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公开(公告)号:US11653473B2
公开(公告)日:2023-05-16
申请号:US16867465
申请日:2020-05-05
Applicant: Raytheon Company
Inventor: James S. Wilson , Gordon R. Scott , James M. Giesey
CPC classification number: H05K7/20254 , H05K7/06 , H05K7/20272
Abstract: An apparatus includes a coldplate and a bus bar. The coldplate is configured to be thermally coupled to a structure to be cooled and to remove thermal energy from the structure. The bus bar is integrated into the coldplate and is configured to deliver power to multiple components of the structure. The apparatus may also include multiple mounting holes positioned in rows on the coldplate and configured to mechanically couple the structure to the coldplate, where one of the bus bar or an additional bus bar is integrated between each pair of adjacent rows of mounting holes. The apparatus may further include sealed cooling channels adjacent to the bus bar and each additional bus bar. The bus bar may be integrated into the coldplate using vacuum brazing or ultrasonic additive manufacturing.
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公开(公告)号:US09041614B2
公开(公告)日:2015-05-26
申请号:US13758981
申请日:2013-02-04
Applicant: Raytheon Company
Inventor: Gordon R. Scott
CPC classification number: H01Q21/0087 , H01Q1/02 , H01Q21/062 , Y10T29/49016
Abstract: An RF aperture coldplate for positioning in heat transfer proximity to heat-generating elements of an RF antenna system is presented. The RF aperture coldplate has a front side and a rear side. The RF aperture coldplate includes waveguides each forming an opening therethrough from the front side to the rear side, and passages substantially around the waveguides. The passages are configured to conduct cooling medium around the waveguides and between the front side and the rear side of the RF aperture coldplate.
Abstract translation: 提出了用于定位在RF传感器附近的射频孔径冷板接近RF天线系统的发热元件。 RF孔径冷板具有前侧和后侧。 RF孔径冷板包括每个形成从前侧到后侧穿过的开口的波导,以及基本上在波导周围的通道。 通道构造成在RF孔盖板的前侧和后侧之间的波导周围导入冷却介质。
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公开(公告)号:US09295072B2
公开(公告)日:2016-03-22
申请号:US14015244
申请日:2013-08-30
Applicant: Raytheon Company
Inventor: Nathan M. Mintz , Jamil R. Hashimi , Russell W. Lai , Hung Q. Nguyen , Gregory S. Vogt , Gordon R. Scott , Retting D. Ryan
Abstract: Embodiments of a system and method for using radio frequency (RF) resources are generally described herein. In some embodiments, the system includes an antenna subsystem including antenna apertures. The system may also include devices configured to execute a plurality RF tasks. The system may further include memory to store a prioritized list of RF tasks. The system may still further include a manager to receive a request from an RF task to use an antenna aperture. The manager may insert the RF task into a prioritized list of RF tasks within a time duration specified in the request. The manager may spawn a thread to execute the RF task through the antenna aperture, within a time frame depending on the RF task's position in the prioritized list.
Abstract translation: 本文一般地描述了使用射频(RF)资源的系统和方法的实施例。 在一些实施例中,该系统包括包括天线孔的天线子系统。 该系统还可以包括被配置为执行多个RF任务的设备。 该系统还可以包括用于存储RF任务的优先列表的存储器。 系统还可以包括管理器,以从RF任务接收使用天线孔径的请求。 管理者可以在请求中指定的时间内将RF任务插入RF任务的优先列表中。 管理员可以在一个时间范围内通过天线孔径产生一个线程来执行射频任务,具体取决于射频任务在优先级列表中的位置。
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公开(公告)号:US20140238631A1
公开(公告)日:2014-08-28
申请号:US13758981
申请日:2013-02-04
Applicant: RAYTHEON COMPANY
Inventor: Gordon R. Scott
IPC: H01Q21/00
CPC classification number: H01Q21/0087 , H01Q1/02 , H01Q21/062 , Y10T29/49016
Abstract: An RF aperture coldplate for positioning in heat transfer proximity to heat-generating elements of an RF antenna system is presented. The RF aperture coldplate has a front side and a rear side. The RF aperture coldplate includes waveguides each forming an opening therethrough from the front side to the rear side, and passages substantially around the waveguides. The passages are configured to conduct cooling medium around the waveguides and between the front side and the rear side of the RF aperture coldplate.
Abstract translation: 提出了用于定位在RF传感器附近的射频孔径冷板接近RF天线系统的发热元件。 RF孔径冷板具有前侧和后侧。 RF孔径冷板包括每个形成从前侧到后侧穿过的开口的波导,以及基本上在波导周围的通道。 通道构造成在RF孔盖板的前侧和后侧之间的波导周围导入冷却介质。
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公开(公告)号:US20150305053A1
公开(公告)日:2015-10-22
申请号:US14015244
申请日:2013-08-30
Applicant: Raytheon Company
Inventor: Nathan M. Mintz , Jamil R. Hashimi , Russell W. Lai , Hung Q. Nguyen , Gregory S. Vogt , Gordon R. Scott , Retting D. Ryan
IPC: H04W72/10
Abstract: Embodiments of a system and method for using radio frequency (RF) resources are generally described herein. In some embodiments, the system includes an antenna subsystem including antenna apertures. The system may also include devices configured to execute a plurality RF tasks. The system may further include memory to store a prioritized list of RF tasks. The system may still further include a manager to receive a request from an RF task to use an antenna aperture. The manager may insert the RF task into a prioritized list of RF tasks within a time duration specified in the request. The manager may spawn a thread to execute the RF task through the antenna aperture, within a time frame depending on the RF task's position in the prioritized list.
Abstract translation: 本文一般地描述了使用射频(RF)资源的系统和方法的实施例。 在一些实施例中,该系统包括包括天线孔的天线子系统。 该系统还可以包括被配置为执行多个RF任务的设备。 该系统还可以包括用于存储RF任务的优先列表的存储器。 系统还可以包括管理器,以从RF任务接收使用天线孔径的请求。 管理者可以在请求中指定的时间内将RF任务插入RF任务的优先列表中。 管理员可以在一个时间范围内通过天线孔径产生一个线程来执行射频任务,具体取决于射频任务在优先级列表中的位置。
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公开(公告)号:US20210352825A1
公开(公告)日:2021-11-11
申请号:US16867465
申请日:2020-05-05
Applicant: Raytheon Company
Inventor: James S. Wilson , Gordon R. Scott , James M. Giesey
Abstract: An apparatus includes a coldplate and a bus bar. The coldplate is configured to be thermally coupled to a structure to be cooled and to remove thermal energy from the structure. The bus bar is integrated into the coldplate and is configured to deliver power to multiple components of the structure. The apparatus may also include multiple mounting holes positioned in rows on the coldplate and configured to mechanically couple the structure to the coldplate, where one of the bus bar or an additional bus bar is integrated between each pair of adjacent rows of mounting holes. The apparatus may further include sealed cooling channels adjacent to the bus bar and each additional bus bar. The bus bar may be integrated into the coldplate using vacuum brazing or ultrasonic additive manufacturing.
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