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公开(公告)号：US20210385939A1
公开(公告)日：2021-12-09
申请号：US17029355
申请日：2020-09-23
发明人： FU-YUN SHEN , XIAN-QIN HU
摘要： A circuit board with reduced dielectric losses enabling the movement of high frequency signals includes an inner circuit board and two outer circuit boards. The inner circuit board includes a first conductor layer and a first substrate layer. The first conductor layer includes a signal line and two ground lines on both sides of the signal line. The first substrate layer covers a side of the first conductor layer and defines first through holes which expose the signal line. Each outer circuit board includes a second substrate layer and a second conductor layer. The second substrate layer abuts the inner circuit board and defines second through holes which are not aligned with the first through holes, partially surrounding the signal line with air which has a very low dielectric constant. A method for manufacturing the high-frequency circuit board is also disclosed.
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公开(公告)号：US20210235590A1
公开(公告)日：2021-07-29
申请号：US16767870
申请日：2019-04-23
发明人： MING-JAAN HO , XIAN-QIN HU , FU-YUN SHEN , HSIAO-TING HSU , YONG-CHAO WEI
摘要： The disclosure provides a method for manufacturing a circuit board, which includes: (1) providing a substrate, forming a through hole in the substrate; (2) filling the through hole with a conductor to form a conductive hole; (3) providing a peelable film to cover the substrate; (4) forming a groove by laser, the groove including a concave portion; (5) performing a surface treatment on a wall of the groove; (6) removing the peelable film; (7) forming a seed layer; (8) making a circuit layer to obtain a circuit board unit, the circuit layer including a connection pad, the connection pad shaped as a conductive protrusion which surrounds and is electrically connected to the conductor; (9) repeating step (1) to step (8) at least once; and (10) laminating the circuit board units. The disclosure also provides a circuit board.
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公开(公告)号：US20210119222A1
公开(公告)日：2021-04-22
申请号：US16699966
申请日：2019-12-02
发明人： XIAN-QIN HU , HSIAO-TING HSU
IPC分类号： H01M4/66 , H01M4/139 , H01M4/74 , H01M10/0525 , H01M10/0585
摘要： A flexible battery assembly includes a positive plate, a first filling film, a separator, a second filling film, and a negative plate stacked in order. The positive plate includes a first insulating layer, spaced first current collectors, and a positive electrode active layer. The negative plate includes a second insulating layer, spaced second current collectors, and a negative electrode active layer. Each first current collector corresponds to one second current collector. The first filling film comprises first openings each corresponding to one first current collector, and the first current collectors are embedded in the first openings. The second filling film comprises second openings each corresponding to one second current collector, and the second current collectors are embedded in the second openings. An electrolyte is sealed in the first openings and the second openings. A method for manufacturing such flexible battery assembly is also disclosed.
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公开(公告)号：US20210392758A1
公开(公告)日：2021-12-16
申请号：US17419412
申请日：2019-10-31
发明人： HSIAO-TING HSU , MING-JAAN HO , FU-YUN SHEN , XIAN-QIN HU
摘要： A thin circuit board (100) and a method of manufacturing the same, the thin circuit board (100) includes: a dielectric layer (40); an inner circuit substrate (30); and a metal layer (50) formed on at least one side of the inner circuit substrate (30). The metal layer (450) is covered by the dielectric layer (40). The dielectric layer (40) includes an outermost insulating layer (11) and a bonding structure (20) sandwiched between the inner circuit substrate (30) and the metal layer (50), the metal layer (50) is wrapped by the insulating layer (11) and the bonding structure (20).
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公开(公告)号：US20210399397A1
公开(公告)日：2021-12-23
申请号：US16916296
申请日：2020-06-30
发明人： HSIAO-TING HSU , MING-JAAN HO , XIAN-QIN HU , FU-YUN SHEN
摘要： A high-frequency signal transmission structure capable of transmitting high frequency signals with reduced attenuation includes a first wiring board and a second wiring board. The first wiring board includes a first conductor layer, a second conductor layer, and a first base film layer sandwiched between the first conductor layer and the second conductor layer. The second wiring board includes a second base film layer and a third conductor layer. the second base film layer covers the surface of the first conductor layer facing away from the first base film layer. The first base film layer and the second base film layer surround the first conductor layer and both include an aerogel film layer having an air to gel ratio by volume of 80-99%. A method for manufacturing the high-frequency signal transmission structure is also disclosed.
