公开(公告)号：US10033076B2

公开(公告)日：2018-07-24

申请号：US14990428

申请日：2016-01-07

申请人： RAYTHEON COMPANY

发明人： Bradley O. Hansen ,  Michael R. Beylor ,  Kevin W. Patrick ,  Jeremy Bart Baldwin ,  Michael D. Gordon

IPC分类号： H01P1/203 ,  H01P3/08

摘要： A filter assembly in a multi-layer printed wiring board. One or more conductors is formed on an internal layer of a printed wiring board. Surrounding dielectric layers and ground layers form, together with the conductors of the internal layer, microstrip or stripline transmission lines and distributed element filters. The filter assembly may include a plurality of internal conductive layers, each sandwiched between dielectric layers and ground layers, and each internal layer may include a plurality of distributed element filters. Connections from each filter to the surface of the filter assembly are formed by vias, and connections from the surface of the filter assembly to a host board are formed by solder joints.

公开(公告)号：US20170200998A1

公开(公告)日：2017-07-13

申请号：US14990428

申请日：2016-01-07

申请人： RAYTHEON COMPANY

发明人： Bradley O. Hansen ,  Michael R. Beylor ,  Kevin W. Patrick ,  Jeremy Bart Baldwin ,  Michael D. Gordon

IPC分类号： H01P1/203

CPC分类号： H01P1/203 ,  H01P1/20345 ,  H01P1/20363 ,  H01P3/088

摘要： A filter assembly in a multi-layer printed wiring board. One or more conductors is formed on an internal layer of a printed wiring board. Surrounding dielectric layers and ground layers form, together with the conductors of the internal layer, microstrip or stripline transmission lines and distributed element filters. The filter assembly may include a plurality of internal conductive layers, each sandwiched between dielectric layers and ground layers, and each internal layer may include a plurality of distributed element filters. Connections from each filter to the surface of the filter assembly are formed by vias, and connections from the surface of the filter assembly to a host board are formed by solder joints.