公开(公告)号：US20190164681A1

公开(公告)日：2019-05-30

申请号：US15826735

申请日：2017-11-30

Applicant: QUALCOMM Incorporated

Inventor： Donald William KIDWELL, JR. ,  Ravindra Vaman SHENOY ,  Alan LEWIS ,  Christopher Feuling FERGUSON

IPC: H01F27/28 ,  H01F27/32 ,  H01F27/24 ,  H01F41/04 ,  H01F41/12 ,  H05K1/18 ,  H01L23/498 ,  H01L23/64 ,  H01L23/00

Abstract: Some aspects pertain to an inductor apparatus that includes a first metal layer including a plurality of first interconnects, a second metal including a plurality of second interconnects, a first dielectric layer between the first metal layer and the second metal layer, and an inductor. The inductor includes a plurality of vias, where the plurality of vias are configured to couple the plurality of first interconnects to the plurality of second interconnects. The inductor includes a plurality of inductor loops formed by the plurality of vias, the plurality of first interconnects and the plurality of second interconnects. The inductor further includes a first magnetic layer and a second magnetic layer, located between the first interconnects and the second interconnects; and a third magnetic layer and an optional fourth magnetic layer outside of the plurality of inductor loops.

公开(公告)号：US20200303325A1

公开(公告)日：2020-09-24

申请号：US16359319

申请日：2019-03-20

Applicant: QUALCOMM Incorporated

Inventor： Alan LEWIS ,  Zhengming FU ,  Nan CHEN ,  Adam POLAK ,  Laura FUENTES ,  Gregory BULLARD ,  Mark TODOROVICH

IPC: H01L23/00 ,  G06F21/75 ,  H01L27/144

Abstract: Various embodiments include integrated approaches to detecting attempts to breach system-level or chip-level security using photo-generated currents induced by lasers or other radiation sources. Various embodiments integrate photo-detection circuits with a secure processor or other circuit in such a manner that the response to a security attack is fast enough to prevent loss of secure or private information are described. Various embodiments include circuits capable of providing a permanent record of photocurrent detection.

公开(公告)号：US20230352426A1

公开(公告)日：2023-11-02

申请号：US18338928

申请日：2023-06-21

Applicant: QUALCOMM Incorporated

Inventor： Alan LEWIS ,  Zhengming FU ,  Nan CHEN ,  Adam Cezary POLAK ,  Laura FUENTES ,  Gregory BULLARD ,  Mark TODOROVICH

IPC: H01L23/00 ,  H01L27/144 ,  G06F21/75

CPC classification number: H01L23/576 ,  H01L27/1443 ,  G06F21/755

Abstract: Various embodiments include integrated approaches to detecting attempts to breach system-level or chip-level security using photo-generated currents induced by lasers or other radiation sources. Various embodiments integrate photo-detection circuits with a secure processor or other circuit in such a manner that the response to a security attack is fast enough to prevent loss of secure or private information are described. Various embodiments include circuits capable of providing a permanent record of photocurrent detection.

公开(公告)号：US20220238460A1

公开(公告)日：2022-07-28

申请号：US17494747

申请日：2021-10-05

Applicant: QUALCOMM Incorporated

Inventor： Alan LEWIS ,  Zhengming FU ,  Nan CHEN ,  Adam POLAK ,  Laura FUENTES ,  Gregory BULLARD ,  Mark TODOROVICH

IPC: H01L23/00 ,  H01L27/144 ,  G06F21/75

Abstract: Various embodiments include integrated approaches to detecting attempts to breach system-level or chip-level security using photo-generated currents induced by lasers or other radiation sources. Various embodiments integrate photo-detection circuits with a secure processor or other circuit in such a manner that the response to a security attack is fast enough to prevent loss of secure or private information are described. Various embodiments include circuits capable of providing a permanent record of photocurrent detection.