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公开(公告)号：US20180351066A1
公开(公告)日：2018-12-06
申请号：US15611524
申请日：2017-06-01
Applicant: QUALCOMM Incorporated
Inventor： Jorge Luis Rosales , Victor Adrian Chiriac , Mario Francisco Velez , Peng Wang
CPC classification number: H01L35/32
Abstract: A device that includes a region comprising a heat generating device, and an energy harvesting device coupled to the region comprising the heat generating device. The energy harvesting device includes a first thermal conductive layer, a thermoelectric generator (TEG) coupled to the first thermal conductive layer, and a second thermal conductive layer coupled the thermoelectric generator (TEG) such that the thermoelectric generator (TEG) is between the first thermal conductive layer and the second thermal conductive layer. In some implementations, the energy harvesting device includes an insulation layer.
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公开(公告)号：US20170293329A1
公开(公告)日：2017-10-12
申请号：US15481665
申请日：2017-04-07
Applicant: QUALCOMM Incorporated
IPC: G06F1/20 , H01L23/427 , H01L23/473
CPC classification number: G06F1/20 , F28D15/0233 , F28D15/0266 , G06F1/203 , G06F1/206 , G06F2200/201 , H01L23/427 , H01L23/473
Abstract: A device that includes a region comprising an integrated device, and a heat dissipating device coupled to the region comprising the integrated device. The heat dissipating device is configured to dissipate heat away from the region. The heat dissipating device includes a fluid, an evaporator configured to evaporate the fluid, a condenser configured to condense the fluid, an inner wall coupled to the evaporator and the condenser, an outer shell encapsulating the fluid, the evaporator, the condenser and the inner wall, an evaporation portion configured to channel an evaporated fluid from the evaporator to the condenser, wherein the evaporation portion is at least partially defined by the inner wall, and a collection portion configured to channel a condensed fluid from the condenser to the evaporator, wherein the collection portion is at least partially defined by the inner wall. The heat dissipating device may be a multi-phase heat dissipating device.
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公开(公告)号：US11209215B2
公开(公告)日：2021-12-28
申请号：US16047275
申请日：2018-07-27
Applicant: QUALCOMM Incorporated
Inventor： Victor Adrian Chiriac , Jorge Luis Rosales
Abstract: Certain aspects of the present disclosure generally relate to techniques for cooling electronic devices using thermosiphons having one or more micro-pumps at least partially disposed therein. A provided thermosiphon generally includes a fluid; a first evaporator configured to evaporate the fluid, wherein the first evaporator has an inlet and an outlet; a first condenser configured to condense the fluid, wherein the first condenser has an inlet and an outlet; a first channel coupled between the outlet of the first evaporator and the inlet of the first condenser; a second channel coupled between the outlet of the first condenser and the inlet of the first evaporator; and a first micro-pump located in the second channel and operable to pump the fluid in the second channel from the first condenser to the first evaporator.
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公开(公告)号：US11181323B2
公开(公告)日：2021-11-23
申请号：US16281477
申请日：2019-02-21
Applicant: QUALCOMM Incorporated
Inventor： Sean Charles Andrews , Jorge Luis Rosales , Victor Adrian Chiriac
IPC: F28D15/02 , F28F21/08 , H01L23/427
Abstract: An example heat-dissipating device with enhanced interfacial properties generally includes a first heat spreader configured to be thermally coupled to a region configured to generate heat, a second heat spreader, an interposer thermally coupled to at least one of the first heat spreader or the second heat spreader, at least one interfacial layer including a graphene material disposed on at least one surface of the interposer, and a phase change material disposed between the at least one interfacial layer and at least one of the first heat spreader or the second heat spreader and thermally coupled to at least one of the first heat spreader or the second heat spreader.
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公开(公告)号：US11616185B2
公开(公告)日：2023-03-28
申请号：US15611524
申请日：2017-06-01
Applicant: QUALCOMM Incorporated
Inventor： Jorge Luis Rosales , Victor Adrian Chiriac , Mario Francisco Velez , Peng Wang
Abstract: A device that includes a region comprising a heat generating device, and an energy harvesting device coupled to the region comprising the heat generating device. The energy harvesting device includes a first thermal conductive layer, a thermoelectric generator (TEG) coupled to the first thermal conductive layer, and a second thermal conductive layer coupled the thermoelectric generator (TEG) such that the thermoelectric generator (TEG) is between the first thermal conductive layer and the second thermal conductive layer. In some implementations, the energy harvesting device includes an insulation layer.
