. The sheet is coated with the conductor on both surfaces by being rotated in a stream of vapor of the conductor produced by impinging an electron beam (typically at 10 KV and 300 milliamperes) on a block of the conducting material. Photoresist is then deposited on both coated surfaces of the sheet and exposed under masks and developed so as to expose the conducting coating on each surface in the areas of the windows. The exposed coating is then removed with an acid etchant while the remainder of the surfaces remain protected by the developed photoresist. The polyimide in the areas of the windows is thus exposed. The exposed polyimide is then removed by hydrazine leaving windows in each surface with conductors extending across the windows on the respective opposite surfaces.

    摘要翻译： 公开了一种用于生产厚（0.005英寸）聚酰亚胺膜或片，开口或窗口的方法，其中每个电导体如铜或铝延伸。 窗口可以具有通常为0.05英寸×0.1英寸的实质尺寸。 导体的厚度约为0.0008至0.001英寸。 通过在导电材料的块上撞击电子束（通常为10KV和300毫安）而产生的导体的蒸汽流中旋转，在两个表面上涂覆导体。 然后将光致抗蚀剂沉积在片材的两个涂覆表面上，并在掩模下暴露并显影，以暴露窗户区域中每个表面上的导电涂层。 然后用酸蚀刻剂除去暴露的涂层，而剩余的表面保持被显影的光致抗蚀剂保护。 因此，在窗户的区域中的聚酰亚胺被暴露。 然后通过肼除去暴露的聚酰亚胺，在每个表面中留下窗口，导体延伸穿过相应相对表面上的窗口。

    Low-inductance capacitor and a method for minimizing inductance in a snubber circuit
    8.
    发明授权
    Low-inductance capacitor and a method for minimizing inductance in a snubber circuit 有权
    低电感电容器和用于最小化缓冲电路中的电感的方法

    公开(公告)号：US06498713B2

    公开(公告)日：2002-12-24

    申请号：US09809907

    申请日：2001-03-16

    申请人： Phillip A. Sanger ,  Lyon Mandelcorn ,  Leban E. Lesster ,  Frank A. Lindberg

    发明人： Phillip A. Sanger ,  Lyon Mandelcorn ,  Leban E. Lesster ,  Frank A. Lindberg

    IPC分类号： H01G4005

    CPC分类号： H01G4/232 ,  H02M1/34 ,  H02M2001/346 ,  H03K17/0814 ,  H03K17/16 ,  Y02B70/1491

    摘要： A low-voltage, low-inductance device for storing electrical charge in a snubber circuit and a method of minimizing inductance in the snubber circuit using the device, wherein the device includes a plurality of extended electrodes, in parallel or series, that are joined to a positive conductor terminal at one end spray and at a negative conductor terminal at the other end spray so that end sprays of adjacent extended electrodes are alternately joined to the positive and negative conductor terminals. Accordingly, current flowing though adjacent extended electrodes is of substantially equal intensity but different in direction. As a result, inductance produced effectively cancels out that of adjacent extended electrodes.

    摘要翻译： 一种用于在缓冲电路中存储电荷的低电压，低电感装置和使用该装置使缓冲电路中的电感最小化的方法，其中该装置包括并联或串联的多个延伸电极， 一端的正导体端子喷射，另一端的负导体端子喷射，使得相邻的延伸电极的末端喷射交替地接合到正极和负极导体端子。 因此，流过相邻的延伸电极的电流具有基本相等的强度，但在方向上不同。 结果，产生的电感有效抵消了相邻的延伸电极的电感。

    Electric induction motor and related method of cooling
    9.
    发明授权
    Electric induction motor and related method of cooling 失效
    电动感应电动机及相关冷却方式

    公开(公告)号：US5519269A

    公开(公告)日：1996-05-21

    申请号：US442708

    申请日：1995-05-18

    申请人： Frank A. Lindberg

    发明人： Frank A. Lindberg

    IPC分类号： H02K9/19 ,  H02K9/197 ,  H02K9/193

    CPC分类号： H02K9/19 ,  H02K9/197 ,  Y02T10/641

    摘要： An electric vehicle motor and related method of cooling wherein coolant is provided to a coolant inlet of the motor housing, directed through a plurality of radial slots of a stator core that is encased within the housing, and exited from a coolant outlet of the motor housing. The radial slots house the stator conductor wires such that the coolant is forced to come in contact with all of the external surface of all of the stator wires.

    摘要翻译： 一种电动车辆电动机和相关的冷却方法，其中冷却剂被提供到电动机壳体的冷却剂入口，引导通过包封在壳体内的定子芯的多个径向槽，并从电动机壳体的冷却剂出口 。 径向槽容纳定子导体线，使得冷却剂被迫与所有定子线的所有外表面接触。

    Direct cooled switching module for electric vehicle propulsion system
    10.
    发明授权
    Direct cooled switching module for electric vehicle propulsion system 失效
    电动车推进系统的直接冷却开关模块

    公开(公告)号：US5504378A

    公开(公告)日：1996-04-02

    申请号：US258027

    申请日：1994-06-10

    申请人： Frank A. Lindberg ,  Richard M. Young ,  William B. Hall ,  Frank E. Altoz ,  Ngon B. Nguyen

    发明人： Frank A. Lindberg ,  Richard M. Young ,  William B. Hall ,  Frank E. Altoz ,  Ngon B. Nguyen

    IPC分类号： H02M7/00 ,  H05K5/00 ,  H05K7/20

    CPC分类号： H05K7/20927 ,  H02M7/003 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49109 ,  H01L2924/01004 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1627 ,  H01L2924/19041 ,  H01L2924/30107

    摘要： An apparatus for cooling a switching circuit for an electric vehicle, wherein the switching circuit has at least two switching elements connected in series, includes first and second heat sinks, each having two thermally-conductive planar members forming a passage therebetween for channeling cooling fluid, an inlet port in communication with the passage, and an outlet port in communication with the passage, and a substrate for mounting at least one switching element to each of the first and second heat sinks. An ac terminal connects the switching element attached to the first heat sink in series with the switching element attached to the second heat sink, and inlet and outlet manifolds, coupled to the inlet and outlet ports of the first and second heat sinks, circulate cooling fluid through the passages of the first and second heat sinks to cool the switching elements.

    摘要翻译： 一种用于冷却电动车辆的开关电路的装置，其中开关电路具有串联连接的至少两个开关元件，包括第一和第二散热器，每个具有两个导热平面构件，在其间形成用于引导冷却流体的通道， 与通道连通的入口端口和与通道连通的出口端口以及用于将至少一个开关元件安装到第一和第二散热器中的每一个的基板。 交流端子将附接到第一散热器的开关元件与附接到第二散热器的开关元件串联连接，并且连接到第一和第二散热器的入口和出口的入口和出口歧管使冷却流体 通过第一和第二散热器的通道来冷却开关元件。