公开(公告)号：US20180210522A1

公开(公告)日：2018-07-26

申请号：US15411868

申请日：2017-01-20

Applicant: QUALCOMM INCORPORATED

Inventor： PALKESH JAIN ,  RONALD ALTON ,  JON ANDERSON ,  MEHDI SAEIDI

IPC: G06F1/20 ,  G06F9/48 ,  G06F1/32

Abstract: Various embodiments of methods and systems context-aware thermal management in a portable computing device (“PCD”) are disclosed. Notably, the environmental context to which a PCD is subjected may have significant impact on the PCD's thermal energy dissipation efficiency. Embodiments of the solution seek to leverage knowledge of a PCD's environmental context to modify or adjust thermal policy parameters applied within a PCD in response to a thermal event within the PCD.