公开(公告)号：US20070057169A1

公开(公告)日：2007-03-15

申请号：US11225076

申请日：2005-09-14

申请人： Chung-Chi Hsiao ,  Po-Hung Chen ,  Mao-Jung Chen

发明人： Chung-Chi Hsiao ,  Po-Hung Chen ,  Mao-Jung Chen

IPC分类号： H01J40/14

CPC分类号： H01L27/14618 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/00

摘要： The present invention relates to a package structure for an optical sensor having a base set with the plurality of metallization traces on its upper and under surface and several conductors passing through the base electrically connects to the plurality of metallization traces on the surface; at least one optical sensor and its peripheral frame are set upon the base in which the conductors can be located within the frame area or the area between the optical sensor and the frame; and a light-pervious lid encapsulates the frame and completes the package structure. In addition, an enclosing base having a containing capacity can be adopted to replace the base and the frame. The present invention can efficiently raise the reliability of elements and yield and quality by said package structure.

摘要翻译： 本发明涉及一种用于光学传感器的封装结构，其具有在其上表面和下表面上具有多个金属化迹线的基座，并且穿过基座的多个导体电连接到表面上的多个金属化迹线; 至少一个光学传感器及其外围框架设置在基座上，导体可以位于框架区域内或光学传感器与框架之间的区域内; 并且透光的盖子封装框架并完成封装结构。 此外，可以采用具有容纳能力的封闭基座来代替基座和框架。 本发明可以通过所述包装结构有效提高元件的可靠性和产量和质量。

公开(公告)号：US07297918B1

公开(公告)日：2007-11-20

申请号：US11464564

申请日：2006-08-15

申请人： Po-Hung Chen ,  Mao-Jung Chen ,  Chung-Chi Hsiao

发明人： Po-Hung Chen ,  Mao-Jung Chen ,  Chung-Chi Hsiao

IPC分类号： H01J40/14 ,  G02B7/02

CPC分类号： H01L27/14625 ,  H01L27/14618 ,  H01L31/0203 ,  H01L31/02325 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/16195 ,  H04N5/2252 ,  H04N5/2253 ,  H04N5/2257 ,  H01L2924/00014

摘要： An image sensor package structure and an image sensing module are proposed. A substrate, a frame and a light transparent layer are used to package an image sensing chip to form the image sensor package structure. The frame is mounted on the substrate and located around the image sensing chip. The top of the frame extends toward the image sensing chip and upwards to form a locking and placing portion with an L-shaped cross section. Bend positions of the locking and placing portion form a placement space formed to accommodate and position the light transparent layer. The structure is simple, the fabrication is easy, and the gluing and packaging operations can be facilitated. Moreover, when the image sensor package structure and a lens set are assembled into an image sensing module, a lens base with a smaller size can be used to shrink the package area.

摘要翻译： 提出了一种图像传感器封装结构和图像感测模块。 使用基板，框架和透光层来封装图像感测芯片以形成图像传感器封装结构。 框架安装在基板上并位于图像感测芯片周围。 框架的顶部朝向图像感测芯片向上延伸以形成具有L形横截面的锁定和放置部分。 锁定和放置部分的弯曲位置形成为容纳和定位透光层而形成的放置空间。 该结构简单，制造容易，并且可以促进胶合和包装操作。 此外，当图像传感器封装结构和透镜组组装成图像感测模块时，可以使用具有较小尺寸的透镜基座来缩小封装区域。

公开(公告)号：US07405456B2

公开(公告)日：2008-07-29

申请号：US11225077

申请日：2005-09-14

申请人： Po-Hung Chen ,  Chin-Cheng Lo ,  Mao-Jung Chen

发明人： Po-Hung Chen ,  Chin-Cheng Lo ,  Mao-Jung Chen

IPC分类号： H01L29/40

CPC分类号： H01L27/14618 ,  H01L27/14625 ,  H01L2924/0002 ,  H01L2924/00

摘要： The present invention relates to an optical sensor chip package in a cavity of forming frame thereof and has a gap between protection layer and optical sensor chip. The optical sensor chip avoids accepting the pressure from protection layer that damage the reliability between pads and metallic traces when protection layer lay on the forming frame. It improves drawbacks of the glue pass trough the gap between optical sensor chip and pads into the optical sensor area of optical sensor chip. It improves the high process yield and reduces the height of optical sensor chip package to achieve lightly and thinly.

