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公开(公告)号：US20230160764A1
公开(公告)日：2023-05-25
申请号：US18090397
申请日：2022-12-28
发明人： FU-YUN SHEN , HSIAO-TING HSU , MING-JAAN HO
IPC分类号： G01L1/22
CPC分类号： G01L1/2262
摘要： A pressure sensing circuit board includes a dielectric layer, a wiring layer, a strain layer, and a protective layer. The wiring layer is on the dielectric layer. The strain layer is on the dielectric layer having the line layer. The protective layer is on the wiring layer and the strain layer. The pressure sensing circuit board includes a first copper area, a second copper area, and a copper free area. The wiring layer is located in the first copper area and the second copper area. A thickness of the line layer in the first copper area is greater than that in the second copper area, and the wiring layer in the second copper area is mesh-shaped. The strain layer is in the copper free zone and connected to the line layer. The protective layer is on the wiring layer in the second copper area and covers the strain layer.
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公开(公告)号：US20220394859A1
公开(公告)日：2022-12-08
申请号：US17887629
申请日：2022-08-15
发明人： FU-YUN SHEN , MING-JAAN HO , HSIAO-TING HSU , LIN-JIE GAO
摘要： A method for manufacturing a circuit board comprises steps of providing a single-sided board comprising a first insulating base, a copper layer, and at least one first conductive structure; providing a laminated board comprising a metal layer, a third insulating base, a metal shielding layer, and a second insulating base; forming a wiring layer by the metal layer comprising at least one signal wire and at least one connecting pad; defining at least one second through hole each passing through the second insulating base, the metal shielding layer, and the third insulating base; forming a second conductive structure in each second through hole; providing a double-sided board comprising a wiring layer, a fourth insulating base, a first copper foil; and at least one third conductive structure; pressing the single-sided board, at least one middle structure, and the double-sided board in that sequence to form the circuit board.
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公开(公告)号：US20220087020A1
公开(公告)日：2022-03-17
申请号：US17536321
申请日：2021-11-29
发明人： MAN-ZHI PENG , RUI-WU LIU , MING-JAAN HO
摘要： Disclosure provides an adapter board and a method for making the adapter board, which includes providing a mold in which a plurality of first fixing plates and second fixing plates are provided, providing a plurality of wires sequentially passed through the plurality of first fixing plates and the second fixing plate, injecting a non-conductive material into the cavity to form a body, and cutting the body along both sides of the first fixing plates and the second fixing plates to obtain a plurality of board bodies. The first fixing plates are provided with a plurality of first fixing holes, and the second fixing plates are provided with a plurality of second fixing holes. The board body includes a first surface and a second surface. A plurality of first connection pads are formed on the first surface, and a plurality of second connection pads are formed on the second surface.
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公开(公告)号：US20210410295A1
公开(公告)日：2021-12-30
申请号：US17289035
申请日：2020-05-29
发明人： WEN-ZHU WEI , MING-JAAN HO , FU-YUN SHEN , HONG-YAN GUO
摘要： A circuit board includes first circuit substrate and second circuit substrate; first circuit substrate includes: a first base layer arranged on the first circuit layer and a plurality of first conductive bodies on the substrate layer; the first circuit layer includes a hot pressing area and a non-hot pressing area except the hot pressing area. One end of the first conductive body is electrically connected to the hot pressing area and the other end is exposed to the first base layer; second circuit substrate includes: a second base layer, a second base layer arranged on the second circuit layer and a plurality of second conductive bodies; one end of the second conductive body is electrically connected to the second circuit layer, and the other end is exposed on the second base layer; The body is electrically connected to the second conductive body.
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公开(公告)号：US20210235590A1
公开(公告)日：2021-07-29
申请号：US16767870
申请日：2019-04-23
发明人： MING-JAAN HO , XIAN-QIN HU , FU-YUN SHEN , HSIAO-TING HSU , YONG-CHAO WEI
摘要： The disclosure provides a method for manufacturing a circuit board, which includes: (1) providing a substrate, forming a through hole in the substrate; (2) filling the through hole with a conductor to form a conductive hole; (3) providing a peelable film to cover the substrate; (4) forming a groove by laser, the groove including a concave portion; (5) performing a surface treatment on a wall of the groove; (6) removing the peelable film; (7) forming a seed layer; (8) making a circuit layer to obtain a circuit board unit, the circuit layer including a connection pad, the connection pad shaped as a conductive protrusion which surrounds and is electrically connected to the conductor; (9) repeating step (1) to step (8) at least once; and (10) laminating the circuit board units. The disclosure also provides a circuit board.
