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公开(公告)号:US20190132942A1
公开(公告)日:2019-05-02
申请号:US15798071
申请日:2017-10-30
Applicant: QUALCOMM Incorporated
Inventor: Changhan Hobie YUN , Jonghae KIM , Xiaoju YU , Mario Francisco VELEZ , Wei-Chuan CHEN , Niranjan Sunil MUDAKATTE , Matthew Michael NOWAK , Christian HOFFMANN , Rodrigo PACHER FERNANDES , Manuel HOFER , Peter BAINSCHAB , Edgar SCHMIDHAMMER , Stefan Leopold HATZL
CPC classification number: H05K1/0233 , H03H3/02 , H03H3/08 , H03H9/02086 , H03H9/0547 , H03H9/1014 , H03H9/1071 , H05K3/32
Abstract: A passive on glass (POG) on filter capping apparatus may include an acoustic filter die. The apparatus may further include a capping die electrically coupled to the acoustic filter die. The capping die may include a 3D inductor.