公开(公告)号：US20240203820A1

公开(公告)日：2024-06-20

申请号：US18085284

申请日：2022-12-20

Applicant: QUALCOMM Incorporated

Inventor： Youmin YU ,  Wei WU ,  Guoping XU ,  Nader NIKFAR

IPC: H01L23/42 ,  H01L23/04 ,  H01L23/498 ,  H01L25/16

CPC classification number: H01L23/42 ,  H01L23/041 ,  H01L23/49822 ,  H01L25/165

Abstract: A package comprising a substrate, a first integrated device coupled to a first surface of the substrate, a lid structure coupled to the substrate, where the lid structure includes a first compartment comprising a side surface and an inner top surface, and a thermal interface material coupled to (i) the first integrated device and (ii) the side surface and the inner top surface of the first compartment of the lid structure. The substrate includes at least one dielectric layer and a plurality of interconnects.