摘要:
A dissipation device has a dissipation fin set and a centrifugal fan. The centrifugal fan outputs airflow toward the dissipation fin set to remove the heat from it. The centrifugal fan includes a centrifugal impeller mounted on a motor. An outer housing houses the motor and the centrifugal impeller. An inner wall of the housing's outlet has hair structure to reduce noise. The dissipation fin set includes a fin structure closely attached to a heat source, as well as an airflow channel housing. The airflow channel also includes a hair structure for reducing noise.
摘要:
A staggered fin array has a plurality of dissipation fins disposed upright on a substrate. Each dissipation fin has at least one staggered structure at one side or on opposite sides thereof. The staggered structure has two stair structures. Each stair structure has many step surfaces parallel to the airflow direction. An interval surface is formed between adjacent step surfaces. The interval surface is designed as an opening. No more than two leading ledges, formed by the openings, are formed in a single airflow route.
摘要:
A centrifugal fan is described. The centrifugal fan is suitable for a portable electrical apparatus. A tongue shape is formed from a volute sidewall of a casing of the centrifugal fan. The volute sidewall is formed with at least one groove substantially extending horizontally at the tongue shape. Therefore, when the blades rotate to generate a wake flow to blow on a surface of the volute sidewall at the tongue shape, noise generated by the centrifugal fan can be reduced.
摘要:
A staggered fin array has a plurality of dissipation fins disposed upright on a substrate. Each dissipation fin has at least one staggered structure at one side or on opposite sides thereof. The staggered structure has two stair structures. Each stair structure has many step surfaces parallel to the airflow direction. An interval surface is formed between adjacent step surfaces. The interval surface is designed as an opening. No more than two leading ledges, formed by the openings, are formed in a single airflow route.
摘要:
The invention provides a heat-dissipation device and a heat-dissipation method thereof. The electronic device includes a heat source, a thermal interface material (TIM) in contact with the heat source, a heat-dissipation module in contact with the thermal interface material, and an elastic member pushing the heat-dissipation module toward the heat source. The elastic member includes a base and a compressible portion extending from the base, whereby a force, applied to the compressible portion, is transmitted to and uniformly distributed on the base. The heat-dissipation method includes the steps of overlapping a thermal interface material and a heat-dissipation module on the heat source, and exerting a force toward the heat source to the heat-dissipation module.
摘要:
A heat dissipation device for dissipating heat form a heat source includes a control unit, a sensor, a first heat dissipation module, a second heat dissipation module, and a driving mechanism. The sensor electrical connects with the control unit and detects a temperature of the heat source, and reports the temperature to the control unit. The second heat dissipation module is retractably connected to the first heat dissipation module. The driving mechanism is electrically connected to the control unit and the second heat dissipation module. When the temperature exceeds a first temperature, the control unit informs the driving mechanism to extend away from the second heat dissipation module with respect to the first heat dissipation module.
摘要:
A heat dissipation device for dissipating heat form a heat source includes a control unit, a sensor, a first heat dissipation module, a second heat dissipation module, and a driving mechanism. The sensor electrical connects with the control unit and detects a temperature of the heat source, and reports the temperature to the control unit. The second heat dissipation module is retractably connected to the first heat dissipation module. The driving mechanism is electrically connected to the control unit and the second heat dissipation module. When the temperature exceeds a first temperature, the control unit informs the driving mechanism to extend away from the second heat dissipation module with respect to the first heat dissipation module.
摘要:
A centrifugal fan with a resonant silencer has a centrifugal impeller and an outer housing. The outer housing has an inlet, an outlet and a resonant silencer. An inlet is positioned along an axial direction of the centrifugal impeller. An outlet is positioned along a radial direction of the centrifugal impeller. The resonant silencer, extended from a cut-off, can reduce noise caused by a vortex. The resonant silencer can be I- or L-shaped. The cut-off can be covered by a net filter, which isolates the resonant silencer from the flow motivated by the centrifugal impeller.
摘要:
A heat-dissipating module, a fan structure and an impeller. The heat-dissipating module comprises a fan structure providing the impeller to expel heat from a heat source. The impeller comprises a main body and a plurality of blade units. The main body has abase surface, and the blade units extending from the base surface of the main body. Each blade unit comprises a blade surface and a plurality of guiding portions disposed on the blade surface. The pattern of the guiding portions can be linear, curved, parallel or symmetrical, indented on or protruded from the blade units.
摘要:
The invention provides a heat-dissipation device and a heat-dissipation method thereof. The electronic device includes a heat source, a thermal interface material (TIM) in contact with the heat source, a heat-dissipation module in contact with the thermal interface material, and an elastic member pushing the heat-dissipation module toward the heat source. The elastic member includes a base and a compressible portion extending from the base, whereby a force, applied to the compressible portion, is transmitted to and uniformly distributed on the base. The heat-dissipation method includes the steps of overlapping a thermal interface material and a heat-dissipation module on the heat source, and exerting a force toward the heat source to the heat-dissipation module.