Selective solidification apparatus and methods

    公开(公告)号:US10994335B2

    公开(公告)日:2021-05-04

    申请号:US15124287

    申请日:2015-03-18

    申请人: RENISHAW PLC

    摘要: A selective solidification apparatus includes a build chamber, a build platform lowerable in the build chamber, a wiper for spreading powder material across the build platform to form successive powder layers of a powder bed, an energy beam unit for generating an energy beam for consolidating the powder material, a scanner for directing and focusing the energy beam onto each powder layer and a processor for controlling the scanner. The processor is arranged to control the scanner to scan the energy beam across the powder bed to consolidate powder material either side of the wiper when the wiper is moving across the powder bed and to scan the energy beam across at least one of the powder layers during two or more strokes of the wiper across the powder bed.

    Additive manufacturing method and system

    公开(公告)号:US11548229B2

    公开(公告)日:2023-01-10

    申请号:US16075301

    申请日:2017-03-02

    申请人: RENISHAW PLC

    摘要: A method builds a workpiece using an additive manufacturing process, wherein the workpiece is built up by consolidating material in a layer-by-layer manner. The method includes receiving an initial geometric model defining surface geometry of the workpiece, determining workpiece slices to be consolidated as layers of the workpiece during the additive manufacturing process from the initial geometric model, determining adjusted positions of the workpiece slices adjusted from initial positions of the workpiece slices as determined from the initial geometric model, the determination of the adjusted positions based upon warping of the workpiece expected to occur during or after the additive manufacturing process, and building the workpiece using the additive manufacturing process, wherein the workpiece slices are formed in the adjusted positions.

    Control of a chain of machines, including an additive manufacturing machine, in the manufacture of a workpiece

    公开(公告)号:US10983504B2

    公开(公告)日:2021-04-20

    申请号:US15761247

    申请日:2016-09-29

    申请人: RENISHAW PLC

    摘要: This invention concerns apparatus for generating instructions for machines of a manufacturing chain used to manufacture a workpiece. The apparatus comprising a processor arranged to receive a model based definition (MBD) of a workpiece including geometric dimensions and tolerances; receive inputs setting an additive build design for building the workpiece based upon the geometric dimensions; generate additive instructions for an additive manufacturing machine of the manufacturing chain based upon the additive build design; determine a prospective intermediate workpiece product expected from an additive build in accordance with the additive build design; determine differences between the prospective intermediate workpiece product and the model based definition of the workpiece; and generate further instructions for at least one further machine of the manufacturing chain based upon the differences.

    Surface sensing device with optical sensor
    9.
    再颁专利
    Surface sensing device with optical sensor 有权
    具有光学传感器的表面感测装置

    公开(公告)号:USRE45211E1

    公开(公告)日:2014-10-28

    申请号:US13708775

    申请日:2012-12-07

    申请人: Renishaw PLC

    IPC分类号: G01B11/00 G01B5/00 G01N21/86

    CPC分类号: G01B11/007

    摘要: A surface sensing device for use in position determining apparatus has an elongate stylus (74) with a tip (82) for scanning the surface of a workpiece to be measured. Lateral displacements of the stylus tip are detected by a light beam which passes along the stylus from a light source (66) to a retroreflector (78). This reflects the beam back via a beamsplitter (70) to a position sensitive detector (76). The stylus is mounted for longitudinal displacement on a carriage (72). The longitudinal displacement is measured by another light beam projected by the beamsplitter (70) onto a second position sensitive detector (84).

    摘要翻译: 用于位置确定装置的表面感测装置具有细长的触针(74),其具有用于扫描要测量的工件的表面的尖端(82)。 触针尖的横向位移由沿着触针从光源(66)传递到后向反射器(78)的光束来检测。 这通过分束器(70)将光束反射回到位置敏感检测器(76)。 触针安装成用于在滑架(72)上纵向移动。 通过由分束器(70)投射到另一个位置敏感检测器(84)上的另一个光束来测量纵向位移。