公开(公告)号：US20240006344A1

公开(公告)日：2024-01-04

申请号：US18330648

申请日：2023-06-07

Applicant: RENESAS ELECTRONICS CORPORATION

Inventor： Yasutaka NAKASHIBA ,  Toshiyuki HATA ,  Hiroshi YANAGIGAWA ,  Tomohisa SEKIGUCHI

IPC: H01L23/00 ,  H01L23/58 ,  H01L29/78 ,  H01L21/78 ,  H01L21/306

CPC classification number: H01L23/562 ,  H01L24/32 ,  H01L23/585 ,  H01L29/7813 ,  H01L21/78 ,  H01L21/30604 ,  H01L2224/32225

Abstract: A semiconductor device includes a chip mounting portion and a semiconductor chip provided on the chip mounting portion via a conductive adhesive material. Here, a planar shape of the semiconductor chip is a quadrangular shape. Also, in plan view, a plurality of thin portions is formed at a plurality of corner portions of the semiconductor chip, respectively. Also, the plurality of thin portions respectively formed at the plurality of corner portions of the semiconductor chip is spaced apart from each other. Further, thickness of each of the plurality of thin portions is smaller than a thickness of the semiconductor chip other than the plurality of the thin portions.