Abstract:
The present invention discloses a time-sequential multi-spectrum image acquiring device structure which uses a single camera module to achieve multi-spectrum image acquiring in a time-sequential architecture, thereby providing a simple, lightweight telemetry system and reducing the development and operation costs thereof. For example, a visible and near infrared (VNIR) imaging system reduces the use of four camera modules (each including an optical lens, filter, sensor, and image signal processing unit) to single camera module, the VNIR imaging system acquires multi-spectrum images having the same image geometric parameters for image calibration and can simplify the calibration process.The present invention is implemented by introducing a multi-spectrum filter wheel capable of rotating in high speed in the camera module and controlling the image acquiring frequency of the sensor and the synchronicity of the wheel rotating speed for multi-spectrum image acquiring. The present invention is suitable for use in multi-spectrum images acquiring of airborne telemetry requiring lightweight system, such as multi-spectrum images acquiring of unmanned aerial vehicle (UAV).
Abstract:
The present invention discloses a time-sequential multi-spectrum image acquiring device structure which uses a single camera module to achieve multi-spectrum image acquiring in a time-sequential architecture, thereby providing a simple, lightweight telemetry system and reducing the development and operation costs thereof. For example, a visible and near infrared (VNIR) imaging system reduces the use of four camera modules (each including an optical lens, filter, sensor, and image signal processing unit) to single camera module, the VNIR imaging system acquires multi-spectrum images having the same image geometric parameters for image calibration and can simplify the calibration process.The present invention is implemented by introducing a multi-spectrum filter wheel capable of rotating in high speed in the camera module and controlling the image acquiring frequency of the sensor and the synchronicity of the wheel rotating speed for multi-spectrum image acquiring. The present invention is suitable for use in multi-spectrum images acquiring of airborne telemetry requiring lightweight system, such as multi-spectrum images acquiring of unmanned aerial vehicle (UAV).
Abstract:
Disclosed is a chip defect inspection apparatus including a linear array image acquisition module, an illumination control module, a chip defect detection module connected to the LIA module, and an operations and management module connected to the LIA module, the illumination control module and the chip defect detection module.
Abstract:
The present invention discloses an image searching and capturing system and a control method thereof. The system comprises a first capture device, a second capture device, a control module and a processing module. The first capture device captures a plurality of multi-spectral panoramic images with panorama. The control module controls the second capture device to search and target an azimuth of target object according to the plurality of multi-spectral panoramic images; the control module controls that the second capture device rotates a rotation module to capture a high-resolution image of a target object. The control module controls a rotation angle and a rotation direction of the rotation module according to attitude information, position information, and azimuth of the target object. The invention is applied to environmental monitoring and disaster monitoring, and has automatic search for targets, calibration targets and achieve high-resolution images and other effects.
Abstract:
A system and a method for calibrating an ambient light sensor (ALS) are disclosed. The ALS, an adjustable resistor and a switch are located on a first surface of a printed circuit board (PCB), and the adjustable resistor and the switch are connected in series between an adjustable probe of the ALS and the ground. A resistor is connected between two pads located on a second surface of the PCB via two probes touching the pads. A controller connected to the PCB reads a light sensitivity of the ALS and calculates a calculated resistance value of the adjustable resistor by a formula “detected light sensitivity/resistance value of the resistor=objective light sensitivity/resistance value of the adjustable resistor”, wherein the objective light sensitivity and the resistance value of the resistor are given.
Abstract:
An exemplary cutting system (1) for a master liquid crystal panel includes a master liquid crystal panel (10) and two charge-coupled devices (12). The master liquid crystal panel includes four corners, and four alignment marks respectively provided at the corners. At least two of the alignment marks at two diagonal corners are different from each other, and the difference are selected from the group consisting of a difference in shape and a difference in distance from a center of the master liquid crystal panel. The charge-coupled devices are positioned adjacent to two adjacent corners of the mother liquid crystal panel at any one time, and are configured to detect and identify the alignment marks at such two adjacent corners. A related method for cutting the master liquid crystal panel is also provided.
Abstract:
The present invention provides a method for inspecting chip defects. A raw image of a chip is used to extract a chip image. A binary chip edge image obtained from the chip image is used for inspecting defects, coordinated with statistics of edge pixels. During packaging the chip, defects that exceed inspection criteria and affect chip quality are quantitatively and accurately inspected out. The present invention has a simple procedure with high performance on inspecting defect modes and defect sizes. Thus, the present invention greatly improves performance and accuracy of inspections on chip defects for further saving a great amount of labor, time and cost.
Abstract:
The present invention provides a method for inspecting chip defects. A raw image of a chip is used to extract a chip image. A binary chip edge image obtained from the chip image is used for inspecting defects, coordinated with statistics of edge pixels. During packaging the chip, defects that exceed inspection criteria and affect chip quality are quantitatively and accurately inspected out. The present invention has a simple procedure with high performance on inspecting defect modes and defect sizes. Thus, the present invention greatly improves performance and accuracy of inspections on chip defects for further saving a great amount of labor, time and cost.
Abstract:
A medicine reminder device includes a housing, a processing unit, a schedule-setting input unit, a timing unit, light emitting units and medicine containing units. The schedule-setting input unit, the timing unit and the light emitting units are coupled to the processing unit. Each of the medicine containing units corresponds to at least one of the light emitting units, such that at least a part of light, emitted from the light emitting unit, enters the medicine containing unit and then transmits to the outside. The processing unit receives a schedule-setting event through the schedule-setting input unit to obtain timing information. The timing unit receives the timing information and executes a timing event. The processing unit outputs a control signal according to a result resulting from execution of the timing unit, and enables at least one of the light emitting units according to the control signal.