公开(公告)号：US20140196940A1

公开(公告)日：2014-07-17

申请号：US13777298

申请日：2013-02-26

Applicant: QUALCOMM INCORPORATED

Inventor： Christopher J. Healy ,  Gopal C. Jha ,  Manuel Aldrete

IPC: H05K1/02 ,  H05K3/40

CPC classification number: H05K1/0271 ,  H01L21/56 ,  H01L23/3157 ,  H01L23/49816 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/10145 ,  H01L2224/1191 ,  H01L2224/13021 ,  H01L2224/13022 ,  H01L2224/131 ,  H01L2224/81193 ,  H01L2224/81815 ,  H01L2924/12042 ,  H01L2924/3841 ,  H05K3/4038 ,  H05K2201/0305 ,  Y10T29/49165 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Improved Molded Laser Package (MLP) Packages which include a relief path for pressure and reduces the risk of shorting adjacent solder balls are provided. The MLP packages may include a gutter integrally connected to one or more through mold vias allowing a path to relieve pressure created when moisture gets entrapped in through mold vias, during the manufacturing process, while also reducing the risk of solder shorts between adjacent solder balls located in the through mold vias. Additionally, MLP packages which include gutters integrally connected to one or more through mold vias may enable tighter bump pitch and thinner packages. As a result, process margins and risks associated with surface mount technology (SMT) may be improved and provide more flexibility on inventory staging.

Abstract translation: 改进的模制激光封装（MLP）提供了包括压力释放路径和降低相邻焊球短路风险的封装。 MLP包装可以包括一个整体地连接到一个或多个通过模具通孔的沟槽，允许在制造过程期间通过模具通道将水分截留时产生的压力减小的路径，同时还降低相邻焊球之间的焊料短路的风险 在通孔中通孔。 此外，包括整体连接到一个或多个通过模具通孔的沟槽的MLP封装可以实现更紧密的突起间距和更薄的封装。 因此，可能会提高与表面贴装技术（SMT）相关的工艺余量和风险，并为库存阶段提供更大的灵活性。

公开(公告)号：US09313881B2

公开(公告)日：2016-04-12

申请号：US13777298

申请日：2013-02-26

Applicant: Qualcomm Incorporated

Inventor： Christopher J. Healy ,  Gopal C. Jha ,  Manuel Aldrete

IPC: H05K1/11 ,  H05K1/02 ,  H05K3/40 ,  H01L23/31 ,  H01L23/498 ,  H01L23/00 ,  H01L21/56

CPC classification number: H05K1/0271 ,  H01L21/56 ,  H01L23/3157 ,  H01L23/49816 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/10145 ,  H01L2224/1191 ,  H01L2224/13021 ,  H01L2224/13022 ,  H01L2224/131 ,  H01L2224/81193 ,  H01L2224/81815 ,  H01L2924/12042 ,  H01L2924/3841 ,  H05K3/4038 ,  H05K2201/0305 ,  Y10T29/49165 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Improved Molded Laser Package (MLP) Packages which include a relief path for pressure and reduces the risk of shorting adjacent solder balls are provided. The MLP packages may include a gutter integrally connected to one or more through mold vias allowing a path to relieve pressure created when moisture gets entrapped in through mold vias, during the manufacturing process, while also reducing the risk of solder shorts between adjacent solder balls located in the through mold vias. Additionally, MLP packages which include gutters integrally connected to one or more through mold vias may enable tighter bump pitch and thinner packages. As a result, process margins and risks associated with surface mount technology (SMT) may be improved and provide more flexibility on inventory staging.

Abstract translation: 改进的模制激光封装（MLP）提供了包括压力释放路径和降低相邻焊球短路风险的封装。 MLP包装可以包括一个整体地连接到一个或多个通过模具通孔的沟槽，允许在制造过程期间通过模具通道将水分截留时产生的压力减小的路径，同时还降低相邻焊球之间的焊料短路的风险 在通孔中通孔。 此外，包括整体连接到一个或多个通过模具通孔的沟槽的MLP封装可以实现更紧密的突起间距和更薄的封装。 因此，可能会提高与表面贴装技术（SMT）相关的工艺余量和风险，并为库存阶段提供更大的灵活性。