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公开(公告)号:US10933468B2
公开(公告)日:2021-03-02
申请号:US15767475
申请日:2016-11-14
Applicant: RENISHAW PLC
Inventor: Nicholas Henry Hannaford Jones , Ceri Brown , Ramkumar Revanur , Geoffrey McFarland
IPC: G05B19/4093 , B22F3/00 , B33Y50/02 , B22F3/105 , B33Y30/00 , B29C64/153 , B29C64/393 , B29C64/245 , B29C64/268 , B33Y10/00
Abstract: A method of monitoring an additive manufacturing apparatus. The method includes receiving one or more sensor signals from the additive manufacturing apparatus during a build of a workpiece, comparing the one or more sensor signals to a corresponding acceptable process variation of a plurality of acceptable process variations and generating a log based upon the comparisons. Each acceptable process variation of the plurality of acceptable process variations is associated with at least one state of progression of the build of the workpiece and the corresponding acceptable process variation is the acceptable process variation associated with the state of progression of the build when the one or more sensor signals are generated.
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公开(公告)号:US11867663B2
公开(公告)日:2024-01-09
申请号:US16973333
申请日:2019-06-26
Applicant: RENISHAW PLC
IPC: G01N29/14 , B33Y30/00 , B22F10/28 , B33Y50/02 , B22F10/31 , B22F10/85 , B22F12/00 , B22F12/30 , B22F12/70 , B22F10/40 , B22F12/90 , B22F12/45
CPC classification number: G01N29/14 , B22F10/28 , B22F10/31 , B22F10/40 , B22F10/85 , B22F12/222 , B22F12/30 , B22F12/70 , B33Y30/00 , B33Y50/02 , B22F12/45 , B22F12/90
Abstract: A powder bed additive manufacturing apparatus includes a build sleeve, a build platform for supporting a powder bed and object during a build, the build platform lowerable in the build sleeve, and at least one acoustic sensing system. The acoustic sensing system includes an acoustic emission sensor and an acoustic waveguide. The acoustic waveguide extends through the build platform such that a receiving end of the acoustic waveguide distal from the acoustic emission sensor abuts a surface of a build substrate removable mounted to the build platform to transmit structure-borne acoustic waves from the build substrate to the acoustic emission sensor.
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公开(公告)号:US12103099B2
公开(公告)日:2024-10-01
申请号:US16759182
申请日:2018-11-07
Applicant: RENISHAW PLC
Inventor: John Dardis , Kiera Megan Jones , Ceri Brown , Nicholas Henry Hannaford Jones
IPC: B23K15/00 , B22F10/28 , B22F10/36 , B22F10/366 , B22F12/41 , B22F12/44 , B22F12/49 , B22F12/90 , B23K26/342 , B33Y10/00 , B33Y50/00
CPC classification number: B23K15/0086 , B22F10/28 , B22F10/36 , B22F10/366 , B22F12/90 , B23K26/342 , B33Y10/00 , B33Y50/00 , B22F12/41 , B22F12/44 , B22F12/49
Abstract: A method of generating a spatial map of sensor data collected during additive manufacturing, in which a plurality of layers of powder are selectively melted with an energy beam to form an object. The method includes receiving sensor data collected during additive manufacturing of an object, the sensor data including sensor values, the sensor values captured for different coordinate locations of the energy beam during the additive manufacturing of the object, and generating cell values for a corresponding cell-based spatial mapping of the sensor data. Each of the cell values is determined from a respective plurality of the sensor values extending over an area/volume comparable to an extent of the melt pool or the energy beam spot.
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