-
公开(公告)号：US11043727B2
公开(公告)日：2021-06-22
申请号：US16247806
申请日：2019-01-15
申请人： Raytheon Company
摘要： Embodiments of the present disclosure relate to a substrate integrated waveguide monopulse antenna. The antenna comprises a substrate having first and second opposing surfaces. A first conductor is disposed on the first surface of the substrate. A plurality of antenna elements are provided on the first surface of the substrate. A second conductor is disposed on the second surface of the substrate. A plurality of conductive via holes extend through said substrate and extend between the first and second surfaces. The via holes are arranged to form a plurality of resonant cavities with at least one resonant cavity coupled to each of the antenna elements. The substrate also comprises a plurality of hybrid couplers, and two of the plurality of resonant cavities are coupled to at least one port of the plurality of hybrid couplers. A plurality of output couplers provided on the second surface of the substrate.
-
公开(公告)号：US20200227808A1
公开(公告)日：2020-07-16
申请号：US16247806
申请日：2019-01-15
申请人： Raytheon Company
摘要： Embodiments of the present disclosure relate to a substrate integrated waveguide monopulse antenna. The antenna comprises a substrate having first and second opposing surfaces. A first conductor is disposed on the first surface of the substrate. A plurality of antenna elements are provided on the first surface of the substrate. A second conductor is disposed on the second surface of the substrate. A plurality of conductive via holes extend through said substrate and extend between the first and second surfaces. The via holes are arranged to form a plurality of resonant cavities with at least one resonant cavity coupled to each of the antenna elements. The substrate also comprises a plurality of hybrid couplers, and two of the plurality of resonant cavities are coupled to at least one port of the plurality of hybrid couplers. A plurality of output couplers provided on the second surface of the substrate.
-
公开(公告)号：US10033076B2
公开(公告)日：2018-07-24
申请号：US14990428
申请日：2016-01-07
申请人： RAYTHEON COMPANY
发明人： Bradley O. Hansen , Michael R. Beylor , Kevin W. Patrick , Jeremy Bart Baldwin , Michael D. Gordon
摘要： A filter assembly in a multi-layer printed wiring board. One or more conductors is formed on an internal layer of a printed wiring board. Surrounding dielectric layers and ground layers form, together with the conductors of the internal layer, microstrip or stripline transmission lines and distributed element filters. The filter assembly may include a plurality of internal conductive layers, each sandwiched between dielectric layers and ground layers, and each internal layer may include a plurality of distributed element filters. Connections from each filter to the surface of the filter assembly are formed by vias, and connections from the surface of the filter assembly to a host board are formed by solder joints.
-
公开(公告)号：US20170200998A1
公开(公告)日：2017-07-13
申请号：US14990428
申请日：2016-01-07
申请人： RAYTHEON COMPANY
发明人： Bradley O. Hansen , Michael R. Beylor , Kevin W. Patrick , Jeremy Bart Baldwin , Michael D. Gordon
IPC分类号： H01P1/203
CPC分类号： H01P1/203 , H01P1/20345 , H01P1/20363 , H01P3/088
摘要： A filter assembly in a multi-layer printed wiring board. One or more conductors is formed on an internal layer of a printed wiring board. Surrounding dielectric layers and ground layers form, together with the conductors of the internal layer, microstrip or stripline transmission lines and distributed element filters. The filter assembly may include a plurality of internal conductive layers, each sandwiched between dielectric layers and ground layers, and each internal layer may include a plurality of distributed element filters. Connections from each filter to the surface of the filter assembly are formed by vias, and connections from the surface of the filter assembly to a host board are formed by solder joints.
-
公开(公告)号：US20140175077A1
公开(公告)日：2014-06-26
申请号：US13724686
申请日：2012-12-21
申请人： Raytheon Company
IPC分类号： B23K11/30
CPC分类号： B23K1/0016 , B23K1/0004 , B23K2101/42
摘要： An electrically induced fusing system includes a module having walls and a base to define a module body. The module body includes first and second conductive layers stacked next to one another. An electrically resistive layer is interposed between the first and second conductive layers, and is configured to emit heat in response to receiving electrical current from a power supply. At least one electrically conductive terminal is in electrical communication with the resistive layer and an output of the power supply to form an electrical path that delivers the current to the resistive layer. The system further includes a separable component configured to attach to the first conductive layer. At least one fusing element is interposed between the separable component and the first conductive layer, and is configured to melt in response to the heat emitted by the resistive layer.
摘要翻译： 电感应熔融系统包括具有壁和模块本体的模块。 模块主体包括彼此相邻堆叠的第一和第二导电层。 电阻层介于第一和第二导电层之间，并且被配置为响应于接收来自电源的电流而发热。 至少一个导电端子与电阻层和电源的输出电连通以形成将电流传递到电阻层的电路径。 该系统还包括被配置为附接到第一导电层的可分离部件。 至少一个定影元件插入在可分离元件和第一导电层之间，并且被配置为响应于电阻层发出的热而熔化。
-
-
-
-
搜索结果
5 条记录 (耗时 0.013 秒)
