公开(公告)号：US09329646B2

公开(公告)日：2016-05-03

申请号：US14221171

申请日：2014-03-20

Applicant: QUALCOMM Incorporated

Inventor： Victor Adrian Chiriac ,  Youmin Yu ,  Dexter Tamio Chun ,  Stephen Arthur Molloy

IPC: G06F1/20 ,  F28F21/00 ,  H05K7/20

CPC classification number: G06F1/20 ,  F28F21/00 ,  H05K7/20445

Abstract: Some implementations provide a multi-layer heat dissipating device that includes a first heat spreader layer, a first support structure, and a second heat spreader layer. The first heat spreader layer includes a first spreader surface and a second spreader surface. The first support structure includes a first support surface and a second support surface. The first support surface of the first support structure is coupled to the second spreader surface of the first heat spreader. The second heat spreader layer includes a third spreader surface and a fourth spreader surface. The third spreader surface of the second heat spreader layer is coupled to the second support surface of the first support structure. In some implementations, the first support structure is a thermally conductive adhesive layer. In some implementations, the first heat spreader layer has a first thermal conductivity, and the first support structure has a second thermal conductivity.

Abstract translation: 一些实施方案提供了一种多层散热装置，其包括第一散热器层，第一支撑结构和第二散热器层。 第一散热器层包括第一撒布机表面和第二撒布机表面。 第一支撑结构包括第一支撑表面和第二支撑表面。 第一支撑结构的第一支撑表面联接到第一散热器的第二扩张器表面。 第二散热器层包括第三扩散器表面和第四扩散器表面。 第二散热器层的第三扩散器表面联接到第一支撑结构的第二支撑表面。 在一些实施方案中，第一支撑结构是导热粘合剂层。 在一些实施方案中，第一散热器层具有第一导热性，并且第一支撑结构具有第二导热性。

公开(公告)号：US20150268704A1

公开(公告)日：2015-09-24

申请号：US14221171

申请日：2014-03-20

Applicant: QUALCOMM Incorporated

Inventor： Victor Adrian Chiriac ,  Youmin Yu ,  Dexter Tamio Chun ,  Stephen Arthur Molloy

IPC: G06F1/20 ,  F28F21/00

CPC classification number: G06F1/20 ,  F28F21/00 ,  H05K7/20445

Abstract: Some implementations provide a multi-layer heat dissipating device that includes a first heat spreader layer, a first support structure, and a second heat spreader layer. The first heat spreader layer includes a first spreader surface and a second spreader surface. The first support structure includes a first support surface and a second support surface. The first support surface of the first support structure is coupled to the second spreader surface of the first heat spreader. The second heat spreader layer includes a third spreader surface and a fourth spreader surface. The third spreader surface of the second heat spreader layer is coupled to the second support surface of the first support structure. In some implementations, the first support structure is a thermally conductive adhesive layer. In some implementations, the first heat spreader layer has a first thermal conductivity, and the first support structure has a second thermal conductivity.

Abstract translation: 一些实施方案提供了一种多层散热装置，其包括第一散热器层，第一支撑结构和第二散热器层。 第一散热器层包括第一撒布机表面和第二撒布机表面。 第一支撑结构包括第一支撑表面和第二支撑表面。 第一支撑结构的第一支撑表面联接到第一散热器的第二扩张器表面。 第二散热器层包括第三扩散器表面和第四扩散器表面。 第二散热器层的第三扩散器表面联接到第一支撑结构的第二支撑表面。 在一些实施方案中，第一支撑结构是导热粘合剂层。 在一些实施方案中，第一散热器层具有第一导热性，并且第一支撑结构具有第二导热性。