公开(公告)号：US20180241319A1

公开(公告)日：2018-08-23

申请号：US15891872

申请日：2018-02-08

Applicant: RENESAS ELECTRONICS CORPORATION

Inventor： Koji BANDO ,  Kuniharu MUTO ,  Hideaki SATO

IPC: H02M7/48 ,  H02M7/00 ,  H01L23/12 ,  H01L25/16 ,  H01L25/18 ,  H03K17/64

CPC classification number: H02M7/48 ,  H01L23/12 ,  H01L23/3735 ,  H01L25/16 ,  H01L25/18 ,  H02M7/003 ,  H03K17/64

Abstract: An electronic device includes a first substrate, a wiring substrate (second substrate) disposed over the first substrate, and an enclosure (case) in which the first substrate and the wiring substrate are accommodated and that has a first side and a second side. A driver component (semiconductor component) is mounted on the wiring substrate. A gate electrode of a first semiconductor component is electrically connected to the driver component via a lead disposed on a side of the first side and a wiring disposed between the driver component and the first side. A gate electrode of a second semiconductor component is electrically connected to the driver component via a lead disposed on a side of the second side and a wiring disposed between the driver component and the second side.