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公开(公告)号:US09245971B2
公开(公告)日:2016-01-26
申请号:US14040366
申请日:2013-09-27
Applicant: QUALCOMM Incorporated
Inventor: Bin Yang , P R Chidambaram , John Jianhong Zhu , Jihong Choi , Da Yang , Ravi Mahendra Todi , Giridhar Nallapati , Chock Hing Gan , Ming Cai , Samit Sengupta
IPC: H01L29/66 , H01L29/778 , H01L21/8238
CPC classification number: H01L29/66431 , H01L21/823807 , H01L21/823814 , H01L29/1054 , H01L29/165 , H01L29/4966 , H01L29/517 , H01L29/66545 , H01L29/6659 , H01L29/66621 , H01L29/66636 , H01L29/66651 , H01L29/778 , H01L29/7834
Abstract: In a particular embodiment, a semiconductor device includes a high mobility channel between a source region and a drain region. The high mobility channel extends substantially a length of a gate. The semiconductor device also includes a doped region extending from the source region or the drain region toward the high mobility channel. A portion of a substrate is positioned between the doped region and the high mobility channel.
Abstract translation: 在特定实施例中,半导体器件包括源极区和漏极区之间的高迁移率沟道。 高迁移率通道基本上延伸了一个门的长度。 半导体器件还包括从源极区域或漏极区域向高迁移率通道延伸的掺杂区域。 衬底的一部分位于掺杂区域和高迁移率通道之间。
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公开(公告)号:US20150091060A1
公开(公告)日:2015-04-02
申请号:US14040366
申请日:2013-09-27
Applicant: QUALCOMM Incorporated
Inventor: Bin Yang , PR Chidambaram , John Jianhong Zhu , Jihong Choi , Da Yang , Ravi Mahendra Todi , Giridhar Nallapati , Chock Hing Gan , Ming Cai , Samit Sengupta
IPC: H01L29/66 , H01L29/778
CPC classification number: H01L29/66431 , H01L21/823807 , H01L21/823814 , H01L29/1054 , H01L29/165 , H01L29/4966 , H01L29/517 , H01L29/66545 , H01L29/6659 , H01L29/66621 , H01L29/66636 , H01L29/66651 , H01L29/778 , H01L29/7834
Abstract: In a particular embodiment, a semiconductor device includes a high mobility channel between a source region and a drain region. The high mobility channel extends substantially a length of a gate. The semiconductor device also includes a doped region extending from the source region or the drain region toward the high mobility channel. A portion of a substrate is positioned between the doped region and the high mobility channel
Abstract translation: 在特定实施例中,半导体器件包括源极区和漏极区之间的高迁移率沟道。 高迁移率通道基本上延伸了一个门的长度。 半导体器件还包括从源极区域或漏极区域向高迁移率通道延伸的掺杂区域。 衬底的一部分位于掺杂区域和高迁移率通道之间
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