公开(公告)号：US11697232B2

公开(公告)日：2023-07-11

申请号：US16632257

申请日：2018-07-19

Applicant: Polyplastics Co., LTD. ,  Yamase Electric Co., LTD.

Inventor： Hidemi Kondo

IPC: B29C45/14 ,  B32B15/08 ,  B23K26/364 ,  B29K705/02 ,  B32B15/20

CPC classification number: B29C45/14311 ,  B32B15/08 ,  B23K26/364 ,  B29C45/14811 ,  B29K2705/02 ,  B32B15/20

Abstract: A metal resin composite-molded article which can suppress deformation induced by laser processing in a technique for improving the adhesion between a metal plate and a resin by forming grooves on the surface of the metal plate by means of a laser, even if the metal plate is thin. A metal resin composite-molded article obtained by insert-molding a resin composition on a metal plate having a thickness of 500 μm or less, grooves are formed on the surface of the metal plate in which the resin composition is inserted, the width of the grooves is 30-300 μm, the depth of the grooves is at most 24% of the thickness of the metal plate, and the ratio of the width to the depth is 0.1-2.5.

公开(公告)号：US20200223113A1

公开(公告)日：2020-07-16

申请号：US16632257

申请日：2018-07-19

Applicant: Polyplastics Co., LTD. ,  Yamase Electric Co., LTD.

Inventor： Hidemi Kondo

IPC: B29C45/14 ,  B32B15/08

Abstract: A metal resin composite-molded article which can suppress deformation induced by laser processing in a technique for improving the adhesion between a metal plate and a resin by forming grooves on the surface of the metal plate by means of a laser, even if the metal plate is thin. A metal resin composite-molded article obtained by insert-molding a resin composition on a metal plate having a thickness of 500 μm or less, grooves are formed on the surface of the metal plate in which the resin composition is inserted, the width of the grooves is 30-300 μm, the depth of the grooves is at most 24% of the thickness of the metal plate, and the ratio of the width to the depth is 0.1-2.5.

公开(公告)号：US10072147B2

公开(公告)日：2018-09-11

申请号：US15149952

申请日：2016-05-09

Applicant: Polyplastics Co., Ltd.

Inventor： Akihide Shimoda ,  Satomi Nakada ,  Yasumitsu Miyamoto ,  Hidemi Kondo

IPC: C08K3/22 ,  C08K5/053 ,  C08L59/00 ,  C08L59/04 ,  C08K5/103 ,  C08K5/134 ,  C08J7/14

CPC classification number: C08L59/04 ,  C08J7/14 ,  C08J2359/02 ,  C08K3/22 ,  C08K5/103 ,  C08K5/134 ,  C08K5/1345 ,  C08K2003/222 ,  C08L71/02 ,  C08L2201/08 ,  F02M2200/9015

Abstract: A polyacetal resin composition makes it possible, when formed into a molded article, to minimize deterioration during contact with sulfur-containing fuel or an acidic detergent. The polyacetal resin composition contains (A) 100 parts by weight of polyacetal resin, (B) 0.1-1.0 parts by weight of hindered phenolic antioxidant, (C) 0.1-2.0 parts by weight of alkaline earth metal oxide, (D) 0.5-3.0 parts by weight of polyalkylene glycol, and (E) 0.01-1.0 parts by weight of polyvalent fatty acid full ester. This polyacetal resin composition minimizes reductions in the weight of a molded article even after the molded article has been immersed in sulfur-containing fuel.