摘要翻译： 本发明涉及其形成框架的空腔中的光学传感器芯片封装，并且在保护层和光学传感器芯片之间具有间隙。 当保护层位于成型框架上时，光学传感器芯片避免接受来自保护层的压力，从而损坏焊盘和金属迹线之间的可靠性。 它改善了光学传感器芯片和焊盘之间的间隙的胶合通过光学传感器芯片的光学传感器区域的缺点。 它提高了高工艺成品率，降低了光学传感器芯片封装的高度，实现轻薄。

公开(公告)号：US20070090478A1

公开(公告)日：2007-04-26

申请号：US11251777

申请日：2005-10-18

申请人： Po-Hung Chen ,  Mao-Jung Chen

发明人： Po-Hung Chen ,  Mao-Jung Chen

IPC分类号： H01L31/0203

CPC分类号： H01L27/14618 ,  H01L27/14683 ,  H01L31/0203 ,  H01L2924/0002 ,  H01L2924/00

摘要： An image sensor package structure is proposed, in which an image sensor is fixed on a substrate having metallization traces and an adhesion layer. Electric paths of the package structure are changed from the COG (chip on glass) process to the CIS (CMOS image sensor) process to improve electric characteristics. Moreover, spacers are formed at appropriate positions to prevent glue overflow from contaminating the sensing regions and solder balls. The proposed package structure can also shrink the package area to greatly enhance the yield and quality.

摘要翻译： 提出了一种图像传感器封装结构，其中图像传感器固定在具有金属化迹线和粘合层的基板上。 封装结构的电气路径从COG（玻璃上芯片）工艺转变为CIS（CMOS图像传感器）工艺，以改善电气特性。 而且，在适当的位置形成间隔物，以防止胶水溢出污染感测区域和焊球。 提出的包装结构也可以缩小包装面积，大大提高产量和质量。

公开(公告)号：US20070075236A1

公开(公告)日：2007-04-05

申请号：US11239028

申请日：2005-09-30

申请人： Po-Hung Chen ,  Mao-Jung Chen

发明人： Po-Hung Chen ,  Mao-Jung Chen

IPC分类号： H01J5/02 ,  H01J40/14

CPC分类号： H01L27/14618 ,  H01L31/0203 ,  H01L2924/0002 ,  H01L2924/00

摘要： The present invention discloses a packaging method of a light-sensing semiconductor device and a packaging structure thereof, wherein a matrix of spacer walls is formed on a light-sensing wafer, which has multiple light-sensing chips, and the adhesive is directly applied to between two neighboring spacer walls on the non-light-sensing regions. Thus, when the light transparent cover is installed, there is no more adhesive dropping onto the light-sensing regions of the light-sensing chips. Further, when the light transparent cover is pressed to join with the spacer walls, with the trenches formed at the tops of the spacer walls, the adhesive will not overflow from the joint seams into the light-sensing regions.

摘要翻译： 本发明公开了一种感光半导体器件及其封装结构的封装方法，其中在具有多个光感测芯片的感光晶片上形成间隔壁矩阵，并将该粘合剂直接施加到 在非感光区域上的两个相邻间隔壁之间。 因此，当安装光透明盖时，没有更多的粘合剂落在感光片的感光区上。 此外，当将光透明盖按压以与间隔壁接合时，其中沟槽形成在间隔壁的顶部处，粘合剂将不会从接缝处溢出进入感光区域。

公开(公告)号：US20080188031A1

公开(公告)日：2008-08-07

申请号：US12078819

申请日：2008-04-07

申请人： Po-Hung Chen ,  Mao-Jung Chen

发明人： Po-Hung Chen ,  Mao-Jung Chen

IPC分类号： H01L31/0216

CPC分类号： H01L27/14618 ,  H01L31/0203 ,  H01L2924/0002 ,  H01L2924/00

摘要： The present invention discloses a packaging method of a light-sensing semiconductor device and a packaging structure thereof, wherein a matrix of spacer walls is formed on a light-sensing wafer, which has multiple light-sensing chips, and the adhesive is directly applied to between two neighboring spacer walls on the non-light-sensing regions. Thus, when the light transparent cover is installed, there is no more adhesive dropping onto the light-sensing regions of the light-sensing chips. Further, when the light transparent cover is pressed to join with the spacer walls, with the trenches formed at the tops of the spacer walls, the adhesive will not overflow from the joint seams into the light-sensing regions.

摘要翻译： 本发明公开了一种感光半导体器件及其封装结构的封装方法，其中在具有多个光感测芯片的感光晶片上形成间隔壁矩阵，并将该粘合剂直接施加到 在非感光区域上的两个相邻间隔壁之间。 因此，当安装光透明盖时，没有更多的粘合剂落在感光片的感光区上。 此外，当将光透明盖按压以与间隔壁接合时，其中沟槽形成在间隔壁的顶部处，粘合剂将不会从接缝处溢出进入感光区域。

公开(公告)号：US20070064317A1

公开(公告)日：2007-03-22

申请号：US11231848

申请日：2005-09-22

申请人： Po-Hung Chen ,  Mao-Jung Chen

发明人： Po-Hung Chen ,  Mao-Jung Chen

IPC分类号： G02B7/02

CPC分类号： H04N5/2253

摘要： An image sensor package structure is proposed, in which the electric connection of an image sensing chip and the assembly of a housing and a lens barrel are separately carried out to avoid restriction in the packaging process and influence of outside contaminants. Moreover, corresponding faces of the housing and the lens barrel are designed to be smooth surfaces to reduce the probability of adhesion and accumulation of outside contaminants, thereby enhancing the process yield and also reducing the process cost.

