公开(公告)号：US11013151B1

公开(公告)日：2021-05-18

申请号：US16732107

申请日：2019-12-31

Applicant: Quanta Computer Inc.

Inventor： Yi-Chieh Chen ,  Ming-Hung Tsai ,  Yan-Kuei Chen ,  Yi-He Huang

IPC: H05K7/20

Abstract: A chassis includes a receiver frame for receiving a plurality of electronic components. The receiver frame includes a front end, a rear end, a top wall, and a bottom wall. The receiver frame also includes one or more apertures positioned in the bottom wall or the top wall at a location adjacent to the front end. The receiver frame also includes a plurality of air flow channels coupling openings in the front end to the one or more apertures such that air flow from the openings of the front end is first directed towards the rear end across the plurality of electronic components before being directed back towards the front end and then exiting the one or more apertures.

公开(公告)号：US11558977B2

公开(公告)日：2023-01-17

申请号：US17307740

申请日：2021-05-04

Applicant: Quanta Computer Inc.

Inventor： Jen-Mao Chen ,  Wei-Te Wang ,  Ming-Hung Tsai

IPC: G06F1/20 ,  H05K7/20 ,  G06F1/18 ,  G06F1/26

Abstract: A power supply system for a computer system having a fan module that protects the power supply system from backflow from the fan module is disclosed. A power supply unit has an internal fan emitting an airflow from one end of the power supply unit. The power supply unit is mountable next to the fan module. The power supply system is mountable in proximity to an air baffle that diverts the airflow generated by the internal fan. An air tunnel is located on one side of the power supply unit. The air tunnel has an opening on one end for receiving the airflow diverted by the air baffle from the internal fan. The air tunnel has an opposite end in proximity to a second opening to divert the received airflow under the power supply unit.

公开(公告)号：US10219365B1

公开(公告)日：2019-02-26

申请号：US15903465

申请日：2018-02-23

Applicant: QUANTA COMPUTER INC.

Inventor： Chao-Jung Chen ,  Yi-Chieh Chen ,  Ming-Hung Tsai ,  Jen-Mao Chen

IPC: H05K7/20 ,  H05K1/02 ,  G06F1/20 ,  H01L23/367

Abstract: A circuit card assembly includes a circuit card, a plurality of components disposed on a first surface of the circuit card in a shadow arrangement, and a plurality of air-cooled heat sink structures disposed on each of the components. Each of the plurality of heat sink structures comprises a plurality of impedance zones arranged in series substantially perpendicular to the airflow path, where the plurality of impedance zones comprise a first impedance zone having a first air impedance, and a second impedance zone having a second air impedance less than the first air impedance. Further, the plurality of zones in the plurality of heat sink structures are aligned so that the first impedance zone in one of the plurality of heat sink structures does not overlap with the first impedance zone in another of the plurality of heat sink structures, relative to the airflow path.