公开(公告)号：US20170308637A1

公开(公告)日：2017-10-26

申请号：US15136512

申请日：2016-04-22

Applicant: QUALCOMM INCORPORATED

Inventor： PALKESH JAIN ,  MANOJ MEHROTRA

IPC: G06F17/50

CPC classification number: G06F17/5081 ,  G06F17/5036 ,  G06F17/5068 ,  G06F17/5072 ,  G06F2217/80

Abstract: Implementations for probabilistic thermal hotspot accommodation are disclosed herein. In an example aspect, a cell library includes cells having respective leakage current characteristics that include a leakage current variability as well as a leakage current average. In another example aspect, a method obtains cell attribute collections for respective types of multiple cells, with each of the cell attribute collections including a leakage current average and a leakage current variability corresponding to a circuit device of a respective type of cell. The method also obtains an integrated circuit design that describes how multiple circuit devices are interconnected. The method then performs a thermal analysis of the integrated circuit design using the cell attribute collections for the respective types of multiple cells including at least the leakage current variability and the leakage current average.

公开(公告)号：US20180210522A1

公开(公告)日：2018-07-26

申请号：US15411868

申请日：2017-01-20

Applicant: QUALCOMM INCORPORATED

Inventor： PALKESH JAIN ,  RONALD ALTON ,  JON ANDERSON ,  MEHDI SAEIDI

IPC: G06F1/20 ,  G06F9/48 ,  G06F1/32

Abstract: Various embodiments of methods and systems context-aware thermal management in a portable computing device (“PCD”) are disclosed. Notably, the environmental context to which a PCD is subjected may have significant impact on the PCD's thermal energy dissipation efficiency. Embodiments of the solution seek to leverage knowledge of a PCD's environmental context to modify or adjust thermal policy parameters applied within a PCD in response to a thermal event within the PCD.