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Patent Agency Ranking
公开(公告)号：US10353445B2
公开(公告)日：2019-07-16
申请号：US15481665
申请日：2017-04-07
Applicant: QUALCOMM Incorporated
IPC: G06F1/20 , H01L23/427 , H01L23/473 , F28D15/02
Abstract: A device that includes a region comprising an integrated device, and a heat dissipating device coupled to the region comprising the integrated device. The heat dissipating device is configured to dissipate heat away from the region. The heat dissipating device includes a fluid, an evaporator configured to evaporate the fluid, a condenser configured to condense the fluid, an inner wall coupled to the evaporator and the condenser, an outer shell encapsulating the fluid, the evaporator, the condenser and the inner wall, an evaporation portion configured to channel an evaporated fluid from the evaporator to the condenser, wherein the evaporation portion is at least partially defined by the inner wall, and a collection portion configured to channel a condensed fluid from the condenser to the evaporator, wherein the collection portion is at least partially defined by the inner wall. The heat dissipating device may be a multi-phase heat dissipating device.
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公开(公告)号：US20170295671A1
公开(公告)日：2017-10-12
申请号：US15230114
申请日：2016-08-05
Applicant: QUALCOMM Incorporated
Inventor： Victor Adrian Chiriac , Jorge Rosales , Stephen Arthur Molloy , Jon Anderson
CPC classification number: G06F1/203 , G06F2200/201
Abstract: A device that includes a region comprising an integrated device, and a heat dissipating device coupled to the region comprising the integrated device. The heat dissipating device is configured to dissipate heat away from the region. The heat dissipating device includes a fluid, an evaporator configured to evaporate the fluid, a condenser configured to condense the fluid, an inner wall coupled to the evaporator and the condenser, an outer shell encapsulating the fluid, the evaporator, the condenser and the inner wall, an evaporation portion configured to channel an evaporated fluid from the evaporator to the condenser, wherein the evaporation portion is at least partially defined by the inner wall, and a collection portion configured to channel a condensed fluid from the condenser to the evaporator, wherein the collection portion is at least partially defined by the inner wall. The heat dissipating device may be a multi-phase heat dissipating device.
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公开(公告)号：US09329646B2
公开(公告)日：2016-05-03
申请号：US14221171
申请日：2014-03-20
Applicant: QUALCOMM Incorporated
Inventor： Victor Adrian Chiriac , Youmin Yu , Dexter Tamio Chun , Stephen Arthur Molloy
CPC classification number: G06F1/20 , F28F21/00 , H05K7/20445
Abstract: Some implementations provide a multi-layer heat dissipating device that includes a first heat spreader layer, a first support structure, and a second heat spreader layer. The first heat spreader layer includes a first spreader surface and a second spreader surface. The first support structure includes a first support surface and a second support surface. The first support surface of the first support structure is coupled to the second spreader surface of the first heat spreader. The second heat spreader layer includes a third spreader surface and a fourth spreader surface. The third spreader surface of the second heat spreader layer is coupled to the second support surface of the first support structure. In some implementations, the first support structure is a thermally conductive adhesive layer. In some implementations, the first heat spreader layer has a first thermal conductivity, and the first support structure has a second thermal conductivity.
