公开(公告)号：US20230112890A1

公开(公告)日：2023-04-13

申请号：US16978842

申请日：2019-08-31

申请人： QING DING PRECISION ELECTRONICS (HUAIAN) CO.,LTD ,  Avary Holding (Shenzhen) Co., Limited.

发明人： HSIAO-TING HSU ,  TAO-MING LIAO ,  MING-JAAN HO ,  XIAN-QIN HU ,  FU-YUN SHEN

IPC分类号： H05K1/02 ,  H05K3/46 ,  H05K3/42

摘要： A method for manufacturing a circuit board with a heat dissipation structure comprises: providing at least one wiring base board, the wiring base board comprising a first conductor layer, an insulation layer, and an alloy layer which are stacked in order, wherein a solder paste layer is formed on a side of the alloy layer, a part of the alloy layer is exposed out of the solder paste layer to form a thermal conductive surface; providing a core layer; and pressing two wiring base boards on two opposite sides of the core layer to form a sealed heat dissipating chamber between the thermal conductive surfaces of the two wiring base boards. The present disclosure further provides a circuit board with a heat dissipation structure.