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公开(公告)号：US20200251628A1
公开(公告)日：2020-08-06
申请号：US16394358
申请日：2019-04-25
发明人： Ya-Chin Tu , Hung-Wei Kuo , Yu-Zeng Yang
摘要： A semiconductor light emitting unit and a packaging method of the semiconductor light emitting unit are provided. The packaging method includes the following steps. In a step (a), a transparent substrate is provided. In a step (b), a transparent membrane circuit layer is formed on a surface of the transparent substrate. In a step (c), a semiconductor light emitting chip is formed on the transparent membrane circuit layer by a flip-chip mounting process, so that the semiconductor light emitting chip and the transparent membrane circuit layer are electrically connected with each other. In a step (d), an encapsulant is formed over the semiconductor light emitting chip to cover the semiconductor light emitting chip and a portion of the transparent membrane circuit layer. In a step (e), the encapsulant is baked.
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公开(公告)号：US20230284396A1
公开(公告)日：2023-09-07
申请号：US17727114
申请日：2022-04-22
发明人： Bo-An Chen , Ya-Chin Tu
CPC分类号： H05K5/0017 , H02J50/10 , H02J50/402 , H05K7/20954 , H01L25/0753 , H01L27/156 , G02F1/133603
摘要： A charging device with a displaying function is provided. The charging device includes a display panel and a charging circuit. The display panel includes a substrate, a conductive layer, a spacer structure and at least one light-emitting element. The conductive layer is disposed on the substrate. The conductive layer is divided into at least one first region and at least one second region. The at least one first region and the at least one second region are separated from each other through the spacer structure. The at least one light-emitting element is electrically connected with the at least one first region and the at least one second region. The charging circuit is located under the display panel.
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公开(公告)号：US20220077366A1
公开(公告)日：2022-03-10
申请号：US17082217
申请日：2020-10-28
发明人： Ya-Chin Tu , Hung-Wei Kuo
IPC分类号： H01L33/62 , H01L33/54 , H01L25/075
摘要： A light source module includes a transparent conductive substrate and a light-emitting element. The light-emitting element is installed on the transparent conductive film, and electrically connected with the transparent conductive film. The light-emitting element is flip-chip LED, and/or the light-emitting element is not equipped with a lead frame. Moreover, the present invention further provides a manufacturing method of the light source module.
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公开(公告)号：US11205549B1
公开(公告)日：2021-12-21
申请号：US17165631
申请日：2021-02-02
发明人： Bo-An Chen , Chin-Sung Pan , Ya-Chin Tu
IPC分类号： H01H13/83
摘要： A keycap structure includes a keycap body and a display module. The keycap body includes a top wall and a lateral wall. The lateral wall is extended downwardly from a periphery region of the top wall. An accommodation space is defined by the top wall and the lateral wall collaboratively. The display module is disposed within the accommodation space. The display module includes a light-transmissible circuit substrate and plural light-emitting elements. The plural light-emitting elements are installed on the light-transmissible circuit substrate and electrically connected with the light-transmissible circuit substrate. After the light beams are transmitted through the light-transmissible circuit substrate and the top wall sequentially, the light beams are outputted from the keycap body. The light beams from the plural light-emitting elements are collaboratively formed as a luminous zone. Moreover, a pattern corresponding to the luminous zone is shown on the display module.
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公开(公告)号：US10429059B1
公开(公告)日：2019-10-01
申请号：US16110412
申请日：2018-08-23
发明人： Chung-Yuan Chen , Wei-Chiang Huang , Ming-Hui Yeh , Hung-Wei Kuo , Ya-Chin Tu
IPC分类号： F21V33/00 , F21V3/10 , H05K1/18 , H05K7/20 , F24F13/078 , F21Y115/10
摘要： A cooling fan includes a fan base, an impeller part, a driving part, an illumination circuit board and plural light-emitting elements. The driving part includes a shaft seat, a driving circuit board and plural coils. The driving circuit board is disposed on the fan base. The plural coils are arranged between the driving circuit board and the illumination circuit board and arranged around the shaft seat. The rotating shaft of the impeller part is inserted into the shaft seat. When an electric current flows through the plural coils, the rotating shaft is rotated. The plural light-emitting elements are disposed on the illumination circuit board. When the electric current flows through the plural light-emitting elements, the plural light-emitting elements emit light beams.
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公开(公告)号：US20220069179A1
公开(公告)日：2022-03-03
申请号：US17108857
申请日：2020-12-01
发明人： Ya-Chin Tu , Hung-Wei Kuo
IPC分类号： H01L33/56 , H01L25/075
摘要： A light source module includes a substrate, plural light-emitting elements and an encapsulation structure. The plural light-emitting elements are installed on the substrate. The encapsulation structure is installed on the substrate to cover the plural light-emitting elements. The encapsulation structure is made of a composition containing a polymeric glue material, a white powder material and a black powder material. In the composition, a content of the polymeric glue material is 65%˜99.8% by weight, a content of the white powder material is 0.1%˜20% by weight, and a content of the black powder material is 0.1%˜25% by weight.
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公开(公告)号：US10964860B2
公开(公告)日：2021-03-30
申请号：US16422800
申请日：2019-05-24
发明人： Hung-Wei Kuo , Ya-Chin Tu , Chung-Yuan Chen
摘要： A method of packaging a semiconductor illumination module is provided. The method includes the following steps. In a step (a), a substrate is provided. The substrate is selected from one of a flexible printed circuit board, a metal core circuit board, a printed circuit board or a ceramic printed circuit board. The substrate includes a solder mask layer with an opening, and the opening has a width R. In a step (b), a light-emitting element is installed in the opening. In a step (c), an encapsulant injection device is used to inject a packaging encapsulant into the opening. In a step (d), a sealed lens structure is formed to cover the light-emitting element, wherein the sealed lens structure has a height h.
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公开(公告)号：US20200295243A1
公开(公告)日：2020-09-17
申请号：US16422800
申请日：2019-05-24
发明人： Hung-Wei Kuo , Ya-Chin Tu , Chung-Yuan Chen
摘要： A method of packaging a semiconductor illumination module is provided. The method includes the following steps. In a step (a), a substrate is provided. The substrate is selected from one of a flexible printed circuit board, a metal core circuit board, a printed circuit board or a ceramic printed circuit board. The substrate includes a solder mask layer with an opening, and the opening has a width R. In a step (b), a light-emitting element is installed in the opening. In a step (c), an encapsulant injection device is used to inject a packaging encapsulant into the opening. In a step (d), a sealed lens structure is formed to cover the light-emitting element, wherein the sealed lens structure has a height h.
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公开(公告)号：US20190229229A1
公开(公告)日：2019-07-25
申请号：US16192119
申请日：2018-11-15
发明人： Chung-Yuan Chen , Hung-Wei Kuo , Ya-Chin Tu
IPC分类号： H01L33/00 , H01L25/075 , H01L33/52 , H01L33/44 , H05K1/18
摘要： A light source module includes a LED die, a supporting base and an encapsulation layer. The LED die emits a light beam. The supporting base is electrically connected with the LED die, and supports the LED die. After a portion of the light beam is projected to and reflected by the supporting base, the portion of the light beam is projected to surroundings through the LED die. The encapsulation layer covers the LED die and a portion of the supporting base to protect the LED die. The encapsulation layer includes a light-adjusting element. A characteristic of the light beam is changed through the light-adjusting element.
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