摘要翻译： 提出了一种图像传感器封装结构，其中分别执行图像感测芯片的电连接和壳体和透镜镜筒的组合，以避免封装过程中的限制和外部污染物的影响。 此外，壳体和透镜筒的相应面被设计为光滑的表面，以减少外部污染物的粘附和积聚的可能性，从而提高过程产量并且还降低工艺成本。

公开(公告)号：US20070090504A1

公开(公告)日：2007-04-26

申请号：US11225077

申请日：2005-09-14

申请人： Po-Hung Chen ,  Chin-Cheng Lo ,  Mao-Jung Chen

发明人： Po-Hung Chen ,  Chin-Cheng Lo ,  Mao-Jung Chen

IPC分类号： H01L23/02

CPC分类号： H01L27/14618 ,  H01L27/14625 ,  H01L2924/0002 ,  H01L2924/00

摘要： The present invention relates to an optical sensor chip package in a cavity of forming frame thereof and has a gap between protection layer and optical sensor chip. The optical sensor chip avoids accepting the pressure from protection layer that damage the reliability between pads and metallic traces when protection layer lay on the forming frame. It improves drawbacks of the glue pass trough the gap between optical sensor chip and pads into the optical sensor area of optical sensor chip. It improves the high process yield and reduces the height of optical sensor chip package to achieve lightly and thinly.

摘要翻译： 本发明涉及其形成框架的空腔中的光学传感器芯片封装，并且在保护层和光学传感器芯片之间具有间隙。 当保护层位于成型框架上时，光学传感器芯片避免接受来自保护层的压力，从而损坏焊盘和金属迹线之间的可靠性。 它改善了光学传感器芯片和焊盘之间的间隙的胶合通过光学传感器芯片的光学传感器区域的缺点。 它提高了高工艺成品率，降低了光学传感器芯片封装的高度，实现轻薄。

公开(公告)号：US20070058069A1

公开(公告)日：2007-03-15

申请号：US11225114

申请日：2005-09-14

申请人： Po-Hung Chen ,  Mao-Jung Chen

发明人： Po-Hung Chen ,  Mao-Jung Chen

IPC分类号： H04N5/225 ,  G02B7/02

CPC分类号： H04N5/2254 ,  G02B7/023

摘要： A packaging structure of a light sensation module includes a substrate, a light sensation chip, a housing and a lens barrel. The light sensation chip is installed on the substrate and is electrically connected to the substrate. The lens barrel is movably installed to the housing, and the corresponding surfaces of the housing and the lens barrel are smooth. Thereby, the pollutants brought about by friction can be reduced; the deposition of external pollutants can be avoided; the yield can be promoted; and the cost can be lowered.

摘要翻译： 光感模块的包装结构包括基板，光感芯片，外壳和镜筒。 光感芯片安装在基板上并与基板电连接。 透镜筒可移动地安装到壳体上，并且壳体和镜筒的相应表面是光滑的。 因此，可以减少由摩擦引起的污染物; 外部污染物的沉积可以避免; 产量可以提升; 并且可以降低成本。

公开(公告)号：US07547571B2

公开(公告)日：2009-06-16

申请号：US12078819

申请日：2008-04-07

申请人： Po-Hung Chen ,  Mao-Jung Chen

发明人： Po-Hung Chen ,  Mao-Jung Chen

IPC分类号： H01L21/00

CPC分类号： H01L27/14618 ,  H01L31/0203 ,  H01L2924/0002 ,  H01L2924/00

摘要： The present invention discloses a packaging method of a light-sensing semiconductor device and a packaging structure thereof, wherein a matrix of spacer walls is formed on a light-sensing wafer, which has multiple light-sensing chips, and the adhesive is directly applied to between two neighboring spacer walls on the non-light-sensing regions. Thus, when the light transparent cover is installed, there is no more adhesive dropping onto the light-sensing regions of the light-sensing chips. Further, when the light transparent cover is pressed to join with the spacer walls, with the trenches formed at the tops of the spacer walls, the adhesive will not overflow from the joint seams into the light-sensing regions.

摘要翻译： 本发明公开了一种感光半导体器件及其封装结构的封装方法，其中在具有多个光感测芯片的感光晶片上形成间隔壁矩阵，并将该粘合剂直接施加到 在非感光区域上的两个相邻间隔壁之间。 因此，当安装光透明盖时，没有更多的粘合剂落在感光片的感光区上。 此外，当将光透明盖按压以与间隔壁接合时，其中沟槽形成在间隔壁的顶部处，粘合剂将不会从接缝处溢出进入感光区域。