公开(公告)号：US20230345669A1

公开(公告)日：2023-10-26

申请号：US17659977

申请日：2022-04-20

Applicant: Quanta Computer Inc.

Inventor： Yi-Chieh CHEN ,  Yueh-Chang WU ,  Te-Chuan WANG ,  Po-Kai TSENG

IPC: H05K7/20 ,  G06F1/20

CPC classification number: H05K7/20263 ,  H05K7/20254 ,  G06F1/20

Abstract: A heat transmissive chassis for a fan-less equipment component such as a 5G component is disclosed. The chassis includes a heat sink section having an interior surface and an exterior surface. The interior surface is configured for contact with a heat-generating electronic device. A lateral hollow compartment is located near the interior surface. A coolant is contained in the hollow compartment.