公开(公告)号：US09440848B2

公开(公告)日：2016-09-13

申请号：US14724374

申请日：2015-05-28

Applicant: Pixtronix, Inc. ,  Sharp Corporation, Sharp Kabushiki Kaisha

Inventor： Teruo Sasagawa ,  Junghun Chae ,  Jasper Lodewyk Steyn ,  Takeshi Hara ,  Asahi Yamato

IPC: G01P15/08 ,  B81C1/00

CPC classification number: B81C1/00801

Abstract: This disclosure provides systems, methods and apparatus including devices that include layers of passivation material covering at least a portion of an exterior surface of a thin film component within a microelectromechanical device. The thin film component may include an electrically conductive layer that connects via an anchor to a conductive surface on a substrate. The disclosure further provides processes for providing a first layer of passivation material on an exterior surface of a thin film component and for electrically connecting that thin film component to a conductive surface on a substrate. The disclosure further provides processes for providing a second layer of passivation material on any exposed surfaces of the thin film component after release of the microelectromechanical device.

Abstract translation: 本公开提供了包括装置的系统，方法和装置，其包括覆盖微机电装置内的薄膜部件的外表面的至少一部分的钝化材料层。 薄膜部件可以包括通过锚固件连接到基板上的导电表面的导电层。 本公开还提供了在薄膜部件的外表面上提供第一钝化材料层并将该薄膜部件电连接到基板上的导电表面的工艺。 本公开还提供了在释放微机电装置之后在薄膜组件的任何暴露表面上提供第二钝化材料层的工艺。

公开(公告)号：US20160090299A1

公开(公告)日：2016-03-31

申请号：US14724374

申请日：2015-05-28

Applicant: Pixtronix, Inc.

Inventor： Teruo Sasagawa ,  Junghun Chae ,  Jasper Lodewyk Steyn ,  Takeshi Hara ,  Asahi Yamato

IPC: B81B7/02 ,  B81C1/00

CPC classification number: B81C1/00801

Abstract: This disclosure provides systems, methods and apparatus including devices that include layers of passivation material covering at least a portion of an exterior surface of a thin film component within a microelectromechanical device. The thin film component may include an electrically conductive layer that connects via an anchor to a conductive surface on a substrate. The disclosure further provides processes for providing a first layer of passivation material on an exterior surface of a thin film component and for electrically connecting that thin film component to a conductive surface on a substrate. The disclosure further provides processes for providing a second layer of passivation material on any exposed surfaces of the thin film component after release of the microelectromechanical device.

Abstract translation: 本公开提供了包括装置的系统，方法和装置，其包括覆盖微机电装置内的薄膜部件的外表面的至少一部分的钝化材料层。 薄膜部件可以包括通过锚固件连接到基板上的导电表面的导电层。 本公开还提供了在薄膜部件的外表面上提供第一钝化材料层并将该薄膜部件电连接到基板上的导电表面的工艺。 本公开还提供了在释放微机电装置之后在薄膜组件的任何暴露表面上提供第二钝化材料层的工艺。