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1.发明授权Electronic device including thermal sensor and peltier cooler and related methods 有权电子设备包括热传感器和珀耳替尔冷却器及相关方法公开(公告)号：US08952480B2
公开(公告)日：2015-02-10
申请号：US13614008
申请日：2012-09-13
Applicant: PraveenKumar Radhakrishnan
Inventor： PraveenKumar Radhakrishnan
CPC classification number: H01L35/32 , G01J5/061 , G01J5/12 , G01J5/16 , G01J5/20 , H01L23/38 , H01L35/28 , H01L2924/0002 , H01L2924/00
Abstract: An electronic device may include a temperature sensing semiconductor substrate, that may include a thermal sensor at an upper surface thereof, and a cooling semiconductor substrate having an upper surface coupled to a lower surface of the temperature sensing semiconductor substrate. The cooling semiconductor substrate may include a Peltier cooler. At least one of the temperature sensing semiconductor substrate and the cooling semiconductor substrate may have a cavity therein beneath the thermopile and aligned therewith.
Abstract translation: 电子设备可以包括温度感测半导体衬底，其可以包括其上表面处的热传感器，以及具有耦合到温度感测半导体衬底的下表面的上表面的冷却半导体衬底。 冷却半导体衬底可以包括珀尔帖冷却器。 温度感测半导体衬底和冷却半导体衬底中的至少一个可以在热电堆下方具有空腔并与之对准。
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2.发明申请ELECTRONIC DEVICE INCLUDING THERMAL SENSOR AND PELTIER COOLER AND RELATED METHODS 有权包括热传感器和传真机的电子设备及相关方法公开(公告)号：US20140070355A1
公开(公告)日：2014-03-13
申请号：US13614008
申请日：2012-09-13
Applicant: PraveenKumar Radhakrishnan
Inventor： PraveenKumar Radhakrishnan
IPC: H01L31/024 , H01L31/18
CPC classification number: H01L35/32 , G01J5/061 , G01J5/12 , G01J5/16 , G01J5/20 , H01L23/38 , H01L35/28 , H01L2924/0002 , H01L2924/00
Abstract: An electronic device may include a temperature sensing semiconductor substrate, that may include a thermal sensor at an upper surface thereof, and a cooling semiconductor substrate having an upper surface coupled to a lower surface of the temperature sensing semiconductor substrate. The cooling semiconductor substrate may include a Peltier cooler. At least one of the temperature sensing semiconductor substrate and the cooling semiconductor substrate may have a cavity therein beneath the thermopile and aligned therewith.
Abstract translation: 电子设备可以包括温度感测半导体衬底，其可以包括其上表面处的热传感器，以及具有耦合到温度感测半导体衬底的下表面的上表面的冷却半导体衬底。 冷却半导体衬底可以包括珀尔帖冷却器。 温度感测半导体衬底和冷却半导体衬底中的至少一个可以在热电堆下方具有空腔并与之对准。
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