公开(公告)号：US11821794B2

公开(公告)日：2023-11-21

申请号：US17176705

申请日：2021-02-16

申请人： Exergen Corporation

发明人： Jason N. Jarboe ,  Francesco Pompei

IPC分类号： G01J5/06 ,  G01J5/00 ,  G01J5/061 ,  G01J5/12 ,  G01J5/16

CPC分类号： G01J5/06 ,  G01J5/0003 ,  G01J5/0022 ,  G01J5/061 ,  G01J5/12 ,  G01J5/16 ,  G01J5/064 ,  G01J2005/0029

摘要： Devices and corresponding methods can be provided to monitor or measure temperature of a target or to control a process. Targets can have low, unknown, or variable emissivity. Devices and corresponding methods can be used to measure temperatures of thin film, partially transparent, or opaque targets, as well as targets not filling a sensor's field of view. Temperature measurements can be made independent of emissivity of a target surface by, for example, inserting a target between a thermopile sensor and a background surface maintained at substantially the same temperature as the thermopile sensor. In embodiment devices and methods, a sensor temperature can be controlled to match a target temperature by minimizing or zeroing a net heat flux at the sensor, as derived from a sensor output signal. Alternatively, a target temperature can be controlled to minimize the heat flux.

公开(公告)号：US11817522B1

公开(公告)日：2023-11-14

申请号：US17897162

申请日：2022-08-28

申请人： Shimon Maimon

发明人： Shimon Maimon

IPC分类号： H01L31/18 ,  H01L31/10 ,  H01L31/0352 ,  H01L31/0304 ,  G01J5/06 ,  G01J5/20 ,  B82Y20/00 ,  H01L31/101 ,  H01L31/0296 ,  G01J5/061 ,  H01L27/146 ,  H01L23/38 ,  G01J5/00

CPC分类号： H01L31/1832 ,  B82Y20/00 ,  G01J5/061 ,  G01J5/20 ,  H01L27/14669 ,  H01L31/02966 ,  H01L31/03046 ,  H01L31/035236 ,  H01L31/101 ,  H01L31/1844 ,  G01J2005/0077 ,  H01L23/38 ,  H01L2924/0002 ,  Y02E10/544

摘要： A photodetector comprising a doped semiconductor photoabsorber, a barrier layer in contact with the photo absorber layer on one side, and at least one doped semiconductor contact area on the opposite side of the barrier layer. The barrier has a valence band energy substantially equal to the valence band energy of the photo absorber, and a thickness and a conductance band gap sufficient to allow tunneling of minority carriers, and block the flow of thermalized majority carriers from the photo absorber to the contact area. A P-doped or N-doped semiconductor may be utilized. The photoabsorber layer may extend past the one or more individual sections of the contact areas in the direction across the photo-detector.

公开(公告)号：US20230327044A1

公开(公告)日：2023-10-12

申请号：US18205537

申请日：2023-06-03

申请人： Shimon Maimon

发明人： Shimon Maimon

IPC分类号： H01L31/18 ,  H01L31/101 ,  B82Y20/00 ,  H01L31/0352 ,  H01L31/0304 ,  H01L31/0296 ,  G01J5/061 ,  G01J5/20 ,  H01L27/146

CPC分类号： H01L31/1832 ,  H01L31/101 ,  H01L31/1844 ,  B82Y20/00 ,  H01L31/035236 ,  H01L31/03046 ,  H01L31/02966 ,  G01J5/061 ,  G01J5/20 ,  H01L27/14669 ,  Y02E10/544 ,  H01L23/38

摘要： A photodetector comprising a doped semiconductor photoabsorber, a barrier layer in contact with the photo absorber layer on one side, and at least one doped semiconductor contact area on the opposite side of the barrier layer. The barrier has a valence band energy substantially equal to the valence band energy of the photo absorber, and a thickness and a conductance band gap sufficient to allow tunneling of minority carriers, and block the flow of thermalized majority carriers from the photo absorber to the contact area. A P-doped or N-doped semiconductor may be utilized. The photoabsorber layer may extend past the one or more individual sections of the contact areas in the direction across the photo-detector.

