摘要:
A method for cleaving one or more optical fiber(s) at an angle to the optic axis is provided and includes clamping the optical fiber(s) with its coating stripped to expose its distal end. An axial force and/or a bending force is applied to the optical fiber to create internal stresses in the fiber. A sharp blade is provided in an orientation such the blade edge is perpendicular to the optical fiber. The blade is further orientated such that a plane bisecting the blade angle formed between two polished surfaces of the blade is slanted relative to the longitudinal axis of the fiber. The at least one optical fiber is scratched with the sharp blade to create a non-perpendicular cleave having a controlled shape in the region of the scratch. A method of splicing the fibers and a tool for cleaving the fibers are also provided.
摘要:
Process for removing peripheral portions such as bead regions of a glass sheet including a step of pushing the glass sheet in the peripheral portion using a pushing mechanism such as a pushing bar, and corresponding apparatus. As a result of the use of the pushing mechanism, the engagement completion time for suction cups, if used, are reduced significantly. A process without using suction cups is enabled with enhanced yield. The increased process stability and enlarged process window are particularly advantageous for processing glass sheets having high flexibility.
摘要:
The present disclosure provides a method for manufacturing a liquid crystal panel motherboard, comprising providing materials that can form projections on a margin area of at least one of two substrates of the liquid crystal panel motherboard, and then fitting said two substrates to each other, so that the margin area of said at least one of the two substrates cannot be fit to a corresponding margin area of the other substrate seamlessly. The present disclosure also provides a method for cutting a liquid crystal panel motherboard, and a liquid crystal panel obtained from the liquid crystal motherboard.
摘要:
To address the needs in the art, a method of cleaving substrate material that includes forming an initial crack in a bulk substrate material, where the crack is aligned along a cleaving plane of the bulk substrate material, aligning the cleaving plane between two parallel electrodes in a controlled environment, wherein the parallel electrodes include a top electrode and a bottom electrode, where the cleaving plane is parallel with the two parallel electrodes, where a bottom portion of the bulk substrate material is physically and electrically connected to the bottom electrode, and applying a voltage across the two parallel electrodes, where the voltage is at least 50 kV and establishes a uniform electromagnetic force on the top surface of the bulk substrate material, where the electromagnetic force is capable of inducing crack propagation along the cleaving plane and separating a cleaved substrate material from the bulk substrate material.
摘要:
A method of making steel fibers, preferably for use as a concrete additive, and for the supply thereof in making steel fiber concrete, characterized in that to form the steel fibers (2) first a sheet-metal strip (1) is notched either on one face or both faces so as to form steel-fiber wires (4) that are initially connected together by webs (5), and that further, for subsequently converting the webs (5) into thin easily mutually separable separation webs forming separation surfaces that are fracture-rough and low in burring upon separation, the steel-fiber strip is subjected to a flexing process in which each web (5) is subjected to multiple bending deformations about its longitudinal axis in such a way that incipient cracks are produced at the webs (5) due to fatigue fracture and thus the separation webs are produced.
摘要:
A device and method for cleaving a sample includes: creating an indentation on a top surface of the sample by applying a downward force along a vertical axis, the axis arranging perpendicularly to the top surface of the sample; providing a breaking pin and arranging the breaking pin under the sample to touch the bottom surface of the sample at a position that is directly opposite from the indentation; and, applying a downward force on the sample by providing a left side and right side breaker pin wherein the downward force comprises a left-side downward force extended through the left-side breaker pin and right-side downward force through the right side breaker pin, further the pins that provide the left-side and right-side downward force are disposed on a breaker bar and arranged to be on opposite sides of a vertical axis that extends through the indentation on the top surface.
摘要:
Granitic stone slabs can be split into thin rock-faced veneers by opposed tools forced into the slab from opposite sides. One tool comprises a radiused contact surface and the other a sharp edge, with a beveled surface on one side thereof.
摘要:
Methods of cutting laminate strengthened glass substrates are disclosed. A method is disclosed which includes providing a laminate strengthened glass substrate having a glass core layer with first and second surface portions, and at least one glass cladding layer fused to the first surface portion or the second surface portion of the glass core layer. The glass core layer has a core coefficient of thermal expansion that is larger than a cladding coefficient of thermal expansion. The method further includes forming an edge defect on the laminate strengthened glass substrate, heating first and second regions of the laminate strengthened glass substrate on the at least one glass cladding layer. The first and second regions are offset from first and second sides of a desired line of separation, respectively. The method further includes propagating a crack imitated at the edge defect between the first and second regions.
摘要:
Methods and apparatuses for separating sheets of brittle material are disclosed. According to one embodiment, a separation apparatus for separating a sheet of brittle material includes a first separation cam positioned adjacent to a sheet conveyance pathway and a second separation cam positioned opposite from and downstream of the first separation cam. The first and second separation cams may be rotated such that the contact faces of the separation cams periodically extend across a centerline of the conveyance pathway. Rotation of the first and second separation cams may be synchronized such that at least the portion of the contact face of the first separation cam and at least the portion of the contact face of the second separation cam periodically extend across the centerline of the conveyance pathway at a separation time and periodically do not extend across the centerline of the conveyance pathway at a non-separation time.
摘要:
Apparatus and methods for mechanically cleaving a bonded wafer structure are disclosed. The apparatus and methods involve clamps that grip the bonded wafer structure and are actuated to cause the bonded structure to cleave.