公开(公告)号：US12206155B2

公开(公告)日：2025-01-21

申请号：US18189684

申请日：2023-03-24

Applicant: QUALCOMM Incorporated

Inventor： Kai Liu ,  Jonghae Kim ,  Jui-Yi Chiu ,  Nosun Park ,  Je-Hsiung Lan

IPC: H01P7/10 ,  H01P7/06 ,  H01P11/00 ,  H03B5/12

Abstract: In an aspect, an apparatus is disclosed that includes a surface-mounted integrated circuit package housing an active oscillator circuit; an integrated ceramic resonator formed from a ceramic substrate having an upper planar surface receiving the surface-mounted integrated circuit package, the integrated ceramic resonator including a plurality of conductive walls forming a conductive periphery of a ceramic cavity in the ceramic substrate, a conductive rod extending vertically into the ceramic cavity, wherein the conductive rod is isolated from contact with the conductive periphery of the ceramic cavity, a first conductive material extending vertically through the upper planar surface of the ceramic substrate for connecting the conductive periphery of the ceramic cavity to the surface-mounted integrated circuit package housing the active oscillator circuit; and a second conductive material extending through the upper planar surface of the ceramic substrate for connecting the conductive rod to the surface-mounted integrated circuit package.

公开(公告)号：US12273095B2

公开(公告)日：2025-04-08

申请号：US17245901

申请日：2021-04-30

Applicant: QUALCOMM Incorporated

Inventor： Kai Liu ,  Rui Tang ,  Changhan Hobie Yun ,  Mario Francisco Velez ,  Jonghae Kim

IPC: H03H3/02 ,  H01P1/203 ,  H03H9/05 ,  H03H9/54

Abstract: Aspects of the disclosure are directed to a bandpass filter including a first, second, third and fourth resonators, wherein the second and third resonators are in parallel, wherein the first resonator includes a first and second terminals, wherein the second resonator includes a second resonator top terminal and a second resonator bottom terminal, wherein the third resonator includes a third resonator top terminal and a third resonator bottom terminal, wherein the fourth resonator includes a third terminal and a fourth terminal; wherein the first terminal is coupled to the second resonator top terminal, wherein the second terminal is coupled to the third resonator top terminal, wherein the third terminal is coupled to the third resonator bottom terminal, wherein the fourth terminal is coupled to the second resonator bottom terminal; a first inductor coupled to the first and third terminals; and a second inductor coupled to the second and fourth terminals.

公开(公告)号：US20250113111A1

公开(公告)日：2025-04-03

申请号：US18729040

申请日：2022-03-21

Applicant: QUALCOMM Incorporated

Inventor： Kai Liu ,  Wen-Chun Feng ,  Zhongshan Wang ,  Chung-Yan Chih

IPC: H04N25/61 ,  G06T7/20 ,  H04N23/71 ,  H04N23/75

Abstract: This disclosure provides systems, methods, and devices for image processing that support enhanced variable aperture (VA) camera operations. In a first aspect, a method of image processing includes determining first image statistics for first image data representing a first scene captured at a first aperture; and determining whether the first image data satisfies a first criteria. When the first image data satisfies the first criteria, the image processing includes determining an updated lens shading correction (LSC) corresponding to the first aperture based on the first image statistics and on a current LSC corresponding to the first aperture; and determining a first output image frame based on the updated LSC and the first image data. Other aspects and features are also claimed and described.

公开(公告)号：US12155373B2

公开(公告)日：2024-11-26

申请号：US17450847

申请日：2021-10-14

Applicant: QUALCOMM Incorporated

Inventor： Kai Liu ,  Je-Hsiung Lan ,  Jonghae Kim

IPC: H03H9/54 ,  H03H3/02 ,  H03H9/05 ,  H10N30/071

Abstract: Disclosed is a radio frequency (RF) filter that vertically integrates an acoustic die with inductors formed in one or more layers above the acoustic die. The acoustic die may be over-molded so that the acoustic dome, important for maintaining acoustic integrity, may be protected.

公开(公告)号：US11121699B2

公开(公告)日：2021-09-14

申请号：US16279902

申请日：2019-02-19

Applicant: QUALCOMM Incorporated

Inventor： Kai Liu ,  Rui Tang ,  Changhan Hobie Yun ,  Mario Francisco Velez ,  Jonghae Kim

IPC: H03H9/54 ,  H03H9/05 ,  H03H3/02 ,  H01P1/203

Abstract: Aspects of the disclosure are directed to a bandpass filter including a first, second, third and fourth resonators, wherein the second and third resonators are in parallel, wherein the first resonator includes a first and second terminals, wherein the second resonator includes a second resonator top terminal and a second resonator bottom terminal, wherein the third resonator includes a third resonator top terminal and a third resonator bottom terminal, wherein the fourth resonator includes a third terminal and a fourth terminal; wherein the first terminal is coupled to the second resonator top terminal, wherein the second terminal is coupled to the third resonator top terminal, wherein the third terminal is coupled to the third resonator bottom terminal, wherein the fourth terminal is coupled to the second resonator bottom terminal; a first inductor coupled to the first and third terminals; and a second inductor coupled to the second and fourth terminals.