公开(公告)号：US20190204167A1

公开(公告)日：2019-07-04

申请号：US16207614

申请日：2018-12-03

申请人： Commissariat À L'énergie Atomique Et Aux Énergies Alternatives

发明人： Mohammed Benwadih ,  Christine Revenant-Brizard

IPC分类号： G01K17/00 ,  G01J5/20 ,  G06K9/00 ,  G01J5/34 ,  H01L37/02

CPC分类号： G01K17/003 ,  G01J5/0025 ,  G01J5/024 ,  G01J5/046 ,  G01J5/061 ,  G01J5/20 ,  G01J5/34 ,  G01J2005/345 ,  G06K9/0002 ,  H01L37/02

摘要： Thermal pattern sensor comprising several pixels located on a substrate, each pixel comprising a pyroelectric capacitor, the pyroelectric capacitor comprising a pyroelectric material located between two electrically conducting electrodes, the pyroelectric material comprising a sol-gel matrix in which first particles made of a first material and second particles made of a second material are dispersed. The first material being chosen from among calcium, lanthanum, tantalum, barium, lead and/or strontium oxides, the second material being chosen from among titanium, antimony, tin, zinc, gallium, vanadium and/or manganese oxides.

公开(公告)号：US20180292265A1

公开(公告)日：2018-10-11

申请号：US15483219

申请日：2017-04-10

申请人： Raytheon Company

发明人： Gavin L. Avers ,  Michael L. Brest ,  Mark C. Elbogen ,  Christopher J. Cobb ,  Daniel W. Rinehart ,  Jason S. Graham

IPC分类号： G01J5/06 ,  G01J5/08

CPC分类号： G01J5/06 ,  G01J5/061 ,  G01J5/0831 ,  G01J5/0834 ,  G01J5/084 ,  G01J2005/065

摘要： An Infrared Detector Dewar system includes a housing and an infrared detector. The system also includes one or more strut members coupled on a first end to the housing. The system further includes cold shield coupled to the infrared detector and to a second end of the one or more strut members. The cold shield includes a reinforcement ring aligned with the one or more strut members. The cold shield is formed by forming a support member having disc encased by a support ring. The support member is positioned within a mandrel such that the reinforcement ring is disposed to align with a strut position. The cold shield is then formed by electroplating copper over the mandrel and at least a portion of the support member, and then by removing/dissolving all aforementioned mandrels.

公开(公告)号：US10064265B2

公开(公告)日：2018-08-28

申请号：US15027177

申请日：2014-09-29

申请人： SOCIÉTÉ FRANÇAISE DE DÉTECTEURS INFRAROUGES—SOFRADIR

发明人： David Robert ,  Yves Royer

IPC分类号： H05K1/02 ,  G01J5/06 ,  G01J5/10 ,  H01R12/77 ,  H05K1/11 ,  H05K1/14

CPC分类号： H05K1/0201 ,  G01J5/06 ,  G01J5/061 ,  G01J5/10 ,  H01R12/77 ,  H05K1/0209 ,  H05K1/0218 ,  H05K1/028 ,  H05K1/0296 ,  H05K1/11 ,  H05K1/147 ,  H05K2201/06 ,  H05K2201/066 ,  H05K2201/0715

摘要： A flexible printed circuit of low emissivity including first and second ends and a flexible central portion extending between the first and second ends and including electrically-conductive tracks, coated with a polymer material, to electrically connect the first and second ends. The flexible central portion is at least partly covered with a heat shield formed in a material having an emissivity smaller than those of the polymer material and of the electrically-conductive tracks.

公开(公告)号：US20180067143A1

公开(公告)日：2018-03-08

申请号：US15259106

申请日：2016-09-08

申请人： Robert Bosch GmbH

发明人： Seow Yuen Yee ,  Gary Yama ,  Thomas Rocznik

IPC分类号： G01P5/26 ,  G01P13/00

CPC分类号： G01P5/26 ,  G01F1/68 ,  G01F1/684 ,  G01F1/69 ,  G01F1/696 ,  G01F1/699 ,  G01J5/0037 ,  G01J5/0265 ,  G01J5/045 ,  G01J5/06 ,  G01J5/061 ,  G01J5/0887 ,  G01J5/20 ,  G01J2005/063 ,  G01J2005/202 ,  G01P13/0006