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公开(公告)号：US20220078922A1
公开(公告)日：2022-03-10
申请号：US17527320
申请日：2021-11-16
发明人： MING-JAAN HO , XIAN-QIN HU , FU-YUN SHEN , HSIAO-TING HSU , YONG-CHAO WEI
摘要： A circuit board includes at least two circuit board units stacked together. Each circuit board unit includes a substrate and a circuit layer. The substrate defines a conductive hole penetrating therethrough. The conductive hole provided with a conductor therein. One side of the substrate further defines a groove, the groove including a concave portion aligned with the conductive hole. The circuit layer includes a connection pad located in the concave portion. The connection pad is shaped as a conductive protrusion, which surrounds and is electrically connected to the conductor. The circuit layer is located in the groove, and the conductive hole is electrically connecting the circuit layers of the circuit board units.
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公开(公告)号：US20220069438A1
公开(公告)日：2022-03-03
申请号：US17027936
申请日：2020-09-22
发明人： ZI-QIANG GAO , CHIH-WEN CHENG , KE HE , XIAN-QIN HU
摘要： A method for manufacturing an antenna printed circuit board includes the following steps: providing a flexible-rigid printed circuit board comprising a flexible region and a rigid region. The flexible region comprises at least one first connecting pad and at least one second connecting pad arranged opposite sides of the rigid region. At least one antenna module is attached to the first connecting pad through a conductive paste. The antenna module is fixed on the rigid region by a first reflow soldering process. At least one radio frequency integrated circuit structure is attached to the second connecting pad through a conductive paste. The radio frequency integrated circuit is fixed on the rigid region by a second reflow soldering process. A gap between the antenna module and the rigid region and a gap between the radio frequency integrated circuit structure and the rigid region are filled with dielectric materials and cured.
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公开(公告)号：US20210059058A1
公开(公告)日：2021-02-25
申请号：US16583567
申请日：2019-09-26
发明人： HSIAO-TING HSU , MING-JAAN HO , XIAN-QIN HU , FU-YUN SHEN , WEN-ZHU WEI
摘要： A multilayer circuit board includes a first connecting wiring board comprising a first bonding layer and a liquid crystal polymer formed on the first bonding layer. The first bonding layer comprises a first insulating filler. A fusion temperature of the first bonding layer is less than a fusion temperature of the liquid crystal polymer. The multilayer circuit board further includes a first wiring board and a second wiring board disposed on opposite sides of the first connecting wiring board. The first wiring board is combined with the first bonding layer. A method for manufacturing such multilayer circuit board is also provided.
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公开(公告)号：US20230112890A1
公开(公告)日：2023-04-13
申请号：US16978842
申请日：2019-08-31
发明人： HSIAO-TING HSU , TAO-MING LIAO , MING-JAAN HO , XIAN-QIN HU , FU-YUN SHEN
摘要： A method for manufacturing a circuit board with a heat dissipation structure comprises: providing at least one wiring base board, the wiring base board comprising a first conductor layer, an insulation layer, and an alloy layer which are stacked in order, wherein a solder paste layer is formed on a side of the alloy layer, a part of the alloy layer is exposed out of the solder paste layer to form a thermal conductive surface; providing a core layer; and pressing two wiring base boards on two opposite sides of the core layer to form a sealed heat dissipating chamber between the thermal conductive surfaces of the two wiring base boards. The present disclosure further provides a circuit board with a heat dissipation structure.
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公开(公告)号：US20230047768A1
公开(公告)日：2023-02-16
申请号：US17979150
申请日：2022-11-02
发明人： YING-QIU ZHENG , CHAO PENG , XIAN-QIN HU
摘要： A method for manufacturing a circuit board with narrow conductive traces and narrow spaces between traces includes a base layer and two first wiring layers disposed on opposite surfaces of the base layer. Each first wiring layer includes a first bottom wiring and a first electroplated copper wiring. The first bottom wiring is formed on the base layer. The first bottom wiring includes a first end facing the base layer, a second end opposite to the first end, and a first sidewall connecting the first end and the second end. The first electroplated copper wiring covers the second end and the first sidewall of the first bottom wiring.
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