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公开(公告)号：US20240230751A9
公开(公告)日：2024-07-11
申请号：US18470820
申请日：2023-09-20
发明人： Yoshiaki TANAKA , Kouji NAKAJIMA
IPC分类号： G01R31/28
CPC分类号： G01R31/2853
摘要： A semiconductor device making it easy to detect disconnection in source wires and achieving a reduction in resistance and an inspection method for the semiconductor device are provided. A semiconductor device according to the present embodiment includes: a lead frame; a semiconductor chip on the lead frame; a source pad provided in the semiconductor chip; a plurality of source wires connected to the source pad; a disconnection detection wire connected to the source pad; source terminals connected to the plurality of source wires; and a disconnection detection terminal connected to the disconnection detection wire. One end of the disconnection detection wire is positioned in vicinity of a corner of the source pad closer to the disconnection detection terminal side.
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公开(公告)号：US20240133944A1
公开(公告)日：2024-04-25
申请号：US18470820
申请日：2023-09-19
发明人： Yoshiaki TANAKA , Kouji NAKAJIMA
IPC分类号： G01R31/28
CPC分类号： G01R31/2853
摘要： A semiconductor device making it easy to detect disconnection in source wires and achieving a reduction in resistance and an inspection method for the semiconductor device are provided. A semiconductor device according to the present embodiment includes: a lead frame; a semiconductor chip on the lead frame; a source pad provided in the semiconductor chip; a plurality of source wires connected to the source pad; a disconnection detection wire connected to the source pad; source terminals connected to the plurality of source wires; and a disconnection detection terminal connected to the disconnection detection wire. One end of the disconnection detection wire is positioned in vicinity of a corner of the source pad closer to the disconnection detection terminal side.
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