公开(公告)号：US20230025554A1

公开(公告)日：2023-01-26

申请号：US17380845

申请日：2021-07-20

Applicant: QUANTA COMPUTER INC.

Inventor： Yi-Chieh CHEN ,  Yueh-Chang WU ,  Te-Chuan WANG ,  Tzu-Hsuan HSU

IPC: G06F1/20 ,  H05K7/20

Abstract: A cooling system for a rack of servers includes a plurality of cooling circuits, where each cooling circuit is coupled to a server of the rack. Each cooling circuit includes a plurality of cooling modules arranged in parallel. Each cooling module includes a cold plate having a cooling conduit passing therethrough, and a pump fluidly coupled to the cooling conduit. The cooling circuit further includes one or more valves fluidly interconnecting the plurality of cooling modules. Each of the one or more valves, when turned on, fluidly connects the cooling conduits of any two adjacent cooling modules. The cooling system further includes a first cooling distribution manifold fluidly connected to the cooling circuit of each of the plurality of servers through an inlet pipe, and a second cooling distribution manifold fluidly connected to the cooling circuit of each of the plurality of servers through an outlet pipe.

公开(公告)号：US20220418154A1

公开(公告)日：2022-12-29

申请号：US17304704

申请日：2021-06-24

Applicant: Quanta Computer Inc.

Inventor： Yi-Chieh CHEN ,  Yueh-Chang WU ,  Te-Chuan WANG ,  Tzu-Hsuan HSU

IPC: H05K7/20 ,  G06F1/20

Abstract: A cooling device for a computing system is disclosed. The cooling device includes an inlet conduit, a first cold plate, a connecting conduit, a second cold plate, an outlet conduit, and a heat conductor. Coolant flows through the inlet conduit. The first cold plate has a first inlet surface and a first outlet surface. The inlet conduit is coupled to the first inlet surface. The inlet conduit transfers the coolant into the first cold plate. The connecting conduit is coupled at one end to the first outlet surface. The coolant flows from the first cold plate through the connecting conduit. The second cold plate has a second inlet surface and a second outlet surface, the connecting conduit being coupled at another end to the second inlet surface. The outlet conduit is coupled to the second outlet surface. The coolant flows from the second cold plate through the outlet conduit.

公开(公告)号：US20240268059A1

公开(公告)日：2024-08-08

申请号：US18165849

申请日：2023-02-07

Applicant: Quanta Computer Inc.

Inventor： Yi-Chieh CHEN ,  Yueh-Chang WU ,  Te-Chuan WANG ,  Tzu-Hsuan HSU

IPC: H05K7/20

CPC classification number: H05K7/20145 ,  H05K7/20209

Abstract: An example compute cabinet assembly includes an equipment room configured to implement electrical components therein, an air inlet channel coupled to a first side of the equipment room, and a cabinet fan module coupled to a second side of the equipment room opposite the first side. A first air outlet channel is coupled to the cabinet fan module and extends along a third side of the equipment room towards a first outlet of the first air outlet channel. Moreover, electric fans are positioned in the cabinet fan module, the electric fans being configured to create an airflow path originating at an inlet of the air inlet channel. The airflow path further extends through the equipment room and cabinet fan module. A guide plate is also positioned adjacent to an inlet of the equipment room, the guide plate being configured to uniformly distribute the airflow path through the equipment room.

公开(公告)号：US20220225541A1

公开(公告)日：2022-07-14

申请号：US17149151

申请日：2021-01-14

Applicant: QUANTA COMPUTER INC.

Inventor： Yi-Chieh CHEN ,  Yueh-Chang WU ,  Te-Chuan WANG ,  Tzu-Hsuan HSU

IPC: H05K7/20

Abstract: A computing device includes a sealed computer chassis housing, a heat source, a heat spreader, and a thermal pad. The sealed computer chassis housing, defines an interior space and an exterior surface with a heat sink for the interior space. The heat source is disposed within the interior space. The heat spreader includes a plurality of thermally-conductive protrusions coupled to one or more components of the heat source by an intermediate thermally conductive layer. The thermal pad is positioned above and in thermal contact with the heat spreader. The thermal pad is positioned to contact an interior wall of the sealed computer chassis housing opposite to the heat sink.

公开(公告)号：US20240268057A1

公开(公告)日：2024-08-08

申请号：US18165830

申请日：2023-02-07

Applicant: Quanta Computer Inc.

Inventor： Yi-Chieh CHEN ,  Yueh-Chang WU ,  Te-Chuan WANG ,  Tzu-Hsuan HSU

IPC: H05K7/20

CPC classification number: H05K7/20136 ,  H05K7/20209

Abstract: An example assembly includes an equipment room, a cabinet fan module having fans, and a processor configured to execute logic. Temperature sensors are positioned in the air inlet channel and the equipment room. An electrical component having an air inlet area is also positioned in the equipment room. The logic causes the fans to operate at a predetermined speed, and compare a temperature in the air inlet channel with a temperature at the air inlet area. In response to determining that the temperature at the air inlet area is greater than the temperature in the air inlet channel plus a constant value, the operating speed of the fans is increased. Moreover, the operating speed of the fans is decreased in response to determining that the ambient temperature in the air inlet channel plus a constant value is greater than or equal to the temperature at the air inlet area.

公开(公告)号：US20240265903A1

公开(公告)日：2024-08-08

申请号：US18165838

申请日：2023-02-07

Applicant: Quanta Computer Inc.

Inventor： Yi-Chieh CHEN ,  Yueh-Chang WU ,  Te-Chuan WANG ,  Tzu-Hsuan HSU

IPC: G10K11/168 ,  H05K7/20

CPC classification number: G10K11/168 ,  H05K7/20736

Abstract: An example compute cabinet assembly includes an equipment room, an air inlet channel coupled to the equipment room, and a cabinet fan module coupled to the equipment room. The compute cabinet assembly further includes first and second air outlet channels. The first air outlet channel extends along a side of the equipment room towards an outlet of the first air outlet channel. The second air outlet channel extends along another side of the equipment room towards an outlet of the second air outlet channel. The compute cabinet assembly also includes electric fans positioned in the cabinet fan module. The electric fans are configured to create airflow originating at an inlet of the air inlet channel, extending through the equipment room and cabinet fan module, and exiting the compute cabinet assembly at the outlets of the first and second air outlet channels.