公开(公告)号：US11264352B2

公开(公告)日：2022-03-01

申请号：US16897424

申请日：2020-06-10

Applicant: REALTEK SEMICONDUCTOR CORP.

Inventor： Ting-Ying Wu ,  Chien-Hsiang Huang ,  Chin-Yuan Lo ,  Chih-Wei Chang

IPC: H01L23/00

Abstract: An electronic package structure and a chip thereof are provided. The electronic package structure includes a substrate, a chip, a plurality of signal wires, and a core ground wire. The chip disposed on and electrically connected to the substrate has a core wiring region and an input and output pad region located at a top surface thereof. The input and output pad region is located between the core wiring region and an edge of the chip. The chip includes a plurality of signal pads in the input and output region and a core ground pad adjacent to one of the signal pads. The core ground pad located in the core wiring region. The signal wires are respectively connected to the signal pads. The core ground wire connected to the core ground pad is adjacent to and shields one of the signal wires.