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公开(公告)号：US20220312655A1
公开(公告)日：2022-09-29
申请号：US17684560
申请日：2022-03-02
发明人： FU-YUN SHEN , MING-JAAN HO , HSIAO-TING HSU
摘要： A method for manufacturing an electromagnetic shielding film comprising providing an insulating layer, wherein the insulating layer is metallized to obtain a silver layer; and painting a conductive adhesive on a surface of the silver layer to form a conductive adhesive layer. The conductive adhesive layer comprises bisphenol A diglycidyl ether with a mass percentage between 9.8% and 10.5%, bisphenol S diglycidyl ether with a mass percentage between 4.54% and 4.86%, bisphenol F diglycidyl ether with a mass percentage between 2.27% and 2.43%, polyamide with a mass percentage between 7.11% and 7.62%, silver copper powder with a mass percentage between 48.6% and 68.3%, and silver strips with a mass percentage between 6.44% and 25.9%.
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公开(公告)号：US20220141948A1
公开(公告)日：2022-05-05
申请号：US17573847
申请日：2022-01-12
发明人： FU-YUN SHEN , WEN-ZHU WEI , MING-JAAN HO
摘要： A method for manufacturing a circuit board comprising: providing an inner circuit substrate board comprising a first transmission area, a bendable area, and a second transmission area which are connected in an order, wherein the inner circuit substrate board further comprises a substrate layer and an inner circuit layer on the substrate layer, the inner circuit layer comprises a first signal circuit; pressing a first outer circuit substrate board on the inner circuit layer; wherein the first outer circuit substrate board comprises a first dielectric layer formed on the inner circuit layer and a first outer circuit layer formed on the first dielectric layer; the first dielectric layer is located in the first transmission area and the second transmission area; two ends of the first signal circuit are electrically connected to the first outer circuit layer.
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公开(公告)号：US20210392758A1
公开(公告)日：2021-12-16
申请号：US17419412
申请日：2019-10-31
发明人： HSIAO-TING HSU , MING-JAAN HO , FU-YUN SHEN , XIAN-QIN HU
摘要： A thin circuit board (100) and a method of manufacturing the same, the thin circuit board (100) includes: a dielectric layer (40); an inner circuit substrate (30); and a metal layer (50) formed on at least one side of the inner circuit substrate (30). The metal layer (450) is covered by the dielectric layer (40). The dielectric layer (40) includes an outermost insulating layer (11) and a bonding structure (20) sandwiched between the inner circuit substrate (30) and the metal layer (50), the metal layer (50) is wrapped by the insulating layer (11) and the bonding structure (20).
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公开(公告)号：US20210345479A1
公开(公告)日：2021-11-04
申请号：US17036563
申请日：2020-09-29
发明人： FU-YUN SHEN , WEN-ZHU WEI , MING-JAAN HO
摘要： A transmission circuit board includes a bendable area, a first transmission areas, and a second transmission areas. The first and second transmission areas are connected to the bendable area. The inner circuit substrate board further includes a substrate layer and an inner circuit layer formed on the substrate layer and including a first signal circuit. The transmission circuit board further includes a first dielectric layer formed on the inner circuit layer, a first outer circuit layer formed on the first dielectric layer, a first protecting layer formed on the first outer circuit layer, and a first shielding layer formed on the first protecting layer. The first dielectric layer lies the first and second transmission areas. Two ends of the first signal circuit are connected to the first outer circuit layer. The first shielding layer is connected to the first outer circuit layer and lies the bendable area.
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公开(公告)号：US20230038731A1
公开(公告)日：2023-02-09
申请号：US17637133
申请日：2020-03-27
发明人： HSIAO-TING HSU , MING-JAAN HO , KATSUMI FUJIWARA , FU-YUN SHEN , FU-WEI ZHONG
摘要： A covering film (100) includes a first covering layer (10), a first adhesive layer (20), and a thermal conductive layer (30) sandwiched between the first covering layer (10) and the first adhesive layer (20). A thermal conductivity of the thermal conductive layer (30) is K1, K1=3˜65 W/m.K. A thermal conductivity of the first covering layer (10) is K2, K2=0.02˜3.0 W/m.K. A thermal conductivity of the first adhesive layer (20) is K3, K3=0.02˜1.0 W/m.K. A circuit board and its manufacturing method are also provided.
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