公开(公告)号：US3805117A

公开(公告)日：1974-04-16

申请号：US31442972

申请日：1972-12-12

Applicant: RCA CORP

Inventor： HAUSMAN E

IPC: H05K3/36 ,  H01L23/50 ,  H01L25/00 ,  H01L25/16 ,  H05K1/14 ,  H05K7/02 ,  H05K1/04

CPC classification number: H05K1/145 ,  H01L25/165 ,  H01L2924/0002 ,  H01L2924/00

Abstract: The device includes a sub-assembly comprising a solid member of insulating material and a number of electronic devices disposed within openings through the solid member. Lead wires of the components extend outwardly of the openings and into holes through a pair of printed circuit board members mounted on opposite sides of the solid member, the lead wires being soldered to various conductive paths on the circuit boards. Spring clips are used to clamp the circuit boards against the solid member, the clips being soldered to various ones of the conductive paths. Semiconductor chips are mounted on the circuit boards after the solder operations, and the sub-assembly is mounted on the terminal leads of a header by welding the leads to various ones of the spring clips.

Abstract translation: 该装置包括一个子组件，该子组件包括绝缘材料的固体部件和设置在通过该固体部件的开口内的多个电子装置。 组件的导线通过安装在实心构件的相对侧上的一对印刷电路板构件从开口向外延伸到孔中，引线被焊接到电路板上的各种导电路径。 弹簧夹用于将电路板夹在固体构件上，夹子被焊接到各种导电路径中。 在焊接操作之后，半导体芯片安装在电路板上，并且通过将引线焊接到各种弹簧夹中而将子组件安装在集管的端子引线上。