公开(公告)号：US20190254199A1

公开(公告)日：2019-08-15

申请号：US15894657

申请日：2018-02-12

申请人： Robert J. Lipp ,  Phillip N. Hughes

发明人： Robert J. Lipp ,  Phillip N. Hughes

IPC分类号： H05K7/20 ,  H05K7/14

摘要： A system and an method to provide cooling of electronic components mounted in a tray by means of a cold plate, is disclosed. The system comprises a cold plate that is mounted in a rack with removable trays mounted on rails affixed to the underside of the cold plate. In one embodiment, compatibility with Open Rack specifications developed by the Open Compute Project is disclosed.

公开(公告)号：US20210014105A1

公开(公告)日：2021-01-14

申请号：US16506908

申请日：2019-07-09

申请人： Phillip N. Hughes ,  Robert J Lipp

发明人： Phillip N. Hughes ,  Robert J Lipp

IPC分类号： H04L12/24 ,  H04L12/931 ,  H04L12/707 ,  H04L12/863 ,  G06F1/20 ,  H05K7/20

摘要： A new physical computer architecture that combines elements in a virtuous cycle to eliminate performance killing inefficiencies in compute systems and need never be physically repaired during its lifetime is described. The system comprises a three dimensional rectangular cube structure with integrated liquid cooling and a multi-dimensional direct network laced through it. The network comprises a distributed, dynamically adaptive, multiply-fault-tolerant routing protocol that can logically replace failed components.

公开(公告)号：US20190269041A1

公开(公告)日：2019-08-29

申请号：US16399729

申请日：2019-04-30

申请人： Robert J. Lipp ,  Phillip N. Hughes

发明人： Robert J. Lipp ,  Phillip N. Hughes

IPC分类号： H05K7/20 ,  H05K7/14

摘要： A cold plate compatible with the Open Compute Project Rack specification is disclosed. The cold plate is mounted in a compatible rack with removable trays mounted on support and coupling rails affixed to the underside of the cold plate thus supporting the trays during insertion and operation.

公开(公告)号：US20100027220A1

公开(公告)日：2010-02-04

申请号：US12535272

申请日：2009-08-04

申请人： Phillip N. Hughes ,  Robert J. Lipps

发明人： Phillip N. Hughes ,  Robert J. Lipps

IPC分类号： H05K7/20

CPC分类号： H05K7/20318 ,  H01L2924/0002 ,  H05K7/20445 ,  H05K7/2049 ,  H05K7/20509 ,  H01L2924/00

摘要： Various embodiments disclose a system and an associated method to provide cooling to a plurality of electronic components mounted proximately to one another in an electronic enclosure is disclosed. The system comprises a cold plate that is mounted on the electronic enclosure to conduct heat thermally. The cold plate has a first surface to mount proximate to the plurality of electronic components and a second surface to mount distal from the plurality of electronic components. One or more heat risers are configured to be thermally coupled between the first surface of the cold plate and at least one of the plurality of electronic components.

摘要翻译： 公开了一种系统和相关方法，用于向电子外壳中彼此靠近安装的多个电子部件提供冷却。 该系统包括安装在电子外壳上以便热传导热量的冷板。 冷板具有靠近多个电子部件安装的第一表面，以及远离多个电子部件安装的第二表面。 一个或多个热提升管被配置为热耦合在冷板的第一表面和多个电子部件中的至少一个之间。

公开(公告)号：US08270170B2

公开(公告)日：2012-09-18

申请号：US12535272

申请日：2009-08-04

申请人： Phillip N. Hughes ,  Robert J. Lipps

发明人： Phillip N. Hughes ,  Robert J. Lipps

IPC分类号： H05K7/20

CPC分类号： H05K7/20318 ,  H01L2924/0002 ,  H05K7/20445 ,  H05K7/2049 ,  H05K7/20509 ,  H01L2924/00

摘要： Various embodiments disclose a system and an associated method to provide cooling to a plurality of electronic components mounted proximately to one another in an electronic enclosure is disclosed. The system comprises a cold plate that is mounted on the electronic enclosure to conduct heat thermally. The cold plate has a first surface to mount proximate to the plurality of electronic components and a second surface to mount distal from the plurality of electronic components. One or more heat risers are configured to be thermally coupled between the first surface of the cold plate and at least one of the plurality of electronic components.

摘要翻译： 公开了一种系统和相关方法，用于向电子外壳中彼此靠近安装的多个电子部件提供冷却。 该系统包括安装在电子外壳上以便热传导热量的冷板。 冷板具有靠近多个电子部件安装的第一表面，以及远离多个电子部件安装的第二表面。 一个或多个热提升管被配置为热耦合在冷板的第一表面和多个电子部件中的至少一个之间。