公开(公告)号：US20180198428A1

公开(公告)日：2018-07-12

申请号：US15400078

申请日：2017-01-06

Applicant: QUALCOMM Incorporated

Inventor： Bassel HANAFI ,  Sherif ABDELHALEM ,  Hasnain LAKDAWALA

IPC: H03G1/00 ,  H03F3/19 ,  H03F3/21 ,  H03F1/02

CPC classification number: H03G1/0005 ,  H03F1/0205 ,  H03F1/223 ,  H03F1/56 ,  H03F3/19 ,  H03F3/193 ,  H03F3/21 ,  H03F3/211 ,  H03F3/245 ,  H03F3/265 ,  H03F3/68 ,  H03F3/72 ,  H03F2200/111 ,  H03F2200/213 ,  H03F2200/222 ,  H03F2200/231 ,  H03F2200/294 ,  H03F2200/42 ,  H03F2200/451 ,  H03F2200/546 ,  H03G3/3042

Abstract: Certain aspects of the present disclosure generally relate to a multi-output amplifier implemented using a capacitive attenuator. For example, the multi-output amplifier generally includes a first capacitive attenuator coupled to an input node of the multi-output amplifier. In certain aspects, the multi-output amplifier also includes a first amplification stage having an input coupled to a tap node of the first capacitive attenuator and an output coupled to a first output node of the multi-output amplifier, and a second amplification stage having an output coupled to a second output node of the multi-output amplifier. For certain aspects, the multi-output amplifier includes a second capacitive attenuator coupled to the input node of the multi-output amplifier, and the second amplification stage may have an input coupled to a tap node of the second capacitive attenuator.