公开(公告)号：US10741702B2

公开(公告)日：2020-08-11

申请号：US16154021

申请日：2018-10-08

Applicant: QUALCOMM Incorporated

Inventor： Xia Li ,  Bin Yang ,  Kai Liu

IPC: H01L29/94 ,  H01L27/13 ,  H01L49/02 ,  H01L23/522 ,  H01L29/786 ,  H01L23/00 ,  H01L23/532

Abstract: Certain aspects of the present disclosure provide a variable transistor-based capacitive element implemented on a glass or dielectric substrate. Such a variable transistor-based capacitive element may be suitable for use as a tunable capacitor in a passive-on-glass (POG) device, for example. One example device having a tunable capacitance generally includes a glass or dielectric substrate and a transistor disposed above the glass or dielectric substrate. The transistor has a gate region, a drain region, and a source region, wherein a capacitance of the transistor is configured to vary based on a voltage between the gate region and the drain region.

公开(公告)号：US20240267634A1

公开(公告)日：2024-08-08

申请号：US18166227

申请日：2023-02-08

Applicant: QUALCOMM Incorporated

Inventor： Wei-Te Chang ,  Yi-Chun Hsu ,  Kai Liu ,  Wei-Chih Liu ,  Wen-Chun Feng

IPC: H04N23/81 ,  H04N23/11

CPC classification number: H04N23/81 ,  H04N23/11

Abstract: This disclosure provides systems, methods, and devices for image signal processing that support compensating for a diffraction pattern in an image. The diffraction pattern results from blades of a variable aperture of a camera used to capture the image. In a first aspect, a method of image processing includes receiving, by a processor, first image data; determining, by the processor, a characteristic of the first image data correlated with a color temperature of the first image data; determining, by the processor, a compensation matrix based on whether the characteristic exceeds a predetermined threshold, wherein the compensation matrix comprises correction values for reducing red channel peaks in the first image data; and determining, with the computing device, corrected image data based on the first image data and on the compensation matrix. Other aspects and features are also claimed and described.

公开(公告)号：US11757423B2

公开(公告)日：2023-09-12

申请号：US17353420

申请日：2021-06-21

Applicant: QUALCOMM Incorporated

Inventor： Kai Liu ,  Chunhu Zhang ,  Chenliang Du

IPC: H03H7/01 ,  H03H9/02 ,  H03H9/64 ,  G10K11/36

CPC classification number: H03H7/0161 ,  H03H9/02007 ,  H03H9/6406 ,  G10K11/36

Abstract: Disclosed is a radio frequency (RF) filter that vertically integrates an acoustic wave filter with an integrated passive device (IPD) filter. The acoustic wave filter provides selectivity at fundamental frequency band while the IPD filter provides rejection at harmonic frequency bands.

公开(公告)号：US11727537B1

公开(公告)日：2023-08-15

申请号：US17656361

申请日：2022-03-24

Applicant: QUALCOMM Incorporated

Inventor： Wen-Chun Feng ,  Hui Shan Kao ,  Kai Liu

IPC: G06T5/00 ,  G06T5/50 ,  G06T7/55

CPC classification number: G06T5/002 ,  G06T5/50 ,  G06T7/55 ,  G06T2207/20081

Abstract: This disclosure provides systems, methods, and devices for image processing that support enhanced image effects, such as bokeh effect, applied in image processing. In a first aspect, a method of image processing includes determining a depth map corresponding to the first scene based on first image data and second image data captured at different aperture sizes; determining a focus map based on the depth map and a simulated aperture size different from the first aperture size and the second aperture size; and determining an output image frame based on the focus map, the first image data, and the second image data. Other aspects and features are also claimed and described.

公开(公告)号：US10923436B2

公开(公告)日：2021-02-16

申请号：US16362951

申请日：2019-03-25

Applicant: QUALCOMM Incorporated

Inventor： Bin Yang ,  Kai Liu ,  Xia Li

IPC: H01L23/00 ,  H01L25/16 ,  H01L23/498 ,  H04W88/02 ,  H04W88/08

Abstract: Certain aspects of the present disclosure provide apparatus for thermal matching of integrated circuits (ICs). One example apparatus generally includes a first substrate, a first IC disposed on the first substrate and having a second substrate, and a second IC disposed on the first substrate. The second IC may include a third substrate, a thermal conductivity adjustment region comprising different material than the third substrate, the thermal conductivity adjustment region being adjacent to a first side of the third substrate, and one or more electrical components formed in one or more layers of the second IC adjacent to a second side of the third substrate, wherein the first side and the second side are opposite sides of the third substrate, and wherein a thermal conductivity of the thermal conductivity adjustment region is closer to a thermal conductivity of the second substrate than a thermal conductivity of the third substrate.