Abstract translation: 一些实施方案提供了一种多层散热装置，其包括第一散热器层，第一支撑结构和第二散热器层。 第一散热器层包括第一撒布机表面和第二撒布机表面。 第一支撑结构包括第一支撑表面和第二支撑表面。 第一支撑结构的第一支撑表面联接到第一散热器的第二扩张器表面。 第二散热器层包括第三扩散器表面和第四扩散器表面。 第二散热器层的第三扩散器表面联接到第一支撑结构的第二支撑表面。 在一些实施方案中，第一支撑结构是导热粘合剂层。 在一些实施方案中，第一散热器层具有第一导热性，并且第一支撑结构具有第二导热性。
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公开(公告)号：US20150268704A1
公开(公告)日：2015-09-24
申请号：US14221171
申请日：2014-03-20
Applicant: QUALCOMM Incorporated
Inventor： Victor Adrian Chiriac , Youmin Yu , Dexter Tamio Chun , Stephen Arthur Molloy
CPC classification number: G06F1/20 , F28F21/00 , H05K7/20445
Abstract: Some implementations provide a multi-layer heat dissipating device that includes a first heat spreader layer, a first support structure, and a second heat spreader layer. The first heat spreader layer includes a first spreader surface and a second spreader surface. The first support structure includes a first support surface and a second support surface. The first support surface of the first support structure is coupled to the second spreader surface of the first heat spreader. The second heat spreader layer includes a third spreader surface and a fourth spreader surface. The third spreader surface of the second heat spreader layer is coupled to the second support surface of the first support structure. In some implementations, the first support structure is a thermally conductive adhesive layer. In some implementations, the first heat spreader layer has a first thermal conductivity, and the first support structure has a second thermal conductivity.
Abstract translation: 一些实施方案提供了一种多层散热装置，其包括第一散热器层，第一支撑结构和第二散热器层。 第一散热器层包括第一撒布机表面和第二撒布机表面。 第一支撑结构包括第一支撑表面和第二支撑表面。 第一支撑结构的第一支撑表面联接到第一散热器的第二扩张器表面。 第二散热器层包括第三扩散器表面和第四扩散器表面。 第二散热器层的第三扩散器表面联接到第一支撑结构的第二支撑表面。 在一些实施方案中，第一支撑结构是导热粘合剂层。 在一些实施方案中，第一散热器层具有第一导热性，并且第一支撑结构具有第二导热性。
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10.发明授权Thermal design and electrical routing for multiple stacked packages using through via insert (TVI) 有权使用通孔插入（TVI）的多个堆叠封装的热设计和电气布线公开(公告)号：US09041212B2
公开(公告)日：2015-05-26
申请号：US13787476
申请日：2013-03-06
Applicant: QUALCOMM Incorporated
Inventor： Dong Wook Kim , Victor Adrian Chiriac , Kyu-Pyung Hwang , Changhan Hobie Yun , Young Kyu Song
IPC: H01L23/48 , H01L23/34 , H01L23/367 , H01L23/538 , H01L25/065
CPC classification number: H01L23/34 , H01L23/367 , H01L23/3677 , H01L23/5384 , H01L23/5385 , H01L23/5389 , H01L25/0652 , H01L25/105 , H01L25/50 , H01L2224/16 , H01L2224/16145 , H01L2224/16227 , H01L2225/06513 , H01L2225/06517 , H01L2225/06565 , H01L2924/0002 , H01L2924/15311 , H01L2924/00
Abstract: Some implementations provide a semiconductor package structure that includes a package substrate, a first package, an interposer coupled to the first package, and a first set of through via insert (TVI). The first set of TVI is coupled to the interposer and the package substrate. The first set of TVI is configured to provide heat dissipation from the first package. In some implementations, the semiconductor package structure further includes a heat spreader coupled to the interposer. The heat spreader is configured to dissipate heat from the first package. In some implementations, the first set of TVI is further configured to provide an electrical path between the first package and the package substrate. In some implementations, the first package is electrically coupled to the package substrate through the interposer and the first set of TVI. In some implementations, the first set of TVI includes a dielectric layer and a metal layer.
Abstract translation: 一些实施方案提供半导体封装结构，其包括封装衬底，第一封装，耦合到第一封装的插入器和第一组通孔插入件（TVI）。 第一组TVI耦合到插入器和封装衬底。 第一组TVI被配置为提供第一包装的散热。 在一些实施方案中，半导体封装结构还包括耦合到插入件的散热器。 散热器被配置为从第一包装散发热量。 在一些实施方式中，第一组TVI被进一步配置成在第一封装和封装衬底之间提供电路径。 在一些实施方案中，第一封装通过插入器和第一组TVI电耦合到封装衬底。 在一些实施方案中，第一组TVI包括电介质层和金属层。
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