摘要： A sensor comprises a substrate having a first surface; a cap structure connected to the substrate, the cap structure configured to define a cavity between an inner surface of the cap structure and the first surface of the substrate, the cap structure configured to block infrared radiation from entering the cavity from outside the cap structure; a plurality of absorbers, each absorber in the plurality of absorbers being connected to the first surface of the substrate and arranged at a respective position within the cavity and configured to absorb infrared radiation at the respective position within the cavity; and a plurality of readout circuits, each readout circuit in the plurality of readout circuits being connected to a respective absorber in the plurality of absorbers and configured to provide a measurement signal that indicates an amount of infrared radiation absorbed by the respective absorber.

公开(公告)号：US20170370779A1

公开(公告)日：2017-12-28

申请号：US15194753

申请日：2016-06-28

申请人： Excelitas Technologies Singapore Pte Ltd.

发明人： Piotr Kropelnicki ,  Radu M. Marinescu ,  Grigore D. Huminic ,  Hermann Karagoezoglu ,  Kai Liang Chuan

IPC分类号： G01J5/12 ,  H01L31/09 ,  H01L31/18 ,  G01J5/06 ,  H01L35/34 ,  H01L35/32

CPC分类号： G01J5/12 ,  G01J5/024 ,  G01J5/061 ,  G01J2005/065 ,  H01L31/09 ,  H01L31/1804 ,  H01L31/1828 ,  H01L31/1856 ,  H01L35/32 ,  H01L35/34

摘要： An unreleased thermopile IR sensor and method of fabrication is provided which includes a new thermally isolating material and an ultra-thin material based sensor which, in combination, provide excellent sensitivity without requiring a released membrane structure. The sensor is fabricated using a wafer transfer technique in which a substrate assembly comprising the substrate and new thermally isolating material is bonded to a carrier substrate assembly comprising a carrier substrate and the ultra-thin material, followed by removal of the carrier substrate. As such, temperature restrictions of the various materials are overcome.

公开(公告)号：US20170176607A1

公开(公告)日：2017-06-22

申请号：US15175785

申请日：2016-06-07

申请人： SHANGHAI UNITED IMAGING HEALTHCARE CO., LTD.

发明人： Weiping LIU ,  Yixing SUN

IPC分类号： G01T1/24

CPC分类号： G01T1/244 ,  G01J5/061 ,  G01T1/1648 ,  G01T1/249 ,  G01T1/2985 ,  H01L31/024

摘要： An imaging system including an imaging device and/or a cooling system is provided. The imaging system may include a control module, an imaging device, and/or a cooling system. The imaging device may include a first portion and a second portion. The cooling system may include a cooling module configured to generate a cooling medium, and/or a cooling medium passage configured to spread the cooling medium. The cooling medium passage may belong to a closed loop. At least part of the cooling system may be located within the imaging device such that the cooling medium may be in direct contact with the at least part of the imaging device.

公开(公告)号：US09599274B2

公开(公告)日：2017-03-21

申请号：US13732245

申请日：2012-12-31

申请人： Raytheon Company

发明人： Andrew L. Bullard

IPC分类号： F16M1/00 ,  F16M3/00 ,  F16M5/00 ,  F16M7/00 ,  F16M9/00 ,  F16M11/00 ,  G01J5/02 ,  G01J5/06 ,  G02B7/00

CPC分类号： F16M11/00 ,  G01J5/0205 ,  G01J5/061 ,  G02B7/008 ,  Y10T29/49826

摘要： An apparatus includes a first interface platform and a second interface platform. One interface platform is configured to be coupled to a support structure, and the other interface platform is configured to be coupled to a device that operates at a temperature different than a temperature of the support structure. The apparatus also includes at least one intermediate stage platform and struts connecting the first and second interface platforms to the at least one intermediate stage platform. Top surfaces of the interface platforms may be substantially coplanar. At least a portion of the second interface platform can reside within an opening of the first interface platform. The struts can be arranged in a nested configuration having first and second sets of struts, where the second set is located within the first set. Each strut in the first set could be substantially parallel to an adjacent